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A5191HRTPG

Onsemi

A5191HRTPG by Onsemi

A5191HRTPG by Onsemi is a modem IC with CMOS technology, operating at 3.3V. It offers data rate of 0.0012 Mbps and operates in industrial temperature range (-40 to 85°C). This square chip carrier package with 28 terminals is ideal for telecom applications requiring reliable communication.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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VNN

France . 2,574 parts In-Stock

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Vyrian

USA . 1,550 parts In-Stock

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Digiode

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Nova Conductors

Japan . 50 parts In-Stock

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LWI Electronics Inc

India . 16 parts In-Stock

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Semi Source

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AZTECH Wire

Italy . 228 parts In-Stock

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$12.301

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Ampacity Inc.

Singapore . 1,479 parts In-Stock

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Kepictronics

USA . 7,856 parts In-Stock

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Problanco Electronics

Mexico . 7,222 parts In-Stock

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Lixinc

USA . 4,516 parts In-Stock

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TANS Electronics

Latvia . 4,308 parts In-Stock

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Kulean Microsystems

USA . 2,132 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 840 parts In-Stock

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SupplyDigital Components

Austria . 441 parts In-Stock

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Corphita

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Corohmni

South Africa . 113 parts In-Stock

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Overview

Elevate your communication experience with the A5191HRTPG by Onsemi. This modem, crafted by a trusted manufacturer in the industry, offers unparalleled quality and reliability. Perfect for a wide range of applications, this modem is designed to enhance your connectivity needs effortlessly. Say goodbye to slow connections and hello to seamless communication with the A5191HRTPG. Upgrade your technology today and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the modem easy to handle and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation of the modem on circuit boards.

Maximum Operating Temperature: 85 °C

The modem can operate at high temperatures without malfunctioning, ensuring reliability in various environments.

Nominal Supply Voltage: 3.3 V

The modem operates at a standard voltage, making it compatible with a wide range of systems.

Data Rate: 0.0012 Mbps

The modem has a decent data rate, suitable for basic internet browsing and communication needs.

Technical Specifications

Modems A5191HRTPG attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3/e4

Length:

11.4808 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN/NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

11.4808 mm

Trade Compliance

A5191HRTPG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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