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11564-502-XTD

Onsemi

11564-502-XTD by Onsemi

The Onsemi 11564-502-XTD modem IC features a plastic/epoxy package, dual terminal position, and CMOS technology. With 24 terminals in a small outline style, it operates on 3/5V power supplies. Ideal for telecom applications as a modem-demodulator with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,557 parts In-Stock

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1,557

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Vyrian

USA . 1,369 parts In-Stock

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1,369

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 537 parts In-Stock

1+ parts

$0.723

100+ parts

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537

$0.723

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Northwest PG Solutions

USA . 2,353 parts In-Stock

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$0.795

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2,353

$0.795

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SupplyDigital Components

Austria . 6,367 parts In-Stock

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6,367

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TANS Electronics

Latvia . 6,293 parts In-Stock

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6,293

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Problanco Electronics

Mexico . 5,376 parts In-Stock

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5,376

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Corphita

USA . 693 parts In-Stock

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693

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UHIMA Technologies

Türkiye . 490 parts In-Stock

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490

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Corohmni

South Africa . 333 parts In-Stock

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333

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Kulean Microsystems

USA . 94 parts In-Stock

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94

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Overview

Enhance your communication experience with the 11564-502-XTD by Onsemi. Crafted with precision and reliability in mind, this modem is designed to deliver seamless connectivity and optimal performance. Whether you're looking to enhance your home entertainment setup or streamline your office operations, this modem is the perfect solution for all your communication needs. Trust in the quality and expertise of Onsemi to bring you a product that exceeds expectations and provides unmatched value. Upgrade your connectivity today with the 11564-502-XTD and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the modem lightweight and durable, ideal for portable or long-lasting use.

Surface Mount: YES

Surface mount capability makes installation and assembly easy, saving time and effort.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and fitting into various electronic devices.

Power Supplies (V): 3/5

Support for multiple power supply options allows for greater flexibility in powering the modem.

No. of Terminals: 24

Higher number of terminals enable more connectivity options and complex functionalities to be supported.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is suitable for compact designs.

Terminal Finish: TIN LEAD

Tin lead terminal finish provides good conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position offers redundancy and better signal transmission for improved performance.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and compatibility with various systems.

Terminal Form: GULL WING

Gull wing terminal form enables easy surface mounting and ensures strong mechanical connection.

Telecom IC Type: MODEM-DEMODULATOR

Modem-demodulator IC type indicates the modem's functionality in transmitting and receiving data signals efficiently.

Terminal Pitch: 1.27 mm

Small terminal pitch allows for high-density mounting and precise alignment of terminals on the PCB.

Technical Specifications

Modems 11564-502-XTD attributes and parameters. Explore more Modems devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

Sub-Category:

Other Telecom ICs

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

11564-502-XTD Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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