Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
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Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TDA5051 by NXP Semiconductors is a modem IC with 16 terminals and a small outline package style. It operates at temperatures ranging from 0 to 70 °C and has a data rate of 0.0012 Mbps. This telecom IC is commonly used in various communication applications.
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PLASTIC/EPOXY - The choice of plastic/epoxy material for the package body enhances the durability and lightweight nature of the modem, making it easy to handle and transport.
YES - The surface mount feature allows for easy installation and assembly of the modem onto circuit boards, ensuring efficient integration into various devices.
1 - With a single function, this modem simplifies its purpose and operation, providing a straightforward and reliable solution for connecting to the internet or other communication networks.
RECTANGULAR - The rectangular package shape optimizes space utilization, enabling seamless integration into electronic devices while maintaining an aesthetically pleasing design.
16 - The ample number of terminals allows for effective connectivity, ensuring stable and uninterrupted data transfer between the modem and other components.
SMALL OUTLINE - The small outline package style contributes to the modem's compact and space-saving design, making it suitable for applications with limited board space.
70 °C - The high maximum operating temperature ensures the modem's reliability and performance even under demanding environmental conditions, providing a stable connection for extended periods.
0 °C - The low minimum operating temperature allows the modem to function effectively in various environments, ensuring reliable connectivity in both cold and hot climates.
DUAL - The dual-terminal position enhances the modem's flexibility and compatibility, allowing for various installation options and accommodating different circuit board layouts.
2.65 mm - The modem's low maximum seated height facilitates its integration into slim and compact devices, offering design versatility without compromising performance.
7.5 mm - The modem's narrow width enhances its compatibility with space-constrained applications, providing easy integration into a wide range of electronic devices.
10.3 mm - The compact length of the modem supports its seamless integration into compact electronic products, ensuring efficient space utilization and maintaining a sleek design.
COMMERCIAL - The modem's commercial temperature grade signifies its suitability for everyday consumer use, delivering reliable and consistent connectivity in normal operating environments.
GULL WING - The gull wing terminal form simplifies the modem's installation process, allowing for efficient soldering onto circuit boards and improving the overall reliability of the connection.
MODEM - The modem's specific telecom IC type highlights its dedicated functionality for telecommunication purposes, ensuring optimal performance and compatibility within communication networks.
5 V - The modem's nominal supply voltage of 5V offers compatibility with standard power sources, facilitating easy integration into various electronic systems.
1.27 mm - The small terminal pitch enhances the modem's versatility for use in compact circuit board designs, ensuring compatibility with modern electronic devices.
0.0012 Mbps - With a high data rate of 0.0012 Mbps, this modem provides fast and efficient data transmission, allowing for seamless internet browsing, downloads, and streaming experiences.
Modems TDA5051 attributes and parameters. Explore more Modems devices from NXP Semiconductors
Additional Features:
Data Rate:
JESD-30 Code:
Length:
No. of Functions:
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
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Package Style (Meter):
Qualification:
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Telecom IC Type:
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TDA5051 Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
AT90CAN128-16AUR
Microchip Technology
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
LM555CM
Onsemi
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
PIC18F4550-I/ML
The Microchip Technology PIC18F4550-I/ML is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring high-speed data processing and analog-to-digital conversion. With low power mode and flash ROM programmability, this chip offers efficient performance in compact designs.
SMBJ18CA
Semtech
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LL4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99-7-F
Multicomp Pro
ULN2803A
YOUTAI SEMICONDUCTOR CO LTD
BUFFER OR INVERTER BASED PERIPHERAL DRIVER; Terminal Form: GULL WING; No. of Terminals: 18; Package Code: SOP; Package Shape: RECTANGULAR; JESD-30 Code: R-PDSO-G18;
BSS138
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
Sangdest Microelectronics (Nanjing)
Vishay Telefunken
ERJ2RKF1002X
Panasonic
Panasonic's ERJ2RKF1002X is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance and operating temperature range of -55 to 155 °C.
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Philips Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel;
2N7002DWH6327XTSA1
Infineon Technologies
2N7002DWH6327XTSA1 by Infineon: N-CHANNEL FET with 60V DS Breakdown Voltage, 0.3A ID, and 3ohm RDS. Ideal for SWITCHING applications in small outline packages with GULL WING terminals.
Iskra Semic Capacitors Industry
RECTIFIER DIODE; Surface Mount: NO; No. of Phases: 1; Maximum Operating Temperature: 200 Cel; JESD-609 Code: e0; Maximum Non Repetitive Peak Forward Current: 2 A;
2N7002
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; No. of Elements: 1; Transistor Application: SWITCHING;
STM32H743ZIT6
STMicroelectronics
STM32H743ZIT6 by STMicroelectronics is a 32-bit microcontroller with integrated cache and a max supply voltage of 3.6V. It is commonly used in industrial applications, offering features such as 21 timers, CAN and USB connectivity, and low power mode.
LM2931AZ-5.0RPG
LM2931AZ-5.0RPG by Onsemi is a Fixed Positive Single Output LDO Regulator with 5V nominal output voltage and 0.1A max output current. It features a low dropout voltage of 0.6V, making it suitable for applications requiring stable power supply in temperature range from -40 to 125°C. The package style is cylindrical with matte tin terminal finish, ideal for various electronic devices needing precise voltage regulation.
