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A5191HRTPG-XTP

Onsemi

A5191HRTPG-XTP by Onsemi

A5191HRTPG-XTP by Onsemi is a modem IC with 28 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V, data rate of 0.0012 Mbps, and operates in industrial temperature grade applications. The chip carrier package style with matte tin finish is suitable for surface mount assembly in various electronic devices.

Median Price

$9.308

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 474 parts In-Stock

1+ parts

$8.460

100+ parts

$6.412

1k+ parts

$6.092

10k+ parts

-

474

$8.460

$6.412

$6.092

-

Chip1Stop

Japan . 300 parts In-Stock

1+ parts

$9.250

100+ parts

$5.680

1k+ parts

-

10k+ parts

-

300

$9.250

$5.680

-

-

Mouser Electronics

USA . 27 parts In-Stock

1+ parts

$9.550

100+ parts

$6.750

1k+ parts

$5.610

10k+ parts

-

27

$9.550

$6.750

$5.610

-

Master Electronics

USA . 750 parts In-Stock

1+ parts

$35.330

100+ parts

$7.160

1k+ parts

$6.710

10k+ parts

-

750

$35.330

$7.160

$6.710

-

Verical

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$9.308

1k+ parts

-

10k+ parts

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750

-

$9.308

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$6.904

100+ parts

-

1k+ parts

-

10k+ parts

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10

$6.904

-

-

-

Digiode

USA . 1,281 parts In-Stock

1+ parts

$8.788

100+ parts

-

1k+ parts

-

10k+ parts

-

1,281

$8.788

-

-

-

IBS Electronics

USA . 1,500 parts In-Stock

1+ parts

$49.462

100+ parts

$10.024

1k+ parts

$9.394

10k+ parts

-

1,500

$49.462

$10.024

$9.394

-

Chip Stock

USA . 19,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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19,500

-

-

-

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Avant Electronics Limited

UK . 1,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,749

-

-

-

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Vyrian

USA . 485 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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485

-

-

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Sensible Micro Corp

USA . 359 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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359

-

-

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ComSIT Distribution GmbH

Germany . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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200

-

-

-

-

LWI Electronics Inc

India . 79 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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79

-

-

-

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NexGen Digital

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 407 parts In-Stock

1+ parts

$6.368

100+ parts

-

1k+ parts

-

10k+ parts

-

407

$6.368

-

-

-

Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

$6.904

100+ parts

$6.559

1k+ parts

-

10k+ parts

$6.145

300

$6.904

$6.559

-

$6.145

Corphita

USA . 2,391 parts In-Stock

1+ parts

$8.325

100+ parts

-

1k+ parts

-

10k+ parts

-

2,391

$8.325

-

-

-

Corohmni

South Africa . 126 parts In-Stock

1+ parts

$9.250

100+ parts

-

1k+ parts

-

10k+ parts

-

126

$9.250

-

-

-

Microchip USA

USA . 2,927 parts In-Stock

1+ parts

$18.060

100+ parts

$17.800

1k+ parts

$17.670

10k+ parts

$17.540

2,927

$18.060

$17.800

$17.670

$17.540

Perfect Parts

USA . 33,398 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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33,398

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-

-

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Lixinc

USA . 11,575 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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11,575

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-

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RC Electronics

USA . 6,863 parts In-Stock

1+ parts

-

100+ parts

$8.210

1k+ parts

$7.490

10k+ parts

$7.260

6,863

-

$8.210

$7.490

$7.260

Kulean Microsystems

USA . 5,085 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,085

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-

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Continental Prestige Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

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-

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Kepictronics

USA . 5,000 parts In-Stock

1+ parts

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5,000

-

-

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TANS Electronics

Latvia . 3,267 parts In-Stock

1+ parts

-

100+ parts

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3,267

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-

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Problanco Electronics

Mexico . 2,900 parts In-Stock

1+ parts

-

100+ parts

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2,900

-

-

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Argo Parts USA

USA . 2,691 parts In-Stock

1+ parts

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100+ parts

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2,691

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-

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S.R.D Solutions

India . 2,258 parts In-Stock

1+ parts

-

100+ parts

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2,258

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-

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A-Z Elektronik GmbH

Germany . 1,800 parts In-Stock

1+ parts

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100+ parts

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1,800

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-

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Alle Elektronik GmbH

Germany . 1,200 parts In-Stock

1+ parts

-

100+ parts

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1,200

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-

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

-

-

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SupplyDigital Components

Austria . 633 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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633

-

-

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Glotronic Ltd.

UK . 600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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600

-

-

-

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UHIMA Technologies

Türkiye . 411 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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411

-

-

-

-

Overview

Experience unmatched performance and reliability with the A5191HRTPG-XTP by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge modems like no other. Ideal for a wide range of applications, this modem offers exceptional value, benefits, and advantages to customers. Trust Onsemi to provide top-quality products that exceed expectations and elevate your projects to new heights. Elevate your connectivity experience with the A5191HRTPG-XTP by Onsemi today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the modem.

Surface Mount:

YES - Allows for easy installation and space-saving on circuit boards.

Package Shape:

SQUARE - Helps with efficient layout and placement on PCBs.

Power Supplies (V):

3.3/5 - Provides flexibility for various power supply options.

No. of Terminals:

28 - Offers ample connections for interfacing with other components.

Package Style (Meter):

CHIP CARRIER - Ensures a compact and efficient design for the modem.

Maximum Operating Temperature:

85 °C - Allows for reliable operation under various environmental conditions.

Minimum Operating Temperature:

40 °C - Ensures the modem can function in extreme temperatures.

Terminal Finish:

MATTE TIN - Enhances solderability and electrical conductivity for terminals.

Terminal Position:

QUAD - Facilitates easy soldering and connection to the circuit.

Maximum Seated Height:

4.572 mm - Contributes to a low-profile design for space-constrained applications.

Width:

11.506 mm - Helps in determining the size and footprint of the modem on the PCB.

Maximum Time At Peak Reflow Temperature (s):

30 - Reflects the reliability of the modem during manufacturing processes.

Peak Reflow Temperature °C:

260 - Indicates the temperature tolerance of the modem during soldering.

Length:

11.506 mm - Aids in understanding the dimensions and placement of the modem on the PCB.

Temperature Grade:

INDUSTRIAL - Suitable for use in industrial environments with varying temperatures.

Technology:

CMOS - Provides efficient power consumption and performance for the modem.

Terminal Form:

J BEND - Helps in easier soldering and mechanical stability of the connections.

Maximum Supply Current:

0.0006 mA - Indicates low power consumption for efficient operation.

Telecom IC Type:

MODEM - Specifically designed for telecommunication applications.

Nominal Supply Voltage:

3.3 V - Standard voltage supply for the modem's operation.

Terminal Pitch:

1.27 mm - Ideal spacing between terminals for ease of soldering and connection.

Data Rate:

0.0012 Mbps - Indicates the high-speed data transmission capability of the modem.

Moisture Sensitivity Level (MSL):

3 - Ensures reliability and performance under humid conditions.

Technical Specifications

Modems A5191HRTPG-XTP attributes and parameters. Explore more Modems devices from Onsemi

Specs

Data Rate:

.0012 Mbps

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e3

Length:

11.506 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.572 mm

Sub-Category:

Modems

Maximum Supply Current:

.0006 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11.506 mm

Trade Compliance

A5191HRTPG-XTP Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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