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73K212SL-IP

Texas Instruments

73K212SL-IP by Texas Instruments

73K212SL-IP by Texas Instruments is an industrial-grade modem with a data rate of 0.0012 Mbps. It operates b/w -40°C to 85°C, featuring a rectangular package style with 22 terminals for through-hole mounting. Ideal for telecom applications requiring reliable communication at a nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,421 parts In-Stock

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4,421

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Digiode

USA . 1,725 parts In-Stock

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1,725

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Distributors (Availability)

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Native Components

USA . 815 parts In-Stock

1+ parts

$2.040

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-

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815

$2.040

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Northwest PG Solutions

USA . 1,508 parts In-Stock

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$2.244

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1,508

$2.244

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Parana Technologies

USA . 477 parts In-Stock

1+ parts

$7.618

100+ parts

-

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$8.134

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477

$7.618

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$8.134

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DigiPath Technology Company

USA . 790 parts In-Stock

1+ parts

$8.388

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790

$8.388

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ChromeModa Solutions

Germany . 6,725 parts In-Stock

1+ parts

$8.559

100+ parts

$7.018

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6,725

$8.559

$7.018

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IDEA Electronic Components Group

UK . 499 parts In-Stock

1+ parts

$8.559

100+ parts

$8.131

1k+ parts

$7.703

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499

$8.559

$8.131

$7.703

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AZTECH Wire

Italy . 419 parts In-Stock

1+ parts

$18.022

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419

$18.022

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One Stop Electronics

USA . 1,210 parts In-Stock

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$127.000

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1,210

$127.000

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Emar International I/E

Canada . 4,500 parts In-Stock

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4,500

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Corphita

USA . 1,224 parts In-Stock

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Overview

Upgrade your communication systems with the cutting-edge 73K212SL-IP modem by Texas Instruments. Renowned for their superior quality and reliability, Texas Instruments offers a wide range of advanced modems for various applications. The 73K212SL-IP stands out for its exceptional value, providing customers with seamless connectivity and high-speed data transmission. Whether you need to improve your networking capabilities or enhance your IoT devices, this modem delivers unparalleled performance and efficiency. Trust Texas Instruments for all your modem needs and experience the difference in quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the modem, ensuring longevity and reliability.

No. of Terminals: 22

Having 22 terminals allows for efficient connectivity and communication with other devices, facilitating smooth data transfer.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures stable performance even in challenging environmental conditions.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V makes the modem compatible with a wide range of power sources, increasing its versatility.

Data Rate: 0.0012 Mbps

With a data rate of 0.0012 Mbps, this modem is capable of processing data at a moderate speed, suitable for various applications.

Technical Specifications

Modems 73K212SL-IP attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0012 Mbps

JESD-30 Code:

R-PDIP-T22

Length:

27.686 mm

No. of Functions:

1

No. of Terminals:

22

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

73K212SL-IP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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