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STLC75C53TQFP

STMicroelectronics

STLC75C53TQFP by STMicroelectronics

STMicroelectronics' STLC75C53TQFP is a 80-terminal modem IC with 5V supply voltage, suitable for telecom applications. It operates b/w 0-70 °C, drawing a max current of 200mA. The package is square-shaped, surface-mountable, and made of plastic/epoxy material.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,843 parts In-Stock

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1,843

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Anansix

USA . 1,669 parts In-Stock

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1,669

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Vyrian

USA . 99 parts In-Stock

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99

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 925 parts In-Stock

1+ parts

$6.111

100+ parts

-

1k+ parts

$5.500

10k+ parts

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925

$6.111

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$5.500

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MKK Technologies

India . 36 parts In-Stock

1+ parts

$11.491

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36

$11.491

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DigiPath Technology Company

USA . 36 parts In-Stock

1+ parts

$11.491

100+ parts

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36

$11.491

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Corphita

USA . 984 parts In-Stock

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984

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Parana Technologies

USA . 261 parts In-Stock

1+ parts

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$7.306

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261

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$7.306

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Overview

Revolutionize your communication systems with the STLC75C53TQFP modem by STMicroelectronics. Known for their superior quality and innovative technology, STMicroelectronics delivers cutting-edge solutions for all your networking needs. This modem offers unparalleled performance and reliability, making it ideal for a wide range of applications. From data transfer to voice communication, this product ensures seamless connectivity and fast, efficient operation. Stay ahead of the competition and experience the value and benefits that the STLC75C53TQFP modem can bring to your business.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic and epoxy materials makes the modem lightweight and durable, ideal for reducing overall weight in a system and ensuring longevity.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and space in the manufacturing process.

Package Shape: SQUARE

The square package shape is compact and space-saving, making it suitable for applications where space constraints are a concern.

Power Supplies (V): 5

The 5V power supply requirement is common and easily achievable, making the modem compatible with a wide range of systems and applications.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options, allowing for versatile integration and connectivity with other components in a system.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this modem can withstand high temperatures and operate reliably in various environments.

Minimum Operating Temperature: 0 °C

The modem is designed to operate effectively even at low temperatures, ensuring consistent performance in a wide range of operating conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish offers good solderability and reliability, ensuring secure connections and ease of soldering during assembly.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades makes this modem suitable for standard commercial applications where moderate temperature ranges are expected.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical and electrical connections, minimizing the risk of damage or disconnection during operation.

Maximum Supply Current: 200 mA

The maximum supply current of 200mA is within a reasonable range, ensuring efficient power consumption and compatibility with a variety of power sources.

Telecom IC Type: MODEM

As a modem with specific telecom IC type, this product is designed for reliable communication over telecommunications networks, ensuring data transmission efficiency.

Nominal Supply Voltage: 5 V

Having a nominal supply voltage of 5V allows for compatibility with standard power sources and ensures consistent performance in various applications.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch provides a balance between compactness and ease of soldering, making assembly and integration smooth and efficient.

Technical Specifications

Modems STLC75C53TQFP attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e0

No. of Terminals:

80

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP80,.63SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Modems

Maximum Supply Current:

200 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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