Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi 11564-502-XTD modem IC features a plastic/epoxy package, dual terminal position, and CMOS technology. With 24 terminals in a small outline style, it operates on 3/5V power supplies. Ideal for telecom applications as a modem-demodulator with surface mount capability.
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Corohmni
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Plastic/Epoxy material makes the modem lightweight and durable, ideal for portable or long-lasting use.
Surface mount capability makes installation and assembly easy, saving time and effort.
Rectangular shape allows for efficient placement and fitting into various electronic devices.
Support for multiple power supply options allows for greater flexibility in powering the modem.
Higher number of terminals enable more connectivity options and complex functionalities to be supported.
Small outline package style saves space and is suitable for compact designs.
Tin lead terminal finish provides good conductivity and solderability for reliable connections.
Dual terminal position offers redundancy and better signal transmission for improved performance.
CMOS technology ensures low power consumption, high speed, and compatibility with various systems.
Gull wing terminal form enables easy surface mounting and ensures strong mechanical connection.
Modem-demodulator IC type indicates the modem's functionality in transmitting and receiving data signals efficiently.
Small terminal pitch allows for high-density mounting and precise alignment of terminals on the PCB.
Modems 11564-502-XTD attributes and parameters. Explore more Modems devices from Onsemi
JESD-30 Code:
JESD-609 Code:
No. of Functions:
No. of Terminals:
Package Body Material:
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Package Equivalence Code:
Package Shape:
Package Style (Meter):
Power Supplies (V):
Qualification:
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Telecom IC Type:
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11564-502-XTD Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
C0805C104K5RACTU
KEMET Corporation
KEMET C0805C104K5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for surface mount applications in electronics requiring compact size and reliable performance.
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
SMBJ18CA
Telefunken Microelectronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STMicroelectronics
LM358M
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
0460-202-16141
TE Connectivity
TE Connectivity's 0460-202-16141 contact features a crimp terminal type, machined contact design, and rated AC voltage of 1500V. With a wire gauge range of 20-16 AWG, it is ideal for applications requiring a male round pin-socket contact style in assembly products.
Taitron Components
1N4148
Weitronic Enterprise
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
LM358AN
Signetics
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
Teledyne Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JESD-30 Code: R-PDSO-G3; Maximum Operating Temperature: 150 Cel; No. of Terminals: 3;
M85049/85-08W02
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
MBRS340T3G
Onsemi
MBRS340T3G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.5V and output current of 4A. It operates b/w -65°C to 150°C, making it suitable for various applications requiring high-speed switching and low power loss in a small outline package. The diode's matte tin terminal finish and dual position make it ideal for surface mount PCB designs.
ERJ2RKF1002X
Panasonic
Panasonic's ERJ2RKF1002X is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance and operating temperature range of -55 to 155 °C.
PAP-06V-S
J S T Mfg
PAP-06V-S by J S T Mfg is a 6-contact BOARD CONNECTOR with 94V-0 UL Flammability Code. It has FEMALE contacts, CRIMP termination, and comes WITH CABLE ASSEMBLY for CABLE mounting applications.
Itt Semiconductor
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
BAV99W-7-F
Diodes Incorporated
Diodes Incorporated BAV99W-7-F is a fast recovery rectifier diode with 2 elements in series connected, center tap configuration. It has a max reverse recovery time of 0.004 us and can handle a max output current of 0.15 A. Ideal for applications requiring fast switching capabilities and operating temperatures ranging from -65 to 150 °C.
73K222BL-IHR
Maxim Integrated
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR;
SI3015-F-FS
Silicon Labs
SI3015-F-FS by Silicon Labs is a modem IC with 16 terminals, operating at 3.3V/5V and data rate of 0.0024 Mbps. It is used in telecom applications, featuring a small outline package style and Gull Wing terminal form for commercial temperature grade operation up to 70°C.
