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ST70136G

STMicroelectronics

ST70136G by STMicroelectronics

ST70136G by STMicroelectronics is a low-profile modem with a 3.3V/5V power supply and operates b/w 0 °C to 70°C. It features a compact square design (10mm x 10mm) with 64 terminals, ideal for telecom applications. Its BICMOS technology ensures efficient performance in communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,977 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,977

-

-

-

-

Vyrian

USA . 1,332 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,332

-

-

-

-

Digiode

USA . 743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

743

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,624 parts In-Stock

1+ parts

$15.293

100+ parts

-

1k+ parts

$13.764

10k+ parts

-

1,624

$15.293

-

$13.764

-

MKK Technologies

India . 855 parts In-Stock

1+ parts

$28.758

100+ parts

-

1k+ parts

-

10k+ parts

-

855

$28.758

-

-

-

DigiPath Technology Company

USA . 855 parts In-Stock

1+ parts

$28.758

100+ parts

-

1k+ parts

-

10k+ parts

-

855

$28.758

-

-

-

Corphita

USA . 3,390 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,390

-

-

-

-

Parana Technologies

USA . 392 parts In-Stock

1+ parts

-

100+ parts

$18.285

1k+ parts

-

10k+ parts

-

392

-

$18.285

-

-

Overview

Unlock seamless connectivity with the ST70136G modem from STMicroelectronics, a trusted leader in innovative technology. Designed for efficiency and reliability, this low-profile, surface-mount solution excels in various applications, ensuring top-notch performance across telecommunications. Experience enhanced durability and versatility, effortlessly integrating into your designs while benefiting from ST's commitment to quality that drives your projects forward. Choose ST70136G and elevate your connectivity solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making the modem suitable for various applications.

Surface Mount: YES

With surface mount capabilities, the modem provides a compact design and allows for easier integration in modern circuit boards.

Package Shape: SQUARE

The square package shape enhances layout options and optimizes space efficiency on PCB designs.

Power Supplies (V): 3.3, 5

Support for multiple power supply voltages (3.3V and 5V) allows for greater flexibility in a variety of applications and compatibility with different systems.

No. of Terminals: 64

With 64 terminals, this modem provides extensive connectivity options for various peripherals and components, facilitating complex functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design with fine pitch is ideal for space-constrained applications where height is a critical factor.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C indicates reliability and performance under moderate thermal conditions, making it suitable for many environments.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C allows for operation in cold environments, expanding its usability across various climates.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on terminals enhances durability and conductivity, ensuring better electrical performance and extended lifespan.

Terminal Position: QUAD

Quad terminal positioning provides a stable connection layout, which is beneficial for enhancing the reliability of signal transmission.

Maximum Seated Height: 1.6 mm

At a maximum seated height of just 1.6 mm, this modem is perfect for applications where vertical space is limited.

Width: 10 mm

The compact width of 10 mm allows for easy installation in tight spaces without compromising functionality.

Length: 10 mm

A length of 10 mm maintains a small footprint, making it ideal for portable and compact devices.

Temperature Grade: COMMERCIAL

Being classified as commercial grade means this modem is designed for general-purpose applications, striking a balance between performance and cost.

Technology: BICMOS

The use of BICMOS technology combines the advantages of bipolar and CMOS, leading to lower power consumption and higher speed, making it efficient for modem functionality.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering characteristics and mechanical stability, ensuring a strong connection in assembly.

Telecom IC Type: MODEM-SUPPORT CIRCUIT

As a modem-support circuit IC type, this product is specifically tailored for communication applications, making it an optimal choice for telecom solutions.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch enables a dense arrangement of connections, maximizing the number of inputs/outputs available in a compact space.

Technical Specifications

Modems ST70136G attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3.3,5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

BICMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

ST70136G Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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