Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The Onsemi 11564-502-XTP modem-demodulator IC features CMOS technology, dual terminal position with 24 terminals on a small outline package. It operates at power supplies of 3/5V and has a terminal pitch of 1.27mm. Ideal for telecom applications requiring surface mount modems in plastic/epoxy packages.
Median Price
-
Lifecycle Status
Suppliers In-Stock
2
In-Stock Inventory
< 1k
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Native Components
$0.144
$0.138
Northwest PG Solutions
$0.158
$0.139
SupplyDigital Components
Kulean Microsystems
Problanco Electronics
Corphita
UHIMA Technologies
TANS Electronics
Corohmni
This material is lightweight and durable, making the modem easy to handle and resistant to damage during transportation or installation.
Surface mount technology allows for efficient and compact PCB design, saving valuable space in electronic devices.
The rectangular shape of the package allows for easy integration into various electronic systems or devices.
This modem can operate on multiple power supplies, providing flexibility in different electronic setups.
With a high number of terminals, this modem can support complex connections and functionalities.
The small outline package style helps in saving space on the PCB board, making it suitable for compact electronic devices.
Tin lead terminal finish provides good solderability and conductivity, ensuring reliable connections in the modem.
Dual terminal position allows for more versatile PCB layout options and better signal routing for optimal performance.
CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the modem.
Gull wing terminal form provides mechanical stability and ease of soldering during the assembly process.
The specific type of telecom IC ensures optimized modulation and demodulation processes, essential for reliable communication.
The small terminal pitch allows for high-density mounting of components on the PCB, enabling a compact and efficient design.
Modems 11564-502-XTP attributes and parameters. Explore more Modems devices from Onsemi
JESD-30 Code:
JESD-609 Code:
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Power Supplies (V):
Qualification:
Sub-Category:
Surface Mount:
Technology:
Telecom IC Type:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
11564-502-XTP Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
BAV99
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
EU2B-YS3303C
Idec
ROTARY SWITCH;
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
2N2222A
North American Philips Discrete Products Div
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Motorola
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; JESD-609 Code: e0;
AT90CAN128-16AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: TQFP; Package Shape: SQUARE;
Microchip Technology
AT90CAN128-16AU by Microchip Technology is a microcontroller with 8-bit data RAM and 16-bit address bus width. It operates at a max clock frequency of 16 MHz, making it suitable for industrial applications requiring low power mode and connectivity options like CAN, SPI, and USART. With 53 I/O lines and 8-channel 10-bit ADCs, this microcontroller offers versatile peripheral support for various embedded systems.
LM317BD2TG
Onsemi
LM317BD2TG by Onsemi is an adjustable positive single output standard regulator with a max output current of 1.5A and a max load regulation of 5.8%. Operating temperature ranges from -40 to 125°C, making it suitable for various applications requiring precise voltage regulation in compact designs.
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
LL4148
Taitron Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Weitron Technology
Taiwan Semiconductor
Lite-on Technology
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 175 Cel; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us;
SMBJ18CA
Bourns
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Rfe International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C1005X7R1E103K050BB
TDK
The TDK C1005X7R1E103K050BB is a ceramic capacitor with capacitance of 0.01uF and rated DC voltage of 25V. It features X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for surface mount applications requiring compact size and stable performance in various electronic circuits.
Leshan Radio
RECTIFIER DIODE; Surface Mount: YES; Maximum Non Repetitive Peak Forward Current: 2 A; Maximum Reverse Recovery Time: .004 us; No. of Phases: 1; Maximum Operating Temperature: 175 Cel;
73K224BL-IH
Analog Devices
73K224BL-IH by Analog Devices is a modem IC with 32 terminals in a rectangular chip carrier package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. It has a data rate of 0.0024 Mbps and operates at a nominal voltage of 5V, ideal for telecom applications.
TNETEL1200PPB
Texas Instruments
TNETEL1200PPB by Texas Instruments is a modem IC with 208 terminals, operating at -40 to 85°C. It has a data rate of 6 Mbps and operates at 3.3V supply voltage. This square-shaped IC in flatpack style is ideal for industrial telecom applications due to its high temperature grade and small form factor.
TSG7515C
STMicroelectronics
TSG7515C by STMicroelectronics is a modem IC with +-5V power supplies, 28 terminals, and CMOS technology. It operates b/w 0 °C to 70°C and is commonly used in telecom applications due to its commercial temperature grade and -5V nominal negative supply voltage.
