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TDA5051AT

NXP Semiconductors

TDA5051AT by NXP Semiconductors

TDA5051AT by NXP Semiconductors is a 16-terminal modem IC with 5V supply voltage, operating at 0-70°C. It features a data rate of 0.0012 Mbps and consumes 0.068 mA current. Ideal for telecom applications, this CMOS technology-based device comes in a small outline package for surface mounting.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,477 parts In-Stock

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Digiode

USA . 2,468 parts In-Stock

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Vyrian

USA . 1,025 parts In-Stock

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ComSIT Distribution GmbH

Germany . 25 parts In-Stock

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Speed Components Ltd

Israel . 14 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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Corohmni

South Africa . 16 parts In-Stock

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$6.841

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Aztec Data Supply Inc.

USA . 1,562 parts In-Stock

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$12.470

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AZTECH Wire

Italy . 785 parts In-Stock

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Semicontronic

India . 1,065 parts In-Stock

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$331.000

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$322.725

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$321.070

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One Stop Electronics

USA . 1,297 parts In-Stock

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$450.000

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Ampacity Inc.

Singapore . 748 parts In-Stock

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UNI Independent Distributors

Spain . 7,669 parts In-Stock

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Lixinc

USA . 4,324 parts In-Stock

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Continental Prestige Electronics

USA . 2,537 parts In-Stock

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Corphita

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Argo Parts USA

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience seamless and reliable data communication with the TDA5051AT by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors ensures top-notch quality and performance in their modems. Ideal for various applications, this modem offers customers unparalleled value and benefits. From its compact design to its low power consumption, the TDA5051AT delivers efficiency and convenience. Upgrade your communication systems with this innovative solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, ideal for a wide range of applications.

Surface Mount: YES

This modem is easy to install and can be mounted on the surface of a PCB, saving space and reducing assembly time.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into existing electronic systems and layouts.

Power Supplies (V): 5

With a 5V power supply, this modem can easily be powered by most standard electronic devices, making it versatile and convenient.

No. of Terminals: 16

The modem's 16 terminals allow for multiple connections and interfaces, enabling seamless communication with other devices.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic designs.

Maximum Operating Temperature: 70 °C

The modem can operate at temperatures up to 70°C, ensuring reliable performance even in harsh environments.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this modem is suitable for use in a wide range of temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance, ensuring a reliable connection.

Terminal Position: DUAL

The dual terminal position allows for flexibility in installation and connection options, making the modem adaptable to various setups.

Maximum Seated Height: 2.65 mm

The low maximum seated height of 2.65 mm enables the modem to be installed in tight spaces without sacrificing performance.

Width: 7.5 mm

The compact width of the modem makes it suitable for use in small electronic devices or crowded PCB layouts.

Length: 10.3 mm

With a length of 10.3 mm, this modem is space-efficient and can easily fit into compact electronic designs.

Temperature Grade: COMMERCIAL

The modem is designed for commercial use, ensuring reliable performance and compatibility with standard electronic systems.

Technology: CMOS

The CMOS technology used in this modem provides low power consumption and high-speed data processing capabilities, making it energy-efficient and fast.

Terminal Form: GULL WING

The gull wing terminal form offers a secure connection and easy soldering, ensuring a stable and reliable electrical connection.

Maximum Supply Current: 0.068 mA

The low maximum supply current of 0.068 mA makes this modem energy-efficient and suitable for battery-powered devices.

Telecom IC Type: MODEM

Specifically designed as a modem, this product is optimized for telecommunications applications, ensuring reliable data transmission.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage of this modem allows for compatibility with a wide range of electronic devices and power sources.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch provides a standard spacing for terminal connections, ensuring compatibility with common electronic components.

Data Rate: 0.0012 Mbps

With a data rate of 0.0012 Mbps, this modem can transmit data at a moderate speed, suitable for a variety of communication applications.

Technical Specifications

Modems TDA5051AT attributes and parameters. Explore more Modems devices from NXP Semiconductors

Specs

Additional Features:

DATA RATE MIN:600BPS

Data Rate:

.0012 Mbps

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Modems

Maximum Supply Current:

.068 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA5051AT Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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