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A5191HRTPG-XTD

Onsemi

A5191HRTPG-XTD by Onsemi

A5191HRTPG-XTD by Onsemi is a modem IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V, data rate of 0.0012 Mbps, and terminal pitch of 1.27mm. Ideal for industrial applications requiring low power consumption and reliable communication over short distances.

Median Price

$12.660

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$6.090

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1,000

$6.090

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Component Electronics Inc.

Canada . 3 parts In-Stock

1+ parts

$19.230

100+ parts

$14.420

1k+ parts

$12.500

10k+ parts

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3

$19.230

$14.420

$12.500

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Digiode

USA . 1,638 parts In-Stock

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1,638

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Vyrian

USA . 1,081 parts In-Stock

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1,081

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Sensible Micro Corp

USA . 296 parts In-Stock

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296

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Chip Stock

USA . 187 parts In-Stock

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187

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ComSIT Distribution GmbH

Germany . 27 parts In-Stock

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27

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Distributors (Availability)

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Benley Electronics

USA . 40 parts In-Stock

1+ parts

$0.400

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40

$0.400

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Continental Prestige Electronics

USA . 5,796 parts In-Stock

1+ parts

$6.090

100+ parts

-

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10k+ parts

$5.968

5,796

$6.090

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-

$5.968

Netroflash

USA . 50 parts In-Stock

1+ parts

$6.090

100+ parts

$5.968

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-

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50

$6.090

$5.968

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AZTECH Wire

Italy . 475 parts In-Stock

1+ parts

$14.712

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475

$14.712

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Corohmni

South Africa . 181 parts In-Stock

1+ parts

$14.945

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181

$14.945

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Advanced Electronics

New Zealand . 83 parts In-Stock

1+ parts

$15.607

100+ parts

$14.202

1k+ parts

$12.798

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83

$15.607

$14.202

$12.798

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Lixinc

USA . 17,087 parts In-Stock

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Microchip USA

USA . 11,336 parts In-Stock

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Perfect Parts

USA . 9,980 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,628 parts In-Stock

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TANS Electronics

Latvia . 4,609 parts In-Stock

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4,609

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Argo Parts USA

USA . 4,516 parts In-Stock

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4,516

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Alle Elektronik GmbH

Germany . 3,752 parts In-Stock

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3,752

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Glotronic Ltd.

UK . 3,700 parts In-Stock

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3,700

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Kulean Microsystems

USA . 3,047 parts In-Stock

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3,047

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SupplyDigital Components

Austria . 1,312 parts In-Stock

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UHIMA Technologies

Türkiye . 607 parts In-Stock

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607

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Corphita

USA . 533 parts In-Stock

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533

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Kepictronics

USA . 500 parts In-Stock

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500

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Problanco Electronics

Mexico . 434 parts In-Stock

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434

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Overview

Elevate your communication systems with the A5191HRTPG-XTD by Onsemi, a cutting-edge modem that delivers unparalleled quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this modem is designed to meet the demands of industrial applications with its impressive features and robust construction. Whether you're looking to enhance your data transmission or improve connectivity, the A5191HRTPG-XTD is the perfect solution for your needs. Upgrade your systems today and experience the benefits of superior performance and seamless communication with this exceptional modem.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, perfect for portable and long-term use.

Surface Mount: YES

Being surface mountable allows for easy installation onto circuit boards, saving space and improving overall system efficiency.

Power Supplies (V): 3.3/5

The modem supports multiple power supply voltages, offering flexibility in different applications and environments.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this modem can perform reliably in various industrial settings without overheating.

Data Rate: 0.0012 Mbps

The modem offers a decent data rate of 0.0012 Mbps, suitable for basic internet browsing and communication needs.

Technical Specifications

Modems A5191HRTPG-XTD attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.506 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Sub-Category:

Modems

Maximum Supply Current:

.0006 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.506 mm

Trade Compliance

A5191HRTPG-XTD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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