Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi 11564-502-XTP modem-demodulator IC features CMOS technology, dual terminal position with 24 terminals on a small outline package. It operates at power supplies of 3/5V and has a terminal pitch of 1.27mm. Ideal for telecom applications requiring surface mount modems in plastic/epoxy packages.
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This material is lightweight and durable, making the modem easy to handle and resistant to damage during transportation or installation.
Surface mount technology allows for efficient and compact PCB design, saving valuable space in electronic devices.
The rectangular shape of the package allows for easy integration into various electronic systems or devices.
This modem can operate on multiple power supplies, providing flexibility in different electronic setups.
With a high number of terminals, this modem can support complex connections and functionalities.
The small outline package style helps in saving space on the PCB board, making it suitable for compact electronic devices.
Tin lead terminal finish provides good solderability and conductivity, ensuring reliable connections in the modem.
Dual terminal position allows for more versatile PCB layout options and better signal routing for optimal performance.
CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the modem.
Gull wing terminal form provides mechanical stability and ease of soldering during the assembly process.
The specific type of telecom IC ensures optimized modulation and demodulation processes, essential for reliable communication.
The small terminal pitch allows for high-density mounting of components on the PCB, enabling a compact and efficient design.
Modems 11564-502-XTP attributes and parameters. Explore more Modems devices from Onsemi
JESD-30 Code:
JESD-609 Code:
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Package Style (Meter):
Power Supplies (V):
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11564-502-XTP Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
IRLML6401TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Minimum Operating Temperature: -55 Cel; Avalanche Energy Rating (EAS): 33 mJ;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
BAV99
STMicroelectronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Microsemi
NPN; Configuration: SINGLE; Surface Mount: NO; Maximum Collector Current (IC): .8 A; Minimum DC Current Gain (hFE): 30; No. of Elements: 1;
Micro Commercial Components
Small Signal Field-Effect Transistors; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Transistor Application: SWITCHING; Maximum Drain Current (ID): .34 A; Package Style (Meter): SMALL OUTLINE;
Vishay Intertechnology
2N7002 by Vishay Intertechnology is a N-CHANNEL FET with 60V DS Breakdown Voltage, 0.115A Drain Current, and 7.5 ohm On Resistance. Ideal for SWITCHING applications due to its SINGLE configuration with BUILT-IN DIODE. Operates in ENHANCEMENT MODE, suitable for surface mount with GULL WING terminals.
LM555CN
Rochester Electronics
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Shape: RECTANGULAR; Surface Mount: NO; No. of Functions: 1;
1N4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Taitron Components
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; No. of Terminals: 3;
Eic Semiconductor
EU2B-YS3303C
Idec
ROTARY SWITCH;
CPC5621A
IXYS Corporation
MODEM-SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SSOP; Package Shape: RECTANGULAR;
TS7542CP
TS7542CP by STMicroelectronics is a modem-support circuit with a data rate of 0.0096 Mbps. It operates at temperatures ranging from 0 to 70 °C and requires power supplies of ±5V. This IC, housed in an in-line package style, features 40 terminals and is suitable for telecom applications.
A5191HRTLG-XTD
Onsemi
A5191HRTLG-XTD by Onsemi is a modem IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V, data rate of 0.0012 Mbps, and low profile flatpack package style. Ideal for industrial telecom applications due to its CMOS technology and low power consumption of 0.0006 mA at 3.3/5V supplies.
73M2901CE-IM/F
Maxim Integrated
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: QCCN; Package Shape: SQUARE;
DS2245-12
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Code: SIMM; Package Shape: RECTANGULAR;
NCN5192MNG
The Onsemi NCN5192MNG is a modem IC with 32 terminals, CMOS technology, and operates at -40 to 85 °C. It features a square surface mount package style with a 1mm seated height. Ideal for industrial telecom applications requiring a 3.3V supply voltage and 0.5mm terminal pitch.
73M2901CL-IGT
Analog Devices
Analog Devices' 73M2901CL-IGT modem operates at -40 to 85 °C, with a data rate of 0.0024 Mbps. Its low profile flatpack design with 40 terminals makes it ideal for industrial telecom applications. The modem's 3.3V supply voltage and quad terminal position offer versatile connectivity options in compact spaces.
FX604D4
Cml Microcircuits
FX604D4 by Cml Microcircuits is a modem IC with 16 terminals, operating at -40 to 85°C. It has a data rate of 0.0012 Mbps and requires 5V supply voltage. Ideal for industrial telecom applications due to its small outline package and low power consumption of 0.0025 mA.
TC35102F
Toshiba
Modems; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 80; Package Code: QFP; Package Shape: RECTANGULAR;
AD1801JST-REEL
AD1801JST-REEL by Analog Devices is a modem IC with 128 terminals in a flatpack, low profile package. Operating b/w 0-85°C, it supports data rates up to 1.4 Mbps at a supply voltage of 5V. Ideal for telecom applications requiring data/fax/voice modulation and demodulation.
L-CV22AV1-E24B-D
Broadcom
Modems;
PEF22827ELV1.1-G
Infineon Technologies
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 225; Package Code: FBGA; Package Shape: SQUARE;
73K312L-28IH
Texas Instruments
73K312L-28IH by Texas Instruments is a modem IC with data rate of 0.0012 Mbps. It operates in industrial temperature range from -40 to 85 °C and requires nominal voltage of 5 V. This chip carrier package has 28 terminals, J bend form, and is suitable for telecom applications.
BCM3368
BCM3300KTB
73M2901CL-IGV
73M2901CL-IGV by Analog Devices is a modem IC with 32 terminals, operating temperature range of -40 to 85 °C. It has a data rate of 0.0024 Mbps and operates at a supply voltage of 3.3V. Ideal for telecom applications due to its thin profile package style and industrial temperature grade suitability.
EF7910JLD
STMicroelectronics' EF7910JLD modem operates at -5V to 5V with 28 terminals in a ceramic rectangular package. It is a bipolar technology telecom IC suitable for commercial applications, with a max operating temperature of 70 °C and supply current of 150mA.
MAX2982GCD/V+W
MODEM;
TS68951CFN013TR
TS68951CFN013TR by STMicroelectronics is a CMOS modem with a compact chip carrier design, featuring 28 terminals. It operates b/w 0 °C to 70°C and requires ±5V power supply. Ideal for telecom applications, it supports efficient data communication in commercial environments.
MM74HC942WM/A+
MM74HC942WM/A+ by Texas Instruments is a CMOS modem IC with dual terminals and a small outline package. It operates b/w -40°C to 85°C, with power supplies of ±5V. Ideal for telecom applications, this surface-mount device has 20 terminals and uses tin/lead terminal finish.
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11564-502-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
11564-503-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Qualification: Not Qualified;
11564-503-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; JESD-609 Code: e0;
11564-504-XTD
11564-504-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
Ami Semiconductor
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
11564-502-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
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