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ST7538P

STMicroelectronics

ST7538P by STMicroelectronics

ST7538P by STMicroelectronics is a low-profile modem designed for industrial applications, operating b/w -40 °C and 85°C. It features a nominal voltage of 5V, with a data rate of 0.0048 Mbps and comes in a compact 10mm x 10mm package. Its robust design ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,751 parts In-Stock

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1,751

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Vyrian

USA . 1,717 parts In-Stock

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1,717

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Zilex Electronics Inc.

Canada . 940 parts In-Stock

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940

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Digiode

USA . 417 parts In-Stock

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417

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Ramos S.r.l.

Italy . 314 parts In-Stock

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314

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J2 Sourcing AB

Sweden . 250 parts In-Stock

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250

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ACDS - Activité Composants Distribution Service

France . 147 parts In-Stock

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147

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Goldney Electronics S.L.

Spain . 130 parts In-Stock

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ComSIT Distribution GmbH

Germany . 54 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 2,107 parts In-Stock

1+ parts

$10.831

100+ parts

-

1k+ parts

$9.748

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2,107

$10.831

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$9.748

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MKK Technologies

India . 737 parts In-Stock

1+ parts

$20.367

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737

$20.367

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DigiPath Technology Company

USA . 737 parts In-Stock

1+ parts

$20.367

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737

$20.367

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A-Z Elektronik GmbH

Germany . 5,211 parts In-Stock

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5,211

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Parana Technologies

USA . 1,849 parts In-Stock

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$12.950

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$12.950

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Metaverse IC Inc.

Canada . 1,060 parts In-Stock

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1,060

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Corphita

USA . 965 parts In-Stock

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965

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Overview

Unlock seamless connectivity and robust performance with the ST7538P modem from STMicroelectronics, a leader in innovative solutions. Designed for industrial applications, this low-profile gem offers exceptional reliability even in extreme temperatures. With its advanced technology and high-quality materials, the ST7538P ensures stable data transmission, making it an ideal choice for telecommunication needs. Elevate your projects with unmatched quality and dependable support from a trusted manufacturer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and resistance to environmental stresses, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for efficient use of space on the PCB, resulting in a smaller overall device footprint.

Package Shape: SQUARE

The square package shape promotes uniform heating during assembly and helps in efficient layout design on the PCB.

Power Supplies (V): 5, 9

Compatible with both 5V and 9V supply voltages, providing flexibility in diverse application environments.

No. of Terminals: 44

A high number of terminals allows for extensive connectivity options, supporting a wide range of circuit designs.

Package Style (Meter): FLATPACK, LOW PROFILE

The low-profile flatpack design saves space in system integration, ideal for compact electronic device designs.

Maximum Operating Temperature: 85 °C

Withstanding temperatures up to 85 °C ensures reliable performance in high-temperature environments.

Minimum Operating Temperature: -40 °C

Operating effectively in extreme cold conditions makes this modem suitable for diverse environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances conductivity and reliability, minimizing signal loss over time.

Terminal Position: QUAD

Quad terminal positioning allows for easier soldering and better electrical performance in multi-pin configurations.

Maximum Seated Height: 1.6 mm

The low profile of 1.6 mm helps minimize the vertical space requirement in compact designs.

Width: 10 mm

Compact width of 10 mm facilitates integration into tight spaces within devices.

Length: 10 mm

Similar to the width, a length of 10 mm contributes to the compact design, allowing for flexibility in layout.

Temperature Grade: INDUSTRIAL

Industrial-grade certification ensures that the modem is designed for reliability over extended use in harsh environments.

Technology: BCDMOS

BCD technology combines the benefits of CMOS and bipolar, delivering low power consumption and high-speed performance.

Terminal Form: GULL WING

Gull wing terminals provide excellent solderability and mechanical strength, enhancing overall performance.

Telecom IC Type: MODEM

Designed specifically for modem applications, ensuring optimal performance for telecommunications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V aligns well with common electronic systems, ensuring compatibility.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch balances density and manufacturability, making it easier to integrate into various PCB layouts.

Data Rate: 0.0048 Mbps

The data rate of 0.0048 Mbps is suitable for specific low-speed applications, making it a good choice for particular use cases.

Technical Specifications

Modems ST7538P attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

Additional Features:

HALF DUPLEX

Data Rate:

.0048 Mbps

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Power Supplies (V):

5,9

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Modems

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BCDMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

ST7538P Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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