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TMS99532JL

Texas Instruments

TMS99532JL by Texas Instruments

TMS99532JL by Texas Instruments is a MOS modem IC with 18 terminals in an inline package. It operates b/w 0°C to 70°C, suitable for commercial applications. The rectangular ceramic package has a terminal pitch of 2.54mm, making it ideal for telecom systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,513 parts In-Stock

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6,513

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Digiode

USA . 1,070 parts In-Stock

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1,070

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,108 parts In-Stock

1+ parts

$12.789

100+ parts

-

1k+ parts

$13.256

10k+ parts

-

2,108

$12.789

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$13.256

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AZTECH Wire

Italy . 886 parts In-Stock

1+ parts

$13.281

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886

$13.281

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DigiPath Technology Company

USA . 1,593 parts In-Stock

1+ parts

$14.083

100+ parts

$12.956

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1,593

$14.083

$12.956

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ChromeModa Solutions

Germany . 2,076 parts In-Stock

1+ parts

$14.370

100+ parts

$11.783

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2,076

$14.370

$11.783

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

1+ parts

$14.370

100+ parts

$13.652

1k+ parts

$12.933

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1,962

$14.370

$13.652

$12.933

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One Stop Electronics

USA . 476 parts In-Stock

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$507.000

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476

$507.000

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Corphita

USA . 4,960 parts In-Stock

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4,960

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Overview

Unlock seamless communication with the TMS99532JL modem by Texas Instruments. Crafted with precision and expertise, this modem offers unparalleled quality and reliability. Ideal for a wide range of applications, this modem is designed to elevate your connectivity experience. Experience lightning-fast data transfer speeds and crystal-clear communication with the TMS99532JL. Trust in Texas Instruments to deliver cutting-edge technology that promises value, benefits, and advantages for all your communication needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides durability and excellent heat dissipation, making the modem resistant to high temperatures and ensuring long-term reliability.

No. of Terminals: 18

Having 18 terminals allows for a greater range of connectivity options and compatibility with various devices and systems.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures the modem can continue to function efficiently even in warmer environments.

Technology: MOS

Metal-Oxide-Semiconductor (MOS) technology offers low power consumption and high efficiency, making the modem energy-efficient and cost-effective in the long run.

Telecom IC Type: MODEM

Being specifically designed as a modem telecom IC type ensures that the product meets the necessary standards and requirements for telecommunications, providing reliable connectivity.

Technical Specifications

Modems TMS99532JL attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T18

No. of Terminals:

18

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

Modems

Surface Mount:

NO

Technology:

MOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS99532JL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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