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MAX2990ECB+

Analog Devices

MAX2990ECB+ by Analog Devices

MODEM; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e3; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

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Suppliers In-Stock

6

In-Stock Inventory

1k+

MAX2990ECB+ by Analog Devices
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Analog Devices Inc

USA . 1,900 parts In-Stock

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Vyrian

USA . 7,778 parts In-Stock

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Chip Stock

USA . 3,983 parts In-Stock

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Digiode

USA . 2,361 parts In-Stock

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Anansix

USA . 2,048 parts In-Stock

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Rebound Electronics

UK . 175 parts In-Stock

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Distributors (Availability)

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MARBEL Systems

Belgium . 50 parts In-Stock

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$9.675

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$9.675

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Texas Native Microelectronics

USA . 450 parts In-Stock

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$11.121

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$10.676

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$10.343

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$9.786

450

$11.121

$10.676

$10.343

$9.786

Kenton Components

USA . 10 parts In-Stock

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$13.345

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$11.744

10

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AZTECH Wire

Italy . 624 parts In-Stock

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$15.500

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Qasali Group International

UK . 4,156 parts In-Stock

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$30.027

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$27.925

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$26.423

4,156

$30.027

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Semicontronic

India . 1,013 parts In-Stock

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$589.000

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$574.275

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$571.330

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Vigor

Singapore . 5,970 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,736 parts In-Stock

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Glotronic Ltd.

UK . 2,117 parts In-Stock

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Microchip USA

USA . 1,787 parts In-Stock

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Corphita

USA . 1,311 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 111 parts In-Stock

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111

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Kepictronics

USA . 100 parts In-Stock

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100

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Technical Specifications

Modems MAX2990ECB+ attributes and parameters. Explore more Modems devices from Analog Devices

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Telecom IC Type:

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

MAX2990ECB+ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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