73K224L-28IHR/F
MODEM; Terminal Form: J BEND; No. of Terminals: 28; Package Code: QCCJ; Package Shape: SQUARE; Minimum Operating Temperature: -40 Cel;
AD1801JST-REEL
Analog Devices
AD1801JST-REEL by Analog Devices is a modem IC with 128 terminals in a flatpack, low profile package. Operating b/w 0-85°C, it supports data rates up to 1.4 Mbps at a supply voltage of 5V. Ideal for telecom applications requiring data/fax/voice modulation and demodulation.
AD28MSP01
AD28MSP01 by Analog Devices is a 28-terminal modem with 5V power supply, operating from 0 to 70°C. Its PLASTIC/EPOXY package in RECTANGULAR shape features IN-LINE style and Tin/Lead finish. Ideal for commercial applications requiring reliable data transmission at nominal 5V supply voltage.
AD28MSP01KR
AD28MSP01KR by Analog Devices is a 28-terminal modem IC with 5V supply, operating from 0 to 70°C. It features GULL WING terminals in a SMALL OUTLINE package, suitable for telecom applications requiring MODEM-SUPPORT CIRCUIT.
ST75C540FP-A
ST75C540FP-A by STMicroelectronics is a 80-terminal modem IC with 5V supply voltage, operating b/w 0-70 °C. It supports fax rate of 14.4 kbps and data rate of 0.0144 Mbps, making it ideal for data/fax/voice applications in telecom systems.
L-SFAX17L-M24-D
Broadcom
Modems;
L-SV92EX-M32-D
NCN49597C5972G
The Onsemi NCN49597C5972G is a programmable modem with 52 terminals, operating at temperatures from -25 to 80 °C. It has a supply voltage of 3.3V and low current draw of 0.08mA, suitable for telecom applications. This chip carrier package is surface mountable and designed for commercial extended temperature grade use.
L-SV92USV2-T48C-DT
L-SV92EX-M32-DT
TRF3520PFB
Texas Instruments
TRF3520PFB by Texas Instruments is a modem IC with 48 terminals in a square package. Operating temperature range from -40 to 85°C makes it suitable for industrial use. With a nominal voltage of 3.75V, this thin profile flatpack is ideal for telecom applications.
EF7910JL
STMicroelectronics' EF7910JL modem operates at 0-70 °C, with ±5V power supplies and -5V nominal negative supply voltage. With a data rate of 0.0012 Mbps, it is ideal for telecom applications requiring a 5V nominal voltage and 125mA max supply current.
ST7554TQF7
ST7554TQF7 by STMicroelectronics is a modem IC with 48 terminals, operating at 5V. It features a data rate of 0.056 Mbps and is designed for telecom applications requiring data/fax/voice modulation. The IC has a low profile flatpack package style, suitable for commercial temperature grades from 0 to 70 °C.
CSP1040A3-E11-DT
AMIS30585AGA
AMIS30585AGA by Onsemi is a 28-terminal modem IC with 3.3V supply voltage, 0.08mA max current, and 0.00144 Mbps data rate. It operates b/w -25 °C to 70°C, suitable for telecom applications requiring surface mount square chip carrier package.
AD5700-1BCPZ-RL7
AD5700-1BCPZ-RL7 by Analog Devices is a modem IC with 24 terminals in a square chip carrier package. Operating from -40 to 125°C, it has a nominal voltage of 2.7V and terminal pitch of 0.5mm. Ideal for telecom applications, this modem IC is surface mountable and has a very thin profile design.
A5191HRTP
A5191HRTP by Onsemi is a modem IC with 28 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a data rate of 0.0012 Mbps and 3.3V supply voltage, it's ideal for telecom applications requiring low-speed communication.
TMS99532ANL
TMS99532ANL by Texas Instruments is a MOS modem IC with 18 terminals in an in-line package. It operates b/w 0°C to 70°C, suitable for commercial applications. The rectangular plastic/epoxy package style with dual terminal position and 2.54mm pitch makes it ideal for telecom equipment.
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11564-502-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 3/5;
11564-503-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Qualification: Not Qualified;
11564-503-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; JESD-609 Code: e0;
11564-504-XTD
11564-504-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
11564-502-XTD
Ami Semiconductor
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Technology: CMOS;
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE;
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