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73K312L-28IH

Texas Instruments

73K312L-28IH by Texas Instruments

73K312L-28IH by Texas Instruments is a modem IC with data rate of 0.0012 Mbps. It operates in industrial temperature range from -40 to 85 °C and requires nominal voltage of 5 V. This chip carrier package has 28 terminals, J bend form, and is suitable for telecom applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,411 parts In-Stock

1+ parts

-

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8,411

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Digiode

USA . 73 parts In-Stock

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73

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 559 parts In-Stock

1+ parts

$0.151

100+ parts

-

1k+ parts

-

10k+ parts

$0.145

559

$0.151

-

-

$0.145

Northwest PG Solutions

USA . 2,300 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

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$0.146

2,300

$0.166

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-

$0.146

Parana Technologies

USA . 1,483 parts In-Stock

1+ parts

$12.887

100+ parts

-

1k+ parts

$13.369

10k+ parts

-

1,483

$12.887

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$13.369

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AZTECH Wire

Italy . 464 parts In-Stock

1+ parts

$14.171

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464

$14.171

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DigiPath Technology Company

USA . 301 parts In-Stock

1+ parts

$14.190

100+ parts

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301

$14.190

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IDEA Electronic Components Group

UK . 2,128 parts In-Stock

1+ parts

$14.480

100+ parts

$13.756

1k+ parts

$13.032

10k+ parts

-

2,128

$14.480

$13.756

$13.032

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ChromeModa Solutions

Germany . 1,635 parts In-Stock

1+ parts

$14.480

100+ parts

$11.874

1k+ parts

-

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1,635

$14.480

$11.874

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One Stop Electronics

USA . 1,370 parts In-Stock

1+ parts

$141.000

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1,370

$141.000

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Corphita

USA . 3,994 parts In-Stock

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3,994

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Overview

Elevate your communication capabilities with the cutting-edge 73K312L-28IH by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability in all its products. This modem, designed with precision and expertise, offers seamless connectivity for a range of applications. Experience unparalleled performance and efficiency without compromising on durability. Upgrade your communication systems today with the 73K312L-28IH and stay ahead in the fast-paced world of technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the modem easy to handle and long-lasting.

Surface Mount: YES

With surface mount capability, this modem can be easily integrated into various electronic devices or circuit boards.

Package Shape: SQUARE

The square shape allows for efficient use of space and easy placement within electronic equipment.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and potential for additional features.

Package Style (Meter): CHIP CARRIER

The chip carrier style is compact and enables efficient heat dissipation, enhancing the modem's performance.

Maximum Operating Temperature: 85 °C

The modem can operate effectively at high temperatures, ensuring reliability in various environments.

Nominal Supply Voltage: 5 V

With a low supply voltage requirement, the modem is energy-efficient and compatible with many power sources.

Data Rate: 0.0012 Mbps

Despite its small size, the modem offers a decent data rate, suitable for basic internet browsing and communication needs.

Technical Specifications

Modems 73K312L-28IH attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQCC-J28

Length:

11.5062 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.5062 mm

Trade Compliance

73K312L-28IH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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