Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TDA5051 by NXP Semiconductors is a modem IC with 16 terminals and a small outline package style. It operates at temperatures ranging from 0 to 70 °C and has a data rate of 0.0012 Mbps. This telecom IC is commonly used in various communication applications.
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PLASTIC/EPOXY - The choice of plastic/epoxy material for the package body enhances the durability and lightweight nature of the modem, making it easy to handle and transport.
YES - The surface mount feature allows for easy installation and assembly of the modem onto circuit boards, ensuring efficient integration into various devices.
1 - With a single function, this modem simplifies its purpose and operation, providing a straightforward and reliable solution for connecting to the internet or other communication networks.
RECTANGULAR - The rectangular package shape optimizes space utilization, enabling seamless integration into electronic devices while maintaining an aesthetically pleasing design.
16 - The ample number of terminals allows for effective connectivity, ensuring stable and uninterrupted data transfer between the modem and other components.
SMALL OUTLINE - The small outline package style contributes to the modem's compact and space-saving design, making it suitable for applications with limited board space.
70 °C - The high maximum operating temperature ensures the modem's reliability and performance even under demanding environmental conditions, providing a stable connection for extended periods.
0 °C - The low minimum operating temperature allows the modem to function effectively in various environments, ensuring reliable connectivity in both cold and hot climates.
DUAL - The dual-terminal position enhances the modem's flexibility and compatibility, allowing for various installation options and accommodating different circuit board layouts.
2.65 mm - The modem's low maximum seated height facilitates its integration into slim and compact devices, offering design versatility without compromising performance.
7.5 mm - The modem's narrow width enhances its compatibility with space-constrained applications, providing easy integration into a wide range of electronic devices.
10.3 mm - The compact length of the modem supports its seamless integration into compact electronic products, ensuring efficient space utilization and maintaining a sleek design.
COMMERCIAL - The modem's commercial temperature grade signifies its suitability for everyday consumer use, delivering reliable and consistent connectivity in normal operating environments.
GULL WING - The gull wing terminal form simplifies the modem's installation process, allowing for efficient soldering onto circuit boards and improving the overall reliability of the connection.
MODEM - The modem's specific telecom IC type highlights its dedicated functionality for telecommunication purposes, ensuring optimal performance and compatibility within communication networks.
5 V - The modem's nominal supply voltage of 5V offers compatibility with standard power sources, facilitating easy integration into various electronic systems.
1.27 mm - The small terminal pitch enhances the modem's versatility for use in compact circuit board designs, ensuring compatibility with modern electronic devices.
0.0012 Mbps - With a high data rate of 0.0012 Mbps, this modem provides fast and efficient data transmission, allowing for seamless internet browsing, downloads, and streaming experiences.
Modems TDA5051 attributes and parameters. Explore more Modems devices from NXP Semiconductors
Additional Features:
Data Rate:
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
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Package Style (Meter):
Qualification:
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Telecom IC Type:
Temperature Grade:
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TDA5051 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Cheng-yi Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Forward International Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Nominal Breakdown Voltage: 21.05 V; Maximum Clamping Voltage: 29.2 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Terminal Finish: MATTE TIN; Maximum Operating Temperature: 200 Cel; Maximum Output Current: .15 A; JESD-609 Code: e3;
M39029/58360
Souriau
CONNECTOR ACCESSORY; Associated Military - Specifications: MIL-DTL-38999; Tool Settings: M22520/2-09; Terminal Type: CRIMP; MIL Conformity: YES; Mating Contacts: M39029/56348;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
Taiwan Semiconductor
RECTIFIER DIODE; Surface Mount: NO; Peak Reflow Temperature (C): 260; Maximum Operating Temperature: 175 Cel; JESD-609 Code: e3; No. of Elements: 1;
LL4148
Transys Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Vishay Telefunken
Yangzhou Yangjie Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Clamping Voltage: 29.2 V; Nominal Breakdown Voltage: 21.05 V; Maximum Repetitive Peak Reverse Voltage: 18 V; Polarity: BIDIRECTIONAL;
BAV99
Vishay Sprague
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138LT1G
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
FDV304P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Moisture Sensitivity Level (MSL): 1; Maximum Drain Current (ID): .46 A;
SS495ASP
Micro Switch
The Micro Switch SS495ASP is an analog circuit IC with a supply voltage range of 4.5V to 10.5V, suitable for automotive applications. Its package body material is plastic/epoxy, and it has a rectangular shape with three terminals. Operating temperature ranges from -40°C to 125°C, making it ideal for various automotive sensor and control systems.
M39029/56-351
Carlisle Interconnect Technologies
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Type: CRIMP; Removal Tools: M81969/8-06, M81969/14-02; IEC Conformity: NO; Contact Gender: FEMALE;
DS18B20
Maxim Integrated
DS18B20 by Maxim Integrated is a 12-bit digital temperature sensor with 1-Wire interface. It operates b/w -55 to 125°C, with ±0.5°C accuracy. Commonly used in applications requiring precise temperature monitoring like HVAC systems and industrial automation.
350766-1
TE Connectivity
TE Connectivity 350766-1 is a rectangular power connector with 0.25" mating contact pitch, rated for 600V and operating temperatures from -55 to 105°C. It has a durable design with POLYAMIDE insulator material, suitable for commercial applications requiring secure crimp termination in cable mounting setups.
