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A5191HRTNG-XTP

Onsemi

A5191HRTNG-XTP by Onsemi

A5191HRTNG-XTP by Onsemi is a modem IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V, data rate of 0.0012 Mbps, and CMOS technology. Ideal for industrial applications requiring low power consumption and compact design in telecom equipment.

Median Price

$4.560

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,000 parts In-Stock

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$2.755

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5,000

$2.755

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DigiKey

USA . 9,050 parts In-Stock

1+ parts

$4.560

100+ parts

$3.432

1k+ parts

$3.014

10k+ parts

$2.766

9,050

$4.560

$3.432

$3.014

$2.766

Mouser Electronics

USA . 3,779 parts In-Stock

1+ parts

$4.560

100+ parts

$3.440

1k+ parts

$2.810

10k+ parts

$2.610

3,779

$4.560

$3.440

$2.810

$2.610

Verical

USA . 5,000 parts In-Stock

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Digiode

USA . 1,274 parts In-Stock

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$4.750

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$4.750

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Vyrian

USA . 18,422 parts In-Stock

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VNN

France . 4,038 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Semicontronic

India . 18,382 parts In-Stock

1+ parts

$2.170

100+ parts

$2.116

1k+ parts

$2.105

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-

18,382

$2.170

$2.116

$2.105

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Ampacity Inc.

Singapore . 18,076 parts In-Stock

1+ parts

$2.170

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18,076

$2.170

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Corphita

USA . 1,500 parts In-Stock

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$4.500

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$4.500

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Corohmni

South Africa . 471 parts In-Stock

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$5.000

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471

$5.000

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Advanced Electronics

New Zealand . 40 parts In-Stock

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$15.023

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$14.271

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$14.271

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40

$15.023

$14.271

$14.271

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Aztec Data Supply Inc.

USA . 3,933 parts In-Stock

1+ parts

$16.910

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3,933

$16.910

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Microchip USA

USA . 5,935 parts In-Stock

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$19.420

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$19.420

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RC Electronics

USA . 8,270 parts In-Stock

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Lixinc

USA . 7,816 parts In-Stock

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Problanco Electronics

Mexico . 7,019 parts In-Stock

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Kepictronics

USA . 5,980 parts In-Stock

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TANS Electronics

Latvia . 1,827 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,791 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,194 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Authorized Procurement Solutions

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Continental Prestige Electronics

USA . 496 parts In-Stock

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Kulean Microsystems

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Argo Parts USA

USA . 316 parts In-Stock

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UHIMA Technologies

Türkiye . 214 parts In-Stock

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SupplyDigital Components

Austria . 149 parts In-Stock

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Overview

Unlock seamless and reliable connectivity with the A5191HRTNG-XTP by Onsemi, a leading manufacturer in the modem category. This cutting-edge product offers unparalleled performance and versatility, making it perfect for a wide range of applications. With its advanced technology and industrial-grade construction, this modem ensures high-quality data transmission and efficiency. Experience the value and benefits of Onsemi's A5191HRTNG-XTP and elevate your communication needs to the next level.

Feature Benefit Bullets

Surface Mount: YES

This modem can easily be mounted on circuit boards, making it convenient for assembly and integration into various devices.

Package Shape: SQUARE

The square shape of this modem allows for efficient use of space on a circuit board, ideal for compact designs.

Power Supplies (V): 3.3/5

With multiple power supply options, this modem can be easily integrated into different systems without requiring additional components.

No. of Terminals: 32

The high number of terminals allows for seamless connectivity and communication with other components within a system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The unique package style of this modem ensures efficient heat dissipation and a slim profile for space-saving designs.

Maximum Operating Temperature: 85 °C

This modem can operate effectively in high-temperature environments, ensuring reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

With a wide range of operating temperatures, this modem can withstand extreme cold environments, making it versatile for different applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability, ensuring a reliable connection for the modem on the circuit board.

Terminal Position: QUAD

The quad terminal position allows for easy identification and connection of the modem within a system, simplifying installation and maintenance.

Maximum Seated Height: 1 mm

The low seated height of this modem makes it suitable for slim devices or applications with limited space for components.

Width: 5 mm

The compact width of this modem enables it to fit into tight spaces on a circuit board, ideal for designs with size constraints.

Technical Specifications

Modems A5191HRTNG-XTP attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Modems

Maximum Supply Current:

.0006 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

A5191HRTNG-XTP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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