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A5191HRTP-XTD

Onsemi

A5191HRTP-XTD by Onsemi

A5191HRTP-XTD by Onsemi is a modem IC with 28 terminals, operating at -40 to 85 °C. It has a power supply of 3.3/5V and low current draw of 0.6mA, suitable for industrial telecom applications. The chip carrier package is made of plastic/epoxy, designed for surface mount assembly in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Digiode

USA . 603 parts In-Stock

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Vyrian

USA . 385 parts In-Stock

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385

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SupplyDigital Components

Austria . 7,972 parts In-Stock

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TANS Electronics

Latvia . 5,945 parts In-Stock

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Problanco Electronics

Mexico . 4,985 parts In-Stock

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Kulean Microsystems

USA . 2,724 parts In-Stock

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Corphita

USA . 1,845 parts In-Stock

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Native Components

USA . 499 parts In-Stock

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499

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Northwest PG Solutions

USA . 491 parts In-Stock

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UHIMA Technologies

Türkiye . 338 parts In-Stock

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Corohmni

South Africa . 330 parts In-Stock

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Overview

Upgrade your communication systems with the A5191HRTP-XTD by Onsemi, a top-quality modem that delivers reliable performance and efficiency. Onsemi is a trusted manufacturer known for its innovative solutions in the telecommunications industry. This modem is ideal for a wide range of applications, offering seamless connectivity and fast data transmission. Experience the value and benefits of this product as it enhances your communication networks, providing you with a competitive edge in today's fast-paced digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Power Supplies (V): 3.3/5

The modem is compatible with multiple power supply voltages, providing flexibility in different electronic systems and environments.

No. of Terminals: 28

Having 28 terminals allows for a wide range of connectivity options and interfaces, enhancing the versatility of the modem.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal performance and efficient heat dissipation, improving the overall reliability of the modem.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, the modem can withstand harsh environmental conditions and prolonged use.

Minimum Operating Temperature: -40 °C

The modem can operate efficiently even in extremely low temperatures down to -40 °C, making it suitable for various industrial and outdoor applications.

Temperature Grade: INDUSTRIAL

The modem is designed to meet industrial temperature grade standards, ensuring reliable performance in demanding industrial environments.

Maximum Supply Current: 0.6 mA

The low maximum supply current of 0.6 mA helps in reducing power consumption and improving energy efficiency of the modem.

Telecom IC Type: MODEM

As a modem, this product is specifically designed for telecommunication applications, providing reliable data transmission and communication capabilities.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise and secure connections, ensuring stable performance and signal integrity of the modem.

Technical Specifications

Modems A5191HRTP-XTD attributes and parameters. Explore more Modems devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-J28

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Modems

Maximum Supply Current:

.6 mA

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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