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TDA5051AT/C1,112

NXP Semiconductors

TDA5051AT/C1,112 by NXP Semiconductors

TDA5051AT/C1,112 by NXP Semiconductors is a modem with a power supply of 5V and a max operating temperature of 70°C. It has 16 terminals in a small outline package and is commonly used in telecom applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 1,559 parts In-Stock

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1,559

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Vyrian

USA . 709 parts In-Stock

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709

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Digiode

USA . 52 parts In-Stock

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52

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Corohmni

South Africa . 367 parts In-Stock

1+ parts

$1.626

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367

$1.626

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AZTECH Wire

Italy . 886 parts In-Stock

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$6.656

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886

$6.656

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Aztec Data Supply Inc.

USA . 2,521 parts In-Stock

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$9.480

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2,521

$9.480

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Semicontronic

India . 650 parts In-Stock

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$104.000

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$101.400

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$100.880

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650

$104.000

$101.400

$100.880

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One Stop Electronics

USA . 1,286 parts In-Stock

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$353.000

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1,286

$353.000

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Ampacity Inc.

Singapore . 949 parts In-Stock

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$933.000

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949

$933.000

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Argo Parts USA

USA . 4,820 parts In-Stock

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4,820

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UNI Independent Distributors

Spain . 4,641 parts In-Stock

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Corphita

USA . 2,659 parts In-Stock

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2,659

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Continental Prestige Electronics

USA . 2,198 parts In-Stock

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2,198

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Experience the next level of connectivity with the TDA5051AT/C1,112 by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors ensures top-notch quality and reliability in every product they offer. The TDA5051AT/C1,112 is no exception. This modem is designed to revolutionize your communication capabilities, providing seamless and efficient data transmission. With its advanced features and compact design, this modem is perfect for various applications, including industrial automation, smart energy systems, and IoT devices. Upgrade your connectivity today and unlock endless possibilities with the TDA5051AT/C1,112.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making the modem easy to handle and install.

Surface Mount: YES

Being surface mountable allows for easy integration into circuit boards, saving space and facilitating efficient assembly.

Power Supplies (V): 5

Operating at a standard voltage of 5V makes this modem compatible with a wide range of power sources, ensuring reliable performance.

No. of Terminals: 16

The ample number of terminals provides flexibility in connecting the modem to other components, enabling versatile functionality.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this modem can withstand high temperature environments, ensuring reliable operation in various conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at a minimum temperature of 0 °C ensures reliable performance even in cold environments, making it suitable for use in diverse settings.

Telecom IC Type: MODEM

Being designed specifically as a modem ensures efficient communication capabilities, providing reliable data transmission and reception.

Technical Specifications

Modems TDA5051AT/C1,112 attributes and parameters. Explore more Modems devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Modems

Maximum Supply Current:

68 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

TDA5051AT/C1,112 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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