Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi 11564-504-XTP modem features a plastic/epoxy body, quad terminal position, and CMOS technology. With 32 terminals and a flatpack style, it operates on 3/5V power supplies. Ideal for telecom applications as a modem-demodulator IC with gull wing terminals and 0.8mm pitch.
Median Price
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Digiode
1+ parts
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Vyrian
Native Components
$14.990
Northwest PG Solutions
$16.489
$14.840
Problanco Electronics
SupplyDigital Components
Kulean Microsystems
UHIMA Technologies
Corphita
TANS Electronics
Corohmni
Plastic and epoxy materials are durable and lightweight, making the modem easy to handle and transport.
Surface mount technology allows for easy installation and replacement of the modem, saving time and effort.
The square package shape helps in efficient utilization of space and easy integration into various systems.
The modem supports both 3V and 5V power supplies, providing flexibility and compatibility with different power sources.
With 32 terminals, the modem can accommodate multiple connections and interfaces, enhancing its functionality.
The flatpack package style offers a compact and streamlined design, saving space and allowing for efficient heat dissipation.
The tin terminal finish provides corrosion resistance and ensures reliable electrical connections for long-lasting performance.
Quad terminal positions allow for easy and secure mounting of the modem, enhancing its stability and reliability.
With a peak reflow temperature of 260 °C, the modem can withstand high-temperature soldering processes without damage.
CMOS technology offers low power consumption and high integration capabilities, making the modem energy-efficient and cost-effective.
The gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections and durability.
Being a modem-demodulator telecom IC type, this modem offers reliable data transmission and reception capabilities, essential for communication purposes.
With a terminal pitch of 0.8mm, the modem allows for high-density packaging and efficient signal routing, optimizing performance and speed.
A moisture sensitivity level of 3 indicates that the modem can withstand moderate exposure to humidity and moisture, ensuring reliability in various environments.
Modems 11564-504-XTP attributes and parameters. Explore more Modems devices from Onsemi
JESD-30 Code:
JESD-609 Code:
Moisture Sensitivity Level (MSL):
No. of Functions:
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Package Body Material:
Package Code:
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Package Style (Meter):
Peak Reflow Temperature (C):
Power Supplies (V):
Qualification:
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Surface Mount:
Technology:
Telecom IC Type:
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11564-504-XTP Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SMBJ18CA
Synsemi
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
EEAGA1H4R7
Panasonic
Panasonic EEAGA1H4R7 is a 4.7uF, 50V Aluminum Electrolytic Capacitor with 0.1 Tan Delta and 0.003mA Leakage Current. Ideal for applications requiring high ripple current handling in temperatures ranging from -55 to 105°C.
2N7002
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
MBRA340T3G
Onsemi
MBRA340T3G by Onsemi is a Schottky rectifier diode with 40V reverse test voltage and 3A max output current. Ideal for power applications, it operates b/w -55 to 150°C, features matte tin terminal finish, and comes in a small outline package.
BSS138
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Qualification: Not Qualified;
1N4148
Comchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Meritek Electronics
Yageo
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
1554216004
Molex
WIRE AND CABLE;
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
ROHM
BAV99
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138DW-7-F
Diodes Incorporated
BSS138DW-7-F by Diodes Incorporated is a N-channel small signal FET with a min DS breakdown voltage of 50V. It is used for switching applications and operates in enhancement mode. This surface mount transistor has a max drain current of 0.2A and a max power dissipation of 0.2W.
1N4148WT
Good-ark Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CN
Intersil
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
Eic Semiconductor
ST7536CFNTR
STMicroelectronics
ST7536CFNTR by STMicroelectronics is a modem IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -10 to 70 °C, suitable for commercial telecom applications. It has a data rate of 0.0012 Mbps and requires nominal voltage of 5V with max current draw of 35mA.
DS2245M-24
Maxim Integrated
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Code: SIMM; Package Shape: RECTANGULAR;
L-CV92-T48B-DB
Broadcom
Modems;
73M2901CL-IGV
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
SI3015-F-FS
Silicon Labs
SI3015-F-FS by Silicon Labs is a modem IC with 16 terminals, operating at 3.3V/5V and data rate of 0.0024 Mbps. It is used in telecom applications, featuring a small outline package style and Gull Wing terminal form for commercial temperature grade operation up to 70°C.
CPC5620A
IXYS Corporation
MODEM-SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SSOP; Package Shape: RECTANGULAR;
TS75C250CP
STMicroelectronics' TS75C250CP modem operates at -5V to 5V with a data rate of 0.0024 Mbps. With 48 terminals in an inline package, it is ideal for telecom applications requiring a commercial temperature grade and through-hole terminal form.
TC35103F
Toshiba
Modems; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 60; Package Code: QFP; Package Shape: SQUARE;
TS75C250CFN
STMicroelectronics' TS75C250CFN is a modem IC with 52 terminals in a square chip carrier package. Operating temperature range from 0 to 70 °C, supporting data rate of 0.0024 Mbps. Ideal for telecom applications requiring -5V negative supply voltage and 5V nominal voltage.
DS2245-12U
73K224L-32IH
Texas Instruments
The Texas Instruments 73K224L-32IH is a modem IC with 32 terminals in a chip carrier package. It operates b/w -40 to 85°C, supporting data rates up to 0.0024 Mbps. Ideal for industrial telecom applications due to its compact size and J bend terminal form.
TRF3520PFB
TRF3520PFB by Texas Instruments is a modem IC with 48 terminals in a square package. Operating temperature range from -40 to 85°C makes it suitable for industrial use. With a nominal voltage of 3.75V, this thin profile flatpack is ideal for telecom applications.
DS2245-24
LTC5585IUF#TRPBF
Analog Devices
LTC5585IUF#TRPBF by Analog Devices is a CMOS modem-demodulator IC with 24 terminals in a square chip carrier package. It operates b/w -40 to 105 °C, suitable for industrial use. With matte tin finish and no-lead terminal form, it's ideal for telecom applications requiring a nominal 5V supply voltage.
ADSP-21MOD870-100
ADSP-21MOD870-100 by Analog Devices is a modem IC with 100 terminals, 8 kbps fax rate, and 0.056 Mbps data rate. It is used in telecom applications for low profile, fine pitch package style in plastic/epoxy material.
MC145442BDW
NXP Semiconductors
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
STLC60134S
STLC60134S by STMicroelectronics is a modem IC with 64 terminals, operating at 3.3V, supporting data rate of 0.008192 Mbps. It features a flatpack package style, CMOS technology, and is suitable for telecom applications requiring modem-support circuits.
AD9867BCPZRL
Analog Devices' AD9867BCPZRL is a CMOS modem IC with 64 terminals in a chip carrier package. It operates b/w -40°C to 85°C, suitable for industrial use. With a nominal voltage of 3.3V, it's ideal for telecom applications requiring high-performance modems.
MAX2980CCB-T
Modems; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 64; Package Code: QFP; Package Shape: SQUARE;
NCN49597MNRG
The Onsemi NCN49597MNRG is a programmable modem with 52 terminals, operating at temperatures from -40 to 115 °C. It has a supply voltage of 3.3V and low current draw of 0.06mA, suitable for industrial telecom applications in surface-mount configurations.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
11564-502-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
11564-502-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 3/5;
11564-503-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Qualification: Not Qualified;
11564-503-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; JESD-609 Code: e0;
11564-504-XTD
Ami Semiconductor
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK;
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; No. of Functions: 1;
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Terminal Position: QUAD;
11564-504-XTP
Supply Digital Components
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