Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
The Onsemi 11564-502-XTP modem-demodulator IC features CMOS technology, dual terminal position with 24 terminals on a small outline package. It operates at power supplies of 3/5V and has a terminal pitch of 1.27mm. Ideal for telecom applications requiring surface mount modems in plastic/epoxy packages.
Median Price
-
Lifecycle Status
Suppliers In-Stock
2
In-Stock Inventory
< 1k
Digiode
1+ parts
100+ parts
1k+ parts
10k+ parts
Vyrian
Native Components
$0.144
$0.138
Northwest PG Solutions
$0.158
$0.139
SupplyDigital Components
Kulean Microsystems
Problanco Electronics
Corphita
UHIMA Technologies
TANS Electronics
Corohmni
This material is lightweight and durable, making the modem easy to handle and resistant to damage during transportation or installation.
Surface mount technology allows for efficient and compact PCB design, saving valuable space in electronic devices.
The rectangular shape of the package allows for easy integration into various electronic systems or devices.
This modem can operate on multiple power supplies, providing flexibility in different electronic setups.
With a high number of terminals, this modem can support complex connections and functionalities.
The small outline package style helps in saving space on the PCB board, making it suitable for compact electronic devices.
Tin lead terminal finish provides good solderability and conductivity, ensuring reliable connections in the modem.
Dual terminal position allows for more versatile PCB layout options and better signal routing for optimal performance.
CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the modem.
Gull wing terminal form provides mechanical stability and ease of soldering during the assembly process.
The specific type of telecom IC ensures optimized modulation and demodulation processes, essential for reliable communication.
The small terminal pitch allows for high-density mounting of components on the PCB, enabling a compact and efficient design.
Modems 11564-502-XTP attributes and parameters. Explore more Modems devices from Onsemi
JESD-30 Code:
JESD-609 Code:
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Power Supplies (V):
Qualification:
Sub-Category:
Surface Mount:
Technology:
Telecom IC Type:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
11564-502-XTP Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N2222A
Digitron Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
2N7002
Changzhou Galaxy Century Microelectronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Minimum DS Breakdown Voltage: 60 V; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; No. of Terminals: 3;
OHN3140U
Optek Technology
MAGNETIC FIELD SENSOR,HALL EFFECT; Mounting Feature: THROUGH HOLE MOUNT; No. of Terminals: 3; Output Type: ANALOG CURRENT; Package Shape or Style: RECTANGULAR; Output Range: 25mA;
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
SMBJ18CA
Microsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
Silicon Group
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BAT54SLT1G
Onsemi
BAT54SLT1G by Onsemi is a fast recovery Schottky diode with 2 elements in series connected configuration. It has a max reverse recovery time of 0.005 us and a max forward voltage of 0.8 V. Ideal for applications requiring high-speed rectification, it operates b/w -55 to 150 °C and can handle a max output current of 0.2 A.
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
C0603C104K5RACAUTO
KEMET Corporation
KEMET C0603C104K5RACAUTO is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics, -55 to 125°C operating range, and ±10% tolerance. Ideal for automotive applications meeting AEC-Q200 standard, it comes in SMT package with matte tin finish and wraparound terminals.
EPCS4SI8N
Intel
EPCS4SI8N by Intel is a small outline flash memory with 512Kx8 organization, operating at 3.3V. It features a max clock frequency of 40MHz and endurance of 100k write/erase cycles. Ideal for industrial applications requiring configuration memory with serial interface and low standby current consumption.
Semitron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Terminal Finish: Matte Tin (Sn) - annealed; Transistor Element Material: SILICON;
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
CRCW080510K0FKEA
Vishay Intertechnology
Vishay Intertechnology's CRCW080510K0FKEA is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.125 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 reference standard compliance and -55 to 155 °C operating temperature range.
RC0402FR-0710KL
Yageo
Yageo's RC0402FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance, suitable for applications requiring a rated power dissipation of 0.0625 W. With a temperature coefficient of 100 ppm/°C, it operates b/w -55 to 155 °C, making it ideal for various electronic circuits.