DS2245-24
Maxim Integrated
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Code: SIMM; Package Shape: RECTANGULAR;
73K212L-IH
Texas Instruments
73K212L-IH by Texas Instruments is a modem IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It supports data rates up to 0.0012 Mbps, making it ideal for telecom applications.
ITC137PTR
Littelfuse
MODEM-SUPPORT CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel;
STLC7545TQFP4YTR
STMicroelectronics' STLC7545TQFP4YTR modem IC operates at 0-70 °C, with a data rate of 0.0384 Mbps. With 44 terminals in a low profile flatpack package, it supports modem applications for telecom circuits at 5V supply voltage.
ST7543CFN
ST7543CFN by STMicroelectronics is a 44-terminal modem IC with 5V supply, operating at 0-70 °C. It supports data rates up to 0.0192 Mbps and is used in telecom applications for modem-support circuits. The chip carrier package is surface-mountable, making it suitable for commercial-grade temperature environments.
73M2901-32IH/5
Analog Devices
Analog Devices' 73M2901-32IH/5 modem operates at -40 to 85 °C, with a data rate of 0.0024 Mbps. It is a surface-mount chip carrier with 32 terminals, ideal for industrial telecom applications.
CX20548-11Z
Conexant Systems
The Conexant Systems CX20548-11Z modem IC operates at 3.3V, with a data rate of 0.002 Mbps. It is a surface mount chip carrier suitable for telecom applications, featuring 16 terminals in a square package shape. This commercial-grade modem has a temperature range of 0-70°C and matte tin terminal finish.
UCB1200BE
MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;
TCM3105DWL
TCM3105DWL by Texas Instruments is a 24-terminal modem IC with 5V supply, operating b/w 0-70°C. It features CMOS technology, GULL WING terminals, and requires 12mA current. Ideal for telecom applications due to its small outline package and dual terminal position.
A5191HRTP
A5191HRTP by Onsemi is a modem IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a data rate of 0.0012 Mbps and 3.3V supply voltage, it's ideal for telecom applications requiring low-speed communication.
TS75C320CP
STMicroelectronics' TS75C320CP modem operates at 5V with a data rate of 0.0096 Mbps. This CMOS technology device has 48 terminals in an inline package, suitable for telecom applications requiring a nominal voltage of 5V and operating temperatures b/w 0-70 °C.
73K224BL-IHR/F
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR;
80RWM6050BALGI
Integrated Device Technology
MODEM; Moisture Sensitivity Level (MSL): 4; Terminal Finish: TIN SILVER COPPER; JESD-609 Code: e1; Peak Reflow Temperature (C): 245;
NE5050D
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;
TS75C962CFN-S
STMicroelectronics' TS75C962CFN-S is a 52-terminal modem IC with 0-70 °C operating temp range. It offers 0.0096 Mbps data rate at 5V supply voltage, suitable for telecom applications. The chip carrier package is surface-mountable and has a square shape, making it ideal for commercial-grade modems.
STLC7545CFN
STLC7545CFN by STMicroelectronics is a 44-terminal modem IC with 3.3/5,5 V power supplies and 0.0384 Mbps data rate. It features CMOS technology, operates b/w 0-70 °C, and is used in telecom applications for modem-support circuits.
935234750518
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 16; Package Code: SOP; Package Shape: RECTANGULAR;
12197-508-XTP
The Onsemi 12197-508-XTP modem features CMOS technology, operates at -40 to 85 °C, and has a data rate of 0.0012 Mbps. It is used in telecom applications for industrial purposes due to its 3.3V supply voltage requirement and quad terminal position.
UPD77810L
Renesas Electronics
Modems; Temperature Grade: COMMERCIAL; Terminal Form: J BEND; No. of Terminals: 68; Package Code: QCCJ; Package Shape: SQUARE;
73M2901CL-IGT/F
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 40; Package Code: LQFP; Package Shape: SQUARE;
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TDA5051AT/C1,518
NXP Semiconductors' TDA5051AT/C1,518 is a 16-terminal modem IC with 5V supply voltage. Operating b/w 0-70°C, it features CMOS technology and consumes 0.068mA max current. Ideal for telecom applications, this surface-mount device in small outline package suits commercial-grade temperature requirements.
TDA5051AT/C1,512
NXP Semiconductors' TDA5051AT/C1,512 modem IC operates at 5V with 16 terminals in a small outline package. It features CMOS technology, peak reflow temp of 260°C, and dual terminal position. Ideal for telecom applications due to its low supply current and moisture sensitivity level of MSL3.
TDA5051AT/C1,118
TDA5051AT/C1,118 by NXP Semiconductors is a modem with a power supply of 5V and a max operating temperature of 70°C. It has 16 terminals in a small outline package shape and is commonly used in telecom applications.
TDA5051AT/C1,112
TDA5051AT/C1,112 by NXP Semiconductors is a modem with a power supply of 5V and a max operating temperature of 70°C. It has 16 terminals in a small outline package and is commonly used in telecom applications.
TDA5051AT
TDA5051AT by NXP Semiconductors is a 16-terminal modem IC with 5V supply voltage, operating at 0-70°C. It features a data rate of 0.0012 Mbps and consumes 0.068 mA current. Ideal for telecom applications, this CMOS technology-based device comes in a small outline package for surface mounting.
TDA5051
TDA5051T
TDA5051AT-T
TDA5051TD
TDA5051T-T
TDA5051ATD-T
TDA5051TD-T
Supply Digital Components
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