BCM3345KPB
Broadcom
Modems;
TS75240CP/XX
STMicroelectronics' TS75240CP/XX modem has 48 terminals, operates b/w 0-70 °C, with -5V negative supply and 5V nominal voltage. It offers data rate of 0.0024 Mbps and is ideal for telecom applications due to its THROUGH-HOLE terminal form and IN-LINE package style.
CX20548-11Z
Conexant Systems
The Conexant Systems CX20548-11Z modem IC operates at 3.3V, with a data rate of 0.002 Mbps. It is a surface mount chip carrier suitable for telecom applications, featuring 16 terminals in a square package shape. This commercial-grade modem has a temperature range of 0-70°C and matte tin terminal finish.
AD9975ABSTZRL
AD9975ABSTZRL by Analog Devices is a 48-terminal modem IC with CMOS technology. It operates b/w -40 to 85 °C, supporting telecom circuits at 3.3V supply voltage. The low-profile flatpack package makes it suitable for industrial applications requiring fine-pitch terminals.
TCM3105NE
TCM3105NE by Texas Instruments is a 16-terminal modem IC with 5V supply voltage. It operates in industrial temperature range (-40 to 85°C) and draws max 16mA current. Suitable for telecom applications, it features CMOS technology and through-hole terminal form.
L-SFAX17L-M24-D
73M2901CL-IGV
73M2901CL-IGV by Analog Devices is a modem IC with 32 terminals, operating temperature range of -40 to 85 °C. It has a data rate of 0.0024 Mbps and operates at a supply voltage of 3.3V. Ideal for telecom applications due to its thin profile package style and industrial temperature grade suitability.
MAX2395ETI
Maxim Integrated
MODEM-MODULATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 28; Package Code: HVQCCN; Package Shape: SQUARE;
A5191HRTL
A5191HRTL by Onsemi is a modem IC with 32 terminals in a square package. Operating temperature range from -40 to 85 °C, suitable for industrial use. Features include 3.3V supply voltage, 0.0012 Mbps data rate, and CMOS technology ideal for telecom applications.
73M2901-32IH/5
Analog Devices' 73M2901-32IH/5 modem operates at -40 to 85 °C, with a data rate of 0.0024 Mbps. It is a surface-mount chip carrier with 32 terminals, ideal for industrial telecom applications.
CPC5622ATR
Littelfuse
MODEM-DATA/FAX/VOICE; Moisture Sensitivity Level (MSL): 3; Terminal Finish: TIN; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3;
TMS99532ANL
TMS99532ANL by Texas Instruments is a MOS modem IC with 18 terminals in an in-line package. It operates b/w 0°C to 70°C, suitable for commercial applications. The rectangular plastic/epoxy package style with dual terminal position and 2.54mm pitch makes it ideal for telecom equipment.
A5191HRTLG-XTP
Ami Semiconductor
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: LQFP; Package Shape: SQUARE;
SX061J
SX061J by Onsemi is a modem-demodulator IC with 1 Mbps data rate. It features 28 terminals in a square chip carrier package, with J bend terminal form and quad position. Suitable for telecom applications, it offers surface mount capability and compact dimensions of 11.5062mm x 11.5062mm x 4.57mm.
TS7514CFNTR
STMicroelectronics' TS7514CFNTR is a CMOS modem IC with 28 terminals in a square chip carrier package. It operates b/w 0-70 °C, supports data rates up to 0.0012 Mbps, and has programmable features for telecom applications.
A5191HRTP-XTD
A5191HRTP-XTD by Onsemi is a modem IC with 28 terminals, operating at -40 to 85 °C. It has a power supply of 3.3/5V and low current draw of 0.6mA, suitable for industrial telecom applications. The chip carrier package is made of plastic/epoxy, designed for surface mount assembly in various electronic devices.
DS2245ML-24
DS2245ML-24 by Analog Devices is a modem with 30 terminals, operating at 0-70 °C. It has a data rate of 0.0024 Mbps and runs on a 5V supply voltage. Ideal for telecom applications due to its NO LEAD terminal form and MICROELECTRONIC ASSEMBLY package style.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
11564-502-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
11564-503-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Qualification: Not Qualified;
11564-503-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; JESD-609 Code: e0;
11564-504-XTD
11564-504-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
11564-502-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved