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73K312L-IH

Texas Instruments

73K312L-IH by Texas Instruments

The Texas Instruments 73K312L-IH is a modem IC with data rate of 0.0012 Mbps. It operates in industrial temperature range (-40 to 85 °C) and requires nominal voltage of 5V. Suitable for telecom applications, it comes in a square chip carrier package with 44 terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,191 parts In-Stock

1+ parts

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7,191

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Digiode

USA . 4,534 parts In-Stock

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4,534

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Manoshevitz Elec. Sales

Israel . 7 parts In-Stock

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7

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 404 parts In-Stock

1+ parts

$0.560

100+ parts

-

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404

$0.560

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Northwest PG Solutions

USA . 1,602 parts In-Stock

1+ parts

$0.616

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-

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1,602

$0.616

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AZTECH Wire

Italy . 500 parts In-Stock

1+ parts

$6.777

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500

$6.777

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Parana Technologies

USA . 506 parts In-Stock

1+ parts

$7.641

100+ parts

-

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$8.159

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506

$7.641

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$8.159

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DigiPath Technology Company

USA . 72 parts In-Stock

1+ parts

$8.413

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-

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72

$8.413

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IDEA Electronic Components Group

UK . 1,118 parts In-Stock

1+ parts

$8.585

100+ parts

$8.156

1k+ parts

$7.726

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1,118

$8.585

$8.156

$7.726

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ChromeModa Solutions

Germany . 81 parts In-Stock

1+ parts

$8.585

100+ parts

$7.040

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-

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81

$8.585

$7.040

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One Stop Electronics

USA . 1,373 parts In-Stock

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$671.000

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1,373

$671.000

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Corphita

USA . 1,771 parts In-Stock

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1,771

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Giza Technologies, Inc.

USA . 17 parts In-Stock

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Overview

Upgrade your communication capabilities with the Texas Instruments 73K312L-IH Modem. Designed with precision by industry leader Texas Instruments, this modem offers unparalleled quality and reliability. Ideal for a wide range of applications, this modem is perfect for enhancing your connectivity in industrial settings. Experience seamless data transmission at high speeds with the 73K312L-IH modem. Trust in Texas Instruments to deliver cutting-edge technology that meets your needs. Elevate your communication systems today with the 73K312L-IH Modem.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the modem lightweight and durable, ideal for portable or rugged environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and reducing production time.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this modem can withstand high temperature environments without compromising performance.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with a wide range of power sources, making it versatile and easy to integrate into existing systems.

Data Rate: 0.0012 Mbps

Despite its compact size, this modem offers a data rate of 0.0012 Mbps, providing reliable and fast data transmission for various applications.

Technical Specifications

Modems 73K312L-IH attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQCC-J44

Length:

16.5862 mm

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.5862 mm

Trade Compliance

73K312L-IH Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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