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A5191HRTL-XTP

Onsemi

A5191HRTL-XTP by Onsemi

A5191HRTL-XTP by Onsemi is a modem IC with 32 terminals, operating at -40 to 85 °C. It has power supplies of 3.3/5V and low supply current of 0.6mA. Ideal for industrial telecom applications due to its quad terminal position and gull wing form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,072 parts In-Stock

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Vyrian

USA . 144 parts In-Stock

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Problanco Electronics

Mexico . 4,803 parts In-Stock

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Kulean Microsystems

USA . 4,128 parts In-Stock

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SupplyDigital Components

Austria . 3,256 parts In-Stock

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Corphita

USA . 1,523 parts In-Stock

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Northwest PG Solutions

USA . 227 parts In-Stock

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TANS Electronics

Latvia . 218 parts In-Stock

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Native Components

USA . 132 parts In-Stock

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$4.452

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UHIMA Technologies

Türkiye . 86 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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Overview

Experience seamless connectivity with the A5191HRTL-XTP modem by Onsemi. Manufactured with precision and expertise, this modem offers reliable performance in a variety of applications. From industrial automation to telecommunications, this modem is a versatile solution that provides value and benefits to customers. Stay connected and stay ahead with the A5191HRTL-XTP by Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the modem easy to install and handle.

Surface Mount: YES

Surface mount capability allows for easy integration into circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on the circuit board.

Power Supplies (V): 3.3/5

Compatible with common power supplies, providing flexibility in power source options.

No. of Terminals: 32

Ample terminals for robust connectivity and functionality.

Package Style (Meter): FLATPACK

The flatpack style is compact and enhances thermal performance.

Maximum Operating Temperature: 85 °C

Can operate efficiently in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold conditions without malfunctions.

Terminal Position: QUAD

Quad terminal position allows for secure and stable connections.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications where temperature variations are common.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and mechanical strength.

Maximum Supply Current: 0.6 mA

Low supply current requirement for energy efficiency.

Telecom IC Type: MODEM

Specifically designed for modem applications, ensuring optimal performance.

Terminal Pitch: 0.8 mm

Fine terminal pitch for compact design and high-density packaging.

Technical Specifications

Modems A5191HRTL-XTP attributes and parameters. Explore more Modems devices from Onsemi

Specs

JESD-30 Code:

S-PQFP-G32

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Sub-Category:

Modems

Maximum Supply Current:

.6 mA

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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