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73K302SL-IP

Texas Instruments

73K302SL-IP by Texas Instruments

The Texas Instruments 73K302SL-IP modem features a data rate of 0.0012 Mbps, operates at temperatures ranging from -40 to 85 °C, and has 22 terminals in an IN-LINE package style. Ideal for industrial applications requiring reliable communication over telecom networks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,554 parts In-Stock

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8,554

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Digiode

USA . 907 parts In-Stock

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907

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Distributors (Availability)

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Parana Technologies

USA . 253 parts In-Stock

1+ parts

$10.433

100+ parts

-

1k+ parts

$10.945

10k+ parts

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253

$10.433

-

$10.945

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DigiPath Technology Company

USA . 1,669 parts In-Stock

1+ parts

$11.488

100+ parts

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1,669

$11.488

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ChromeModa Solutions

Germany . 3,312 parts In-Stock

1+ parts

$11.722

100+ parts

$9.612

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3,312

$11.722

$9.612

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IDEA Electronic Components Group

UK . 107 parts In-Stock

1+ parts

$11.722

100+ parts

$11.136

1k+ parts

$10.550

10k+ parts

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107

$11.722

$11.136

$10.550

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AZTECH Wire

Italy . 506 parts In-Stock

1+ parts

$12.211

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506

$12.211

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One Stop Electronics

USA . 934 parts In-Stock

1+ parts

$304.000

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934

$304.000

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Corphita

USA . 4,874 parts In-Stock

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4,874

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Northwest PG Solutions

USA . 2,128 parts In-Stock

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2,128

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Native Components

USA . 976 parts In-Stock

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976

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Overview

Enhance your communication systems with the reliable 73K302SL-IP modem by Texas Instruments. Crafted with precision and quality, this modem offers seamless connectivity and unmatched performance for various applications in the telecommunications industry. Whether you're looking to upgrade your equipment or streamline your operations, this modem provides exceptional value and benefits, making it the perfect choice for your business needs. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for long-term use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and placement in various setups.

No. of Terminals: 22

Having 22 terminals provides ample connectivity options for different configurations and setups.

Package Style (Meter): IN-LINE

In-line package style allows for efficient and space-saving installation in equipment or systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this modem can withstand extended use in various environments.

Minimum Operating Temperature: -40 °C

Having a low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position offers flexibility in wiring and connection options.

Maximum Seated Height: 5.08 mm

Low maximum seated height allows for compact and streamlined design for space-constrained installations.

Width: 10.16 mm

Narrow width makes the modem suitable for applications where space is limited.

Length: 27.686 mm

The moderate length provides a balance between compactness and functionality in the modem design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in harsh industrial environments.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies soldering and installation processes for ease of use.

Telecom IC Type: MODEM

Specifically designed for telecom applications, ensuring optimal performance in data transmission.

Nominal Supply Voltage: 5 V

Compatible with standard 5V power sources for easy integration into existing systems.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for compatibility with a wide range of connectors and sockets.

Data Rate: 0.0012 Mbps

Capable of transmitting data at a rate of 0.0012 Mbps, suitable for various communication applications.

Technical Specifications

Modems 73K302SL-IP attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0012 Mbps

JESD-30 Code:

R-PDIP-T22

Length:

27.686 mm

No. of Functions:

1

No. of Terminals:

22

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

10.16 mm

Trade Compliance

73K302SL-IP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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