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TDA5051AT/C1,512

NXP Semiconductors

TDA5051AT/C1,512 by NXP Semiconductors

NXP Semiconductors' TDA5051AT/C1,512 modem IC operates at 5V with 16 terminals in a small outline package. It features CMOS technology, peak reflow temp of 260°C, and dual terminal position. Ideal for telecom applications due to its low supply current and moisture sensitivity level of MSL3.

Median Price

$2.589

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 95 parts In-Stock

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Vyrian

USA . 4,143 parts In-Stock

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Digiode

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Flip Electronics

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Anansix

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Argo Parts USA

USA . 3,495 parts In-Stock

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Continental Prestige Electronics

USA . 3,191 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Corohmni

South Africa . 163 parts In-Stock

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$2.667

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AZTECH Wire

Italy . 636 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,449 parts In-Stock

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Microchip USA

USA . 460 parts In-Stock

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Ampacity Inc.

Singapore . 289 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 1,025 parts In-Stock

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UNI Independent Distributors

Spain . 6,624 parts In-Stock

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Corphita

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Robosynatics

Brazil . 3,236 parts In-Stock

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Lucentia Tech

USA . 3,236 parts In-Stock

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Assy Fe

Spain . 44 parts In-Stock

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Overview

Unlock seamless communication with the TDA5051AT/C1,512 by NXP Semiconductors. This high-quality modem offers unparalleled reliability and efficiency in a compact package, making it ideal for a wide range of applications. With NXP Semiconductors' reputation for excellence in semiconductor manufacturing, you can trust that this modem delivers top-notch performance. Experience the value and benefits of this innovative product, providing customers with an unmatched advantage in their communication needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the modem lightweight and durable for long-term use.

Surface Mount: Yes

Being surface mountable allows for easy integration into other electronic systems, making it convenient for applications where space is limited.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, this modem can withstand extended periods of use without overheating.

Technology: CMOS

The use of CMOS technology ensures low power consumption and efficient operation, making this modem energy-efficient and cost-effective.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5 V, this modem is compatible with standard power sources and can easily integrate into existing systems.

Technical Specifications

Modems TDA5051AT/C1,512 attributes and parameters. Explore more Modems devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Modems

Maximum Supply Current:

.068 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TDA5051AT/C1,512 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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