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MC68194FJ

Onsemi

MC68194FJ by Onsemi

MC68194FJ by Onsemi is a 52-terminal modem IC with 5V supply, operating at 0-70 °C. It offers data rate of 10 Mbps and consumes 0.27mA current. Ideal for telecom applications due to its BIPOLAR technology and J BEND terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,383 parts In-Stock

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Vyrian

USA . 1,132 parts In-Stock

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Kulean Microsystems

USA . 7,978 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,757 parts In-Stock

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Problanco Electronics

Mexico . 5,644 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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RC Electronics

USA . 2,821 parts In-Stock

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TANS Electronics

Latvia . 2,804 parts In-Stock

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Corphita

USA . 2,002 parts In-Stock

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SupplyDigital Components

Austria . 1,954 parts In-Stock

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Assy Fe

Spain . 1,500 parts In-Stock

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Kepictronics

USA . 792 parts In-Stock

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UHIMA Technologies

Türkiye . 702 parts In-Stock

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Corohmni

South Africa . 343 parts In-Stock

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Overview

Enhance your communication capabilities with the MC68194FJ modem by Onsemi. Crafted with precision and reliability in mind, this modem offers unmatched performance in a compact chip carrier package. Whether you're looking to optimize data transfer speeds or streamline your telecom operations, this modem is the perfect solution. Experience seamless connectivity and superior quality with the MC68194FJ, designed to exceed your expectations every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This package body material provides excellent durability and heat resistance, ensuring the modem's longevity and reliability.

Surface Mount: YES

Being surface mountable makes installation easy and efficient, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into circuit designs.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes it compatible with most power sources, reducing the need for additional converters.

No. of Terminals: 52

The high number of terminals allows for versatile connectivity options and greater functionality in the modem.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compact size and high reliability, making it ideal for high-performance applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this modem can withstand high heat environments without compromising performance.

Minimum Operating Temperature: 0 °C

The modem can operate effectively in low-temperature conditions down to 0 °C, ensuring reliability in various environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring secure connections and optimal performance.

Terminal Position: QUAD

The quad terminal position offers stable and reliable connections, reducing the risk of signal interference or loss.

Maximum Seated Height: 5.08 mm

The low maximum seated height allows for a compact and space-saving design, making it suitable for applications with limited space.

Width: 18.935 mm

The moderate width of the modem allows for easy integration into circuit layouts and ensures compatibility with standard board sizes.

Length: 18.935 mm

The length of the modem is optimized for efficient placement on a board, making it suitable for compact electronic devices.

Temperature Grade: COMMERCIAL

Designed for commercial use, this modem meets industry standards for reliability and performance in typical operating conditions.

Technology: BIPOLAR

Utilizing bipolar technology ensures efficient signal processing and reliable performance, making it suitable for high-speed data transmission.

Terminal Form: J BEND

The J bend terminal form provides mechanical strength and reliability, ensuring secure connections and minimizing the risk of signal loss.

Maximum Supply Current: 0.27 mA

Operating at a low maximum supply current of 0.27 mA helps minimize power consumption and heat generation, making it energy-efficient.

Telecom IC Type: MODEM

Being specifically designed as a modem, this telecom IC type offers optimized performance for data communication and networking applications.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5V, this modem is compatible with standard power sources and ensures stable operation.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides ample spacing for easy soldering and enhances connectivity reliability in the modem.

Data Rate: 10 Mbps

With a data rate of 10 Mbps, this modem offers high-speed data transmission capabilities, making it suitable for demanding networking applications.

Technical Specifications

Modems MC68194FJ attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

10 Mbps

JESD-30 Code:

S-CQCC-J52

JESD-609 Code:

e0

Length:

18.935 mm

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC52,.8SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Modems

Maximum Supply Current:

.27 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Telecom IC Type:

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

18.935 mm

Trade Compliance

MC68194FJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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