2N7002
Dc Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; No. of Elements: 1; Terminal Form: GULL WING;
OPA2277UA
Burr-Brown Corporation
OPERATIONAL AMPLIFIER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
NDT2955
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; Package Style (Meter): SMALL OUTLINE; Maximum Drain Current (Abs) (ID): 2.5 A;
73M2901CE-IGVR/F
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE;
L-CV22AV1-E24B-D
Broadcom
Modems;
TCM3105NL
Texas Instruments
Texas Instruments' TCM3105NL modem operates at 5V with 16 terminals in a rectangular package. With a max temp of 70°C, it's ideal for commercial telecom applications. This CMOS technology device has a supply current of 12mA and terminal pitch of 2.54mm, making it suitable for various modem designs.
NCN49597C5972G
The Onsemi NCN49597C5972G is a programmable modem with 52 terminals, operating at temperatures from -25 to 80 °C. It has a supply voltage of 3.3V and low current draw of 0.08mA, suitable for telecom applications. This chip carrier package is surface mountable and designed for commercial extended temperature grade use.
CSP1037
MODEM-SUPPORT CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; JESD-609 Code: e0;
MAX2992GCB/V+T
Modems; Screening Level: AEC-Q100;
CPC5620A
IXYS Corporation
MODEM-SUPPORT CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: SSOP; Package Shape: RECTANGULAR;
TDA5051T
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
AD9970
Analog Devices
Analog Devices' AD9970 is a modem-support circuit in a square chip carrier package with 32 terminals. Operating temperature ranges from -25°C to 85°C, supporting a nominal voltage of 1.8V. Ideal for telecom applications requiring high-performance modems in compact form factors.
73K312L-IG
73K312L-IG by Texas Instruments is a modem IC with data rate of 0.0012 Mbps. It operates in industrial temperature range (-40 to 85 °C) and has 52 terminals in a square package style. Ideal for telecom applications, it features gull wing terminal form and flatpack package shape.
73K222AU-IH
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 44; Package Code: QCCJ; Package Shape: SQUARE;
73K224LS-IP
73K224LS-IP by Texas Instruments is an industrial-grade modem IC with a data rate of 0.0024 Mbps. It operates b/w -40°C to 85°C, has 22 terminals in an in-line package style, and uses through-hole terminal form. Ideal for telecom applications requiring reliable data transmission at a nominal voltage of 5V.
73K221L-IH
73K221L-IH by Texas Instruments is a modem IC with data rate of 0.0012 Mbps. It operates in industrial temperature range (-40 to 85 °C) and requires nominal voltage of 5V. This chip carrier package has 28 terminals, J bend form, and is suitable for telecom applications.
L-CFAX34-F100A-DT
TCM3105DWE
Texas Instruments TCM3105DWE is a 24-terminal modem IC with 5V supply voltage, operating b/w -40 to 85°C. It features CMOS technology, GULL WING terminals, and consumes max 16mA current. Ideal for industrial telecom applications due to its small outline package and surface mount capability.
DAC8741HRGET
DAC8741HRGET by Texas Instruments is a programmable modem used in telecom applications. It has a data rate of 0.03125 Mbps and operates at temperatures ranging from -55 to 125 °C. Its compact size, square package shape, and surface mount capability make it suitable for various electronic devices.
L-SFAX17-M24-DT
TS75C321CP
STMicroelectronics
STMicroelectronics' TS75C321CP modem IC operates at -5V to 5V, with data rate of 0.0096 Mbps. With 48 terminals in a rectangular package, it's ideal for telecom applications due to its through-hole terminal form and commercial temperature grade.
L-SFAX34-M24-DT
AD28MSP01KP
AD28MSP01KP by Analog Devices is a 44-terminal modem IC with 5V supply, operating from 0 to 70°C. It features J-bend terminals, quad position, and supports telecom circuits. The chip carrier package is square in shape, made of plastic/epoxy, and has a seated height of 4.57mm.
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TDA5051AT/C1,518
NXP Semiconductors
NXP Semiconductors' TDA5051AT/C1,518 is a 16-terminal modem IC with 5V supply voltage. Operating b/w 0-70°C, it features CMOS technology and consumes 0.068mA max current. Ideal for telecom applications, this surface-mount device in small outline package suits commercial-grade temperature requirements.
TDA5051AT/C1,512
NXP Semiconductors' TDA5051AT/C1,512 modem IC operates at 5V with 16 terminals in a small outline package. It features CMOS technology, peak reflow temp of 260°C, and dual terminal position. Ideal for telecom applications due to its low supply current and moisture sensitivity level of MSL3.
TDA5051AT/C1,118
TDA5051AT/C1,118 by NXP Semiconductors is a modem with a power supply of 5V and a max operating temperature of 70°C. It has 16 terminals in a small outline package shape and is commonly used in telecom applications.
TDA5051AT/C1,112
TDA5051AT/C1,112 by NXP Semiconductors is a modem with a power supply of 5V and a max operating temperature of 70°C. It has 16 terminals in a small outline package and is commonly used in telecom applications.
TDA5051AT
TDA5051AT by NXP Semiconductors is a 16-terminal modem IC with 5V supply voltage, operating at 0-70°C. It features a data rate of 0.0012 Mbps and consumes 0.068 mA current. Ideal for telecom applications, this CMOS technology-based device comes in a small outline package for surface mounting.
TDA5051
TDA5051AT-T
TDA5051TD
TDA5051T-T
TDA5051ATD-T
TDA5051TD-T
Supply Digital Components
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