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
Leshan Radio
LL4148-GS08
Vishay Telefunken
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138BKW,115
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Terminal Finish: TIN; No. of Terminals: 3; Additional Features: LOGIC LEVEL COMPATIBLE;
NDT2955
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
TS68952CP
STMicroelectronics
STMicroelectronics' TS68952CP modem IC operates at 0-70 °C, with 28 terminals in a rectangular package. It supports data rates up to 0.0192 Mbps and runs on a 5V supply voltage. Ideal for telecom applications requiring modem-support circuits, this CMOS technology device is designed for commercial temperature grades.
NCN49599MNTWG
NCN49599MNTWG by Onsemi is a programmable modem with 56 terminals, operating at temperatures from -40 to 85 °C. It has a supply voltage of 3.3V and low current draw of 0.06mA, suitable for industrial telecom applications. This square chip carrier package is surface mountable and made of plastic/epoxy material.
935234750518
NXP Semiconductors
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
NE5050D-T
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
BCM3349KPBG
Broadcom
Modems;
AD28MSP01KR
Analog Devices
AD28MSP01KR by Analog Devices is a 28-terminal modem IC with 5V supply, operating from 0 to 70°C. It features GULL WING terminals in a SMALL OUTLINE package, suitable for telecom applications requiring MODEM-SUPPORT CIRCUIT.
73M2901CE-IGVR/F
Analog Devices' 73M2901CE-IGVR/F modem operates at -40 to 85 °C, with a supply voltage of 3/3.3V and max current of 15.5mA. This telecom IC in a square flatpack package is ideal for industrial applications requiring surface mount modems with 32 terminals.
SI21822-B60-GMR
Skyworks Solutions
MODEM-DEMODULATOR;
UCB1300BE-T
MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
73K324BL-IH
Analog Devices' 73K324BL-IH modem features CMOS technology, operates at -40 to 85 °C, with data rate of 0.0024 Mbps. Ideal for industrial telecom applications due to its compact chip carrier package and J bend terminals.
MAX2992GCB/V+T
Maxim Integrated
Modems; Screening Level: AEC-Q100;
MPL360B-I/Y8X
Microchip Technology
MPL360B-I/Y8X by Microchip Technology is a programmable modem with a package body made of plastic/epoxy. It has 48 terminals in a square shape and operates at temperatures ranging from -40 to 85 °C. This modem is commonly used in telecom applications.
TS75C962CFN-S
STMicroelectronics' TS75C962CFN-S is a 52-terminal modem IC with 0-70 °C operating temp range. It offers 0.0096 Mbps data rate at 5V supply voltage, suitable for telecom applications. The chip carrier package is surface-mountable and has a square shape, making it ideal for commercial-grade modems.
TDA5051TD
KS16114
Samsung
MODEM; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE; Length: 24.2316 mm;
TS7542CFN
STMicroelectronics' TS7542CFN is a modem-support circuit with data rate of 0.0096 Mbps, operating at -5V to +5V. It comes in a square chip carrier package style, suitable for telecom applications requiring low power consumption and compact design.
TS75C322CFN
STMicroelectronics' TS75C322CFN is a modem IC with data rate of 0.0096 Mbps, suitable for telecom applications. It operates b/w 0-70 °C, has 52 terminals in a square chip carrier package, and supports -5V to +5V supply voltage range.
A5191HRTP-XTP
A5191HRTP-XTP by Onsemi is a modem IC with 28 terminals, operating at -40 to 85 °C. It requires 3.3/5V power supply and draws max 0.6mA current. Ideal for industrial telecom applications due to its quad terminal position and J bend form factor in a square chip carrier package.
73K312L-IGT
Texas Instruments
73K312L-IGT by Texas Instruments is a modem IC with data rate of 0.0012 Mbps, operating temperature range from -40 to 85 °C. It features a flatpack package style with 64 terminals in gull wing form. Ideal for industrial telecom applications requiring low profile and fine pitch design.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
11564-502-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
11564-503-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Qualification: Not Qualified;
11564-503-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; JESD-609 Code: e0;
11564-504-XTD
11564-504-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
Ami Semiconductor
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
11564-502-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved