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11564-504-XTP

Onsemi

11564-504-XTP by Onsemi

The Onsemi 11564-504-XTP modem features a plastic/epoxy body, quad terminal position, and CMOS technology. With 32 terminals and a flatpack style, it operates on 3/5V power supplies. Ideal for telecom applications as a modem-demodulator IC with gull wing terminals and 0.8mm pitch.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,054 parts In-Stock

1+ parts

-

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1k+ parts

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2,054

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-

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Vyrian

USA . 166 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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166

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 826 parts In-Stock

1+ parts

$14.990

100+ parts

-

1k+ parts

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10k+ parts

-

826

$14.990

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-

-

Northwest PG Solutions

USA . 610 parts In-Stock

1+ parts

$16.489

100+ parts

$14.840

1k+ parts

-

10k+ parts

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610

$16.489

$14.840

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-

Problanco Electronics

Mexico . 7,302 parts In-Stock

1+ parts

-

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7,302

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SupplyDigital Components

Austria . 5,773 parts In-Stock

1+ parts

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5,773

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-

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Kulean Microsystems

USA . 2,361 parts In-Stock

1+ parts

-

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2,361

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UHIMA Technologies

Türkiye . 650 parts In-Stock

1+ parts

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650

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-

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Corphita

USA . 637 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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637

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TANS Electronics

Latvia . 482 parts In-Stock

1+ parts

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482

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Corohmni

South Africa . 478 parts In-Stock

1+ parts

-

100+ parts

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478

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Overview

Experience seamless connectivity and reliable performance with the 11564-504-XTP by Onsemi. Crafted with precision and expertise, this modem offers unparalleled quality and efficiency for your communication needs. Ideal for a wide range of applications, this product ensures fast and stable connections while maximizing convenience and productivity. Trust in Onsemi's reputation for excellence and elevate your experience with the 11564-504-XTP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials are durable and lightweight, making the modem easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy installation and replacement of the modem, saving time and effort.

Package Shape: SQUARE

The square package shape helps in efficient utilization of space and easy integration into various systems.

Power Supplies (V): 3/5

The modem supports both 3V and 5V power supplies, providing flexibility and compatibility with different power sources.

No. of Terminals: 32

With 32 terminals, the modem can accommodate multiple connections and interfaces, enhancing its functionality.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and streamlined design, saving space and allowing for efficient heat dissipation.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and ensures reliable electrical connections for long-lasting performance.

Terminal Position: QUAD

Quad terminal positions allow for easy and secure mounting of the modem, enhancing its stability and reliability.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260 °C, the modem can withstand high-temperature soldering processes without damage.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, making the modem energy-efficient and cost-effective.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections and durability.

Telecom IC Type: MODEM-DEMODULATOR

Being a modem-demodulator telecom IC type, this modem offers reliable data transmission and reception capabilities, essential for communication purposes.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8mm, the modem allows for high-density packaging and efficient signal routing, optimizing performance and speed.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that the modem can withstand moderate exposure to humidity and moisture, ensuring reliability in various environments.

Technical Specifications

Modems 11564-504-XTP attributes and parameters. Explore more Modems devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Trade Compliance

11564-504-XTP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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