Loading...

STLC60134TR

STMicroelectronics

STLC60134TR by STMicroelectronics

STLC60134TR by STMicroelectronics is a low-profile modem designed for industrial applications, operating b/w -40 °C and 85°C. It features a data rate of 8 Mbps and operates at a nominal voltage of 3.3 V. Its compact design with 64 terminals makes it ideal for space-constrained environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,862 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,862

-

-

-

-

Digiode

USA . 3,052 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,052

-

-

-

-

Anansix

USA . 1,080 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,080

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 835 parts In-Stock

1+ parts

$16.406

100+ parts

-

1k+ parts

$14.766

10k+ parts

-

835

$16.406

-

$14.766

-

MKK Technologies

India . 2,043 parts In-Stock

1+ parts

$30.851

100+ parts

-

1k+ parts

-

10k+ parts

-

2,043

$30.851

-

-

-

DigiPath Technology Company

USA . 2,043 parts In-Stock

1+ parts

$30.851

100+ parts

-

1k+ parts

-

10k+ parts

-

2,043

$30.851

-

-

-

Corphita

USA . 4,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,987

-

-

-

-

Parana Technologies

USA . 420 parts In-Stock

1+ parts

-

100+ parts

$19.616

1k+ parts

-

10k+ parts

-

420

-

$19.616

-

-

Overview

Unlock seamless connectivity and robust performance with the STLC60134TR modem from STMicroelectronics. Renowned for innovation and reliability, STMicroelectronics delivers a low-profile solution designed to thrive in demanding industrial environments. Ideal for telecommunications applications, this modem combines efficiency with exceptional data rates, ensuring your devices stay connected and responsive. Elevate your projects with the quality that defines ST!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic and epoxy materials ensures robustness, protecting the modem under various conditions.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern circuit boards, making it ideal for space-constrained applications.

Package Shape: SQUARE

A square package shape optimizes space efficiency on PCBs, acting as a versatile option for device manufacturers.

No. of Terminals: 64

With 64 terminals, this modem supports a wide array of connections, providing flexibility in circuit design.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low-profile design enhances compatibility with various system designs while allowing for efficient heat dissipation.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C enables the modem to function reliably in industrial environments without overheating.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this modem is suitable for extreme conditions, ensuring performance in harsh climates.

Terminal Position: QUAD

Quad terminal positioning allows for excellent signal integrity and ease of connection, enhancing overall performance.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm contributes to a slim profile, making it ideal for slimline devices.

Width: 10 mm

Compact width means it can fit into smaller electronic designs, offering flexibility for manufacturers.

Length: 10 mm

A consistent length of 10 mm keeps dimensions uniform, helping in standardized assembly processes.

Temperature Grade: INDUSTRIAL

Designed to meet industrial-grade standards, ensuring durability and reliability in demanding environments.

Terminal Form: GULL WING

Gull-wing terminals provide excellent soldering characteristics, enhancing reliability in connection.

Telecom IC Type: MODEM

Being a modem IC, it is specifically optimized for data transmission, ensuring superior connectivity options.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3 V makes this modem energy-efficient, reducing power consumption across devices.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for a dense arrangement of connections, optimizing PCB layout.

Data Rate: 8 Mbps

With a data rate of 8 Mbps, this modem supports efficient data transfer, meeting the demands of various applications.

Technical Specifications

Modems STLC60134TR attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

Additional Features:

DATA RATE:1MBPS UPSTREAM WITH 32KBPS GRANULARITY

Data Rate:

8 Mbps

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

STLC60134TR Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 16