Loading...

12197-507-XTP

Onsemi

12197-507-XTP by Onsemi

12197-507-XTP by Onsemi is a modem IC with 32 terminals in a square package. Operating temperature ranges from -40 to 85 °C, suitable for industrial use. Features include 3.3V supply voltage, 0.0012 Mbps data rate, and CMOS technology for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,580 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,580

-

-

-

-

Digiode

USA . 484 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

484

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 334 parts In-Stock

1+ parts

$1.300

100+ parts

-

1k+ parts

-

10k+ parts

-

334

$1.300

-

-

-

Northwest PG Solutions

USA . 175 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

-

175

$1.430

-

-

-

Kulean Microsystems

USA . 7,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,132

-

-

-

-

Problanco Electronics

Mexico . 5,502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,502

-

-

-

-

TANS Electronics

Latvia . 4,494 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,494

-

-

-

-

SupplyDigital Components

Austria . 906 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

906

-

-

-

-

Corphita

USA . 398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

398

-

-

-

-

Corohmni

South Africa . 325 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

325

-

-

-

-

UHIMA Technologies

Türkiye . 144 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

144

-

-

-

-

Overview

Unlock the power of seamless communication with the 12197-507-XTP modem by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability. Ideal for a wide range of applications, this modem offers unparalleled value with its advanced technology and industrial-grade performance. Elevate your connectivity experience with the 12197-507-XTP and stay ahead in today's fast-paced world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, ideal for portable and long-lasting use.

Surface Mount: YES

With surface mount capability, the modem can be easily integrated into various electronic systems, saving space and simplifying installation.

Maximum Operating Temperature: 85 °C

The modem can operate efficiently in a wide range of temperature conditions, ensuring reliability and performance even in harsh environments.

Technology: CMOS

CMOS technology offers low power consumption and high speed performance, making the modem energy-efficient and reliable for continuous operation.

Data Rate: 0.0012 Mbps

The high data rate of 0.0012 Mbps ensures fast and reliable data transmission, making the modem suitable for applications requiring quick and efficient communication.

Technical Specifications

Modems 12197-507-XTP attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3/e4

Length:

7 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7 mm

Trade Compliance

12197-507-XTP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 13