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73K324L-32IH

Texas Instruments

73K324L-32IH by Texas Instruments

The Texas Instruments 73K324L-32IH is a modem IC with data rate of 0.0024 Mbps, suitable for industrial applications. It operates b/w -40 to 85°C, has 32 terminals in J bend form factor, and requires a nominal voltage of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,035 parts In-Stock

1+ parts

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4,035

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Vyrian

USA . 3,912 parts In-Stock

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3,912

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,011 parts In-Stock

1+ parts

$6.663

100+ parts

-

1k+ parts

$7.370

10k+ parts

-

1,011

$6.663

-

$7.370

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DigiPath Technology Company

USA . 1,665 parts In-Stock

1+ parts

$7.337

100+ parts

$6.750

1k+ parts

-

10k+ parts

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1,665

$7.337

$6.750

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ChromeModa Solutions

Germany . 3,156 parts In-Stock

1+ parts

$7.487

100+ parts

$6.139

1k+ parts

-

10k+ parts

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3,156

$7.487

$6.139

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IDEA Electronic Components Group

UK . 1,966 parts In-Stock

1+ parts

$7.487

100+ parts

-

1k+ parts

$6.738

10k+ parts

-

1,966

$7.487

-

$6.738

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AZTECH Wire

Italy . 737 parts In-Stock

1+ parts

$12.246

100+ parts

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737

$12.246

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One Stop Electronics

USA . 1,427 parts In-Stock

1+ parts

$991.000

100+ parts

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1,427

$991.000

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Glotronic Ltd.

UK . 3,000 parts In-Stock

1+ parts

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3,000

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Corphita

USA . 2,986 parts In-Stock

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2,986

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Northwest PG Solutions

USA . 2,372 parts In-Stock

1+ parts

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2,372

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Native Components

USA . 681 parts In-Stock

1+ parts

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681

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Overview

Elevate your communication capabilities with the 73K324L-32IH by Texas Instruments. This modem is crafted with precision and expertise, reflecting the superior quality of its manufacturer. Perfect for a wide range of applications, this modem offers unrivaled value and benefits to customers looking to enhance their connectivity. Stay ahead of the curve with Texas Instruments and experience seamless communication like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the internal components of the modem.

Surface Mount: YES

Being surface mountable makes installation and integration of the modem easier and more convenient.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this modem can withstand tough industrial environments without overheating.

Nominal Supply Voltage: 5 V

Operating at a standard 5V supply voltage makes this modem compatible with various systems and power sources.

Data Rate: 0.0024 Mbps

Despite its compact size, this modem offers a decent data rate of 0.0024 Mbps for efficient communication.

Technical Specifications

Modems 73K324L-32IH attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0024 Mbps

JESD-30 Code:

R-PQCC-J32

Length:

13.995 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

3.56 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.455 mm

Trade Compliance

73K324L-32IH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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