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A5191HRTNG-XTD

Onsemi

A5191HRTNG-XTD by Onsemi

A5191HRTNG-XTD by Onsemi is a modem IC with CMOS technology. It operates b/w -40 to 85 °C, supporting data rates up to 0.0012 Mbps. With a compact square package and 32 terminals, it's ideal for industrial telecom applications.

Median Price

$91.080

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 1 parts In-Stock

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$91.080

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Digiode

USA . 1,091 parts In-Stock

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$86.526

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Vyrian

USA . 3,774 parts In-Stock

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Northwest PG Solutions

USA . 2 parts In-Stock

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$2.552

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AZTECH Wire

Italy . 757 parts In-Stock

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$20.310

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Corphita

USA . 1,042 parts In-Stock

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$81.972

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Corohmni

South Africa . 494 parts In-Stock

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TANS Electronics

Latvia . 6,107 parts In-Stock

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SupplyDigital Components

Austria . 4,990 parts In-Stock

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Problanco Electronics

Mexico . 4,570 parts In-Stock

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Kulean Microsystems

USA . 3,880 parts In-Stock

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Native Components

USA . 653 parts In-Stock

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Perfect Parts

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Microchip USA

USA . 368 parts In-Stock

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UHIMA Technologies

Türkiye . 151 parts In-Stock

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Overview

Elevate your communication capabilities with the A5191HRTNG-XTD by Onsemi. As a leading manufacturer in the industry, Onsemi offers top-quality modems with advanced technology and industrial-grade performance. This modem is perfect for a wide range of applications, providing reliable connectivity and seamless data transmission. Experience the value and benefits of this product as it enhances your communication systems with its high-speed data rate and cutting-edge features. Upgrade to Onsemi for superior quality and unmatched reliability in your communication solutions.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient installation, making this modem convenient for use in various applications.

Package Shape: SQUARE

The square package shape provides stability and compactness, making it suitable for space-constrained environments.

No. of Terminals: 32

With a high number of terminals, this modem can handle complex data transfer and connectivity requirements.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability and resilience in demanding operating conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature expands the range of environments in which this modem can operate effectively.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim and compact design, ideal for space-saving installations.

Technology: CMOS

CMOS technology offers low power consumption and high performance, making this modem energy-efficient and reliable.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is commonly used in electronic systems, ensuring compatibility and ease of integration.

Data Rate: 0.0012 Mbps

The data rate of 0.0012 Mbps provides sufficient speed for a wide range of applications, making this modem versatile and efficient.

Technical Specifications

Modems A5191HRTNG-XTD attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-XQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

A5191HRTNG-XTD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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