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TDA5051

NXP Semiconductors

TDA5051 by NXP Semiconductors

TDA5051 by NXP Semiconductors is a modem IC with 16 terminals and a small outline package style. It operates at temperatures ranging from 0 to 70 °C and has a data rate of 0.0012 Mbps. This telecom IC is commonly used in various communication applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 1,046 parts In-Stock

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1,046

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Nova Conductors

Japan . 870 parts In-Stock

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870

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Digiode

USA . 525 parts In-Stock

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525

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Anansix

USA . 460 parts In-Stock

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460

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ABC Electronics Ltd.

UK . 1 parts In-Stock

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AZTECH Wire

Italy . 732 parts In-Stock

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$12.011

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$12.011

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Corohmni

South Africa . 202 parts In-Stock

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$14.398

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Aztec Data Supply Inc.

USA . 3,276 parts In-Stock

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$15.190

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Ampacity Inc.

Singapore . 404 parts In-Stock

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$108.000

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One Stop Electronics

USA . 1,422 parts In-Stock

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$505.000

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Semicontronic

India . 551 parts In-Stock

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$698.000

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$680.550

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$677.060

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UNI Independent Distributors

Spain . 6,529 parts In-Stock

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Continental Prestige Electronics

USA . 1,615 parts In-Stock

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Corphita

USA . 844 parts In-Stock

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Argo Parts USA

USA . 633 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Discover the power of seamless communication with the TDA5051 by NXP Semiconductors. As a leading manufacturer in the industry, NXP guarantees top-quality modems that revolutionize connectivity. Whether you're looking to enhance your home automation system or streamline industrial applications, the TDA5051 offers unmatched reliability and efficiency. With its compact design and versatile capabilities, this modem is the perfect choice for any technology enthusiast. Say goodbye to slow data transfer rates and hello to lightning-fast connections with the TDA5051. Upgrade today and experience the difference for yourself!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - The choice of plastic/epoxy material for the package body enhances the durability and lightweight nature of the modem, making it easy to handle and transport.

Surface Mount:

YES - The surface mount feature allows for easy installation and assembly of the modem onto circuit boards, ensuring efficient integration into various devices.

No. of Functions:

1 - With a single function, this modem simplifies its purpose and operation, providing a straightforward and reliable solution for connecting to the internet or other communication networks.

Package Shape:

RECTANGULAR - The rectangular package shape optimizes space utilization, enabling seamless integration into electronic devices while maintaining an aesthetically pleasing design.

No. of Terminals:

16 - The ample number of terminals allows for effective connectivity, ensuring stable and uninterrupted data transfer between the modem and other components.

Package Style (Meter):

SMALL OUTLINE - The small outline package style contributes to the modem's compact and space-saving design, making it suitable for applications with limited board space.

Maximum Operating Temperature:

70 °C - The high maximum operating temperature ensures the modem's reliability and performance even under demanding environmental conditions, providing a stable connection for extended periods.

Minimum Operating Temperature:

0 °C - The low minimum operating temperature allows the modem to function effectively in various environments, ensuring reliable connectivity in both cold and hot climates.

Terminal Position:

DUAL - The dual-terminal position enhances the modem's flexibility and compatibility, allowing for various installation options and accommodating different circuit board layouts.

Maximum Seated Height:

2.65 mm - The modem's low maximum seated height facilitates its integration into slim and compact devices, offering design versatility without compromising performance.

Width:

7.5 mm - The modem's narrow width enhances its compatibility with space-constrained applications, providing easy integration into a wide range of electronic devices.

Length:

10.3 mm - The compact length of the modem supports its seamless integration into compact electronic products, ensuring efficient space utilization and maintaining a sleek design.

Temperature Grade:

COMMERCIAL - The modem's commercial temperature grade signifies its suitability for everyday consumer use, delivering reliable and consistent connectivity in normal operating environments.

Terminal Form:

GULL WING - The gull wing terminal form simplifies the modem's installation process, allowing for efficient soldering onto circuit boards and improving the overall reliability of the connection.

Telecom IC Type:

MODEM - The modem's specific telecom IC type highlights its dedicated functionality for telecommunication purposes, ensuring optimal performance and compatibility within communication networks.

Nominal Supply Voltage:

5 V - The modem's nominal supply voltage of 5V offers compatibility with standard power sources, facilitating easy integration into various electronic systems.

Terminal Pitch:

1.27 mm - The small terminal pitch enhances the modem's versatility for use in compact circuit board designs, ensuring compatibility with modern electronic devices.

Data Rate:

0.0012 Mbps - With a high data rate of 0.0012 Mbps, this modem provides fast and efficient data transmission, allowing for seamless internet browsing, downloads, and streaming experiences.

Technical Specifications

Modems TDA5051 attributes and parameters. Explore more Modems devices from NXP Semiconductors

Specs

Additional Features:

DATA RATE MIN:600BPS

Data Rate:

.0012 Mbps

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

TDA5051 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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