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ST7537

STMicroelectronics

ST7537 by STMicroelectronics

ST7537 by STMicroelectronics is a modem IC with 28 terminals in a square chip carrier package. It operates b/w 0 °C to 70°C, powered by 5V or 10V supplies. Ideal for telecom applications due to its commercial temperature grade and J bend terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,348 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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4,348

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Digiode

USA . 2,369 parts In-Stock

1+ parts

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1k+ parts

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2,369

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Anansix

USA . 794 parts In-Stock

1+ parts

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100+ parts

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794

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,302 parts In-Stock

1+ parts

$8.010

100+ parts

-

1k+ parts

$7.209

10k+ parts

-

1,302

$8.010

-

$7.209

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MKK Technologies

India . 1,019 parts In-Stock

1+ parts

$15.063

100+ parts

-

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10k+ parts

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1,019

$15.063

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DigiPath Technology Company

USA . 1,019 parts In-Stock

1+ parts

$15.063

100+ parts

-

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10k+ parts

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1,019

$15.063

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Corphita

USA . 2,535 parts In-Stock

1+ parts

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2,535

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Parana Technologies

USA . 1,420 parts In-Stock

1+ parts

-

100+ parts

$9.578

1k+ parts

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10k+ parts

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1,420

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$9.578

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Overview

Upgrade your communication systems with the ST7537 by STMicroelectronics, a high-quality modem designed to provide reliable and efficient connectivity. Manufactured by the trusted brand STMicroelectronics, this modem boasts superior performance in a compact square package body, making it ideal for a wide range of applications. With power supplies of 5V and 10V, 28 terminals, and a commercial temperature grade, the ST7537 offers unmatched value and benefits to customers looking for a robust and versatile solution for their networking needs. Elevate your communication network to the next level with the ST7537 modem.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the modem easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easier assembly and efficient use of PCB space.

Power Supplies (V): 5,10

Having multiple power supply options provides flexibility for different applications and voltage requirements.

No. of Terminals: 28

With a high number of terminals, the modem can support various connections and interfaces.

Package Style (Meter): CHIP CARRIER

The chip carrier package style facilitates easy installation and maintenance of the modem.

Maximum Operating Temperature: 70 °C

The modem can operate efficiently in a wide range of temperatures, ensuring reliability in different environments.

Minimum Operating Temperature: 0 °C

The modem can function even in low-temperature conditions, making it suitable for various applications.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and conductivity, ensuring stable connections.

Terminal Position: QUAD

Quad terminal position allows for multiple connections, enhancing the modem's versatility and compatibility.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature ranges, the modem is suitable for typical office and industrial settings.

Terminal Form: J BEND

J bend terminals make installation and handling of the modem more convenient and secure.

Telecom IC Type: MODEM

Specifically designed for modem functionality, ensuring optimal performance in telecommunications applications.

Terminal Pitch: 1.27 mm

With a precise terminal pitch, the modem offers compatibility with standard PCB layouts and assembly processes.

Technical Specifications

Modems ST7537 attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5,10

Qualification:

Not Qualified

Sub-Category:

Modems

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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