Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi 11564-503-XTP modem-demodulator IC features CMOS technology, with a power supply of 3/5V and 32 terminals in a square flatpack package. Ideal for telecom applications, this surface-mount device has a terminal pitch of 0.8mm and Gull Wing terminal form.
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Corohmni
The use of plastic/epoxy as the package body material ensures a lightweight and durable construction, making the modem easy to handle and long-lasting.
The surface mount feature allows for easy and convenient installation on circuit boards, saving space and simplifying assembly processes.
The square package shape provides a compact design, enabling efficient placement and integration within electronic devices.
The availability of power supply options at 3V and 5V ensures compatibility with a wide range of devices, offering flexibility in usage scenarios.
With 32 terminals, the modem can accommodate multiple connections and interfaces, enhancing connectivity and functionality.
The flatpack package style provides a low profile design, facilitating space-saving installations in compact electronic setups.
The tin lead terminal finish offers excellent solderability and conductivity, ensuring reliable connections for optimal performance.
The quad terminal position allows for organized and streamlined connections, reducing the risk of errors and improving overall usability.
The CMOS technology utilized in the modem enables low power consumption and high-speed operation, promoting energy efficiency and performance.
The gull wing terminal form offers secure attachment and easy handling during installation, contributing to the reliability and user-friendliness of the product.
The modem-demodulator telecom IC type indicates versatile functionality for data transmission and reception, making the modem suitable for diverse communication applications.
The 0.8 mm terminal pitch allows for precise and compact arrangement of terminals, optimizing connectivity and ensuring efficient signal transmission.
Modems 11564-503-XTP attributes and parameters. Explore more Modems devices from Onsemi
JESD-30 Code:
JESD-609 Code:
No. of Functions:
No. of Terminals:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Power Supplies (V):
Qualification:
Sub-Category:
Surface Mount:
Technology:
Telecom IC Type:
Terminal Finish:
Terminal Form:
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Terminal Position:
11564-503-XTP Telecommunications trade compliance attributes, and parameters.
HTS
8542.39.00.01
SB
8542.39.00.00
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1554216002
Molex
WIRE AND CABLE;
1N4148
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Config: SINGLE;
M24308/2-1F
Adi Electronics
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; MIL Conformity: YES; Filter Feature: NO; Mating Info.: MULTIPLE MATING PARTS AVAILABLE;
BSS138
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
BAV99
MICRODIODE ELECTRONICS SHENZHEN CO LTD
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/58-360
CONNECTOR ACCESSORY; Alternate Contact Sources: MILITARY; Removal Tool Sources: MILITARY; Material: COPPER ALLOY; National Stock Number (NSN): 5999004733551; Mating Contacts: M39029/56-348, M39029/57-354;
Comchip Technology
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
EU2B-YS3203F
Idec
ROTARY SWITCH;
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
Tyco Electronics Amp
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; IEC Conformity: NO; Mixed Contacts: NO; Empty Shell: NO;
FDD5614P
Onsemi
FDD5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 45A IDM and 0.1 ohm RDS(ON), operating in ENHANCEMENT MODE at up to 175°C. The PLASTIC/EPOXY package with GULL WING terminals ensures efficient heat dissipation and reliable performance.
2N2222A
Central Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Transistor Application: SWITCHING; Transistor Element Material: SILICON;
Jiangsu Changjiang Electronics Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Operating Mode: ENHANCEMENT MODE; Transistor Application: SWITCHING;
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
International Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
RC0603FR-071KL
Yageo
Yageo's RC0603FR-071KL is a fixed resistor with 1000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. Ideal for surface mount applications in electronics, it operates b/w -55 to 155 °C with a temperature coefficient of 100 ppm/°C.
DAC8741HRGET
Texas Instruments
DAC8741HRGET by Texas Instruments is a programmable modem used in telecom applications. It has a data rate of 0.03125 Mbps and operates at temperatures ranging from -55 to 125 °C. Its compact size, square package shape, and surface mount capability make it suitable for various electronic devices.
ST7538P
STMicroelectronics
ST7538P by STMicroelectronics is a low-profile modem designed for industrial applications, operating b/w -40 °C and 85°C. It features a nominal voltage of 5V, with a data rate of 0.0048 Mbps and comes in a compact 10mm x 10mm package. Its robust design ensures reliable performance in demanding environments.
SI2456-FT
Silicon Labs
SI2456-FT by Silicon Labs is a modem IC with 24 terminals, operating at 0-70°C. It has a data rate of 0.056 Mbps and runs on a 3.3V supply voltage. Ideal for telecom applications, this small outline package with gull wing terminals suits surface mount designs.
MAX2990ECB+T
Maxim Integrated
MODEM; Maximum Time At Peak Reflow Temperature (s): 30; Terminal Finish: MATTE TIN; Moisture Sensitivity Level (MSL): 3; Peak Reflow Temperature (C): 260; JESD-609 Code: e3;
73K222AU-IH
Analog Devices
73K222AU-IH by Analog Devices is a modem IC with 44 terminals in a square chip carrier package. It operates b/w -40 to 85 °C, suitable for industrial use. With a data rate of 0.0012 Mbps, it is ideal for telecom applications.
CYG2021
Ixys Integrated Circuits Division
MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: PIN/PEG; No. of Terminals: 10; Package Code: DIP; Package Shape: RECTANGULAR;
DS2245ML-24
MODEM; Temperature Grade: COMMERCIAL; Terminal Form: NO LEAD; No. of Terminals: 30; Package Code: SIMM; Package Shape: RECTANGULAR;
BCM3349KPB
Broadcom
Modems;
A5191HRTNG-XTP
A5191HRTNG-XTP by Onsemi is a modem IC with 32 terminals, operating at -40 to 85°C. It has a supply voltage of 3.3V, data rate of 0.0012 Mbps, and CMOS technology. Ideal for industrial applications requiring low power consumption and compact design in telecom equipment.
ITC135P
Littelfuse
The Littelfuse ITC135P modem IC supports circuits, with 16 terminals in a small outline package. It operates b/w -40°C to 85°C, featuring gull wing terminals and a rectangular shape for surface mounting applications. Dimensions are 10.16mm x 7.493mm x 2.21mm (LxWxH).
73K324BL-IH/F
MODEM; Temperature Grade: INDUSTRIAL; Terminal Form: J BEND; No. of Terminals: 32; Package Code: QCCJ; Package Shape: RECTANGULAR;
TRF3520PFB
TRF3520PFB by Texas Instruments is a modem IC with 48 terminals in a square package. Operating temperature range from -40 to 85°C makes it suitable for industrial use. With a nominal voltage of 3.75V, this thin profile flatpack is ideal for telecom applications.
935288611551
NXP Semiconductors
MODEM-DEMODULATOR; Terminal Form: NO LEAD; No. of Terminals: 40; Package Code: HVQCCN; Package Shape: SQUARE; Length: 6 mm;
DS2245
Analog Devices' DS2245 modem operates at 5V with 30 terminals, suitable for commercial-grade applications. With a temperature range of 0-70 °C, it uses CMOS technology and TIN LEAD finish, making it ideal for telecom systems requiring a 2.54mm terminal pitch.
73M2901CE-IGVR/F
Analog Devices' 73M2901CE-IGVR/F modem operates at -40 to 85 °C, with a supply voltage of 3/3.3V and max current of 15.5mA. This telecom IC in a square flatpack package is ideal for industrial applications requiring surface mount modems with 32 terminals.
AD1801JST
AD1801JST by Analog Devices is a modem IC with 128 terminals in a flatpack, low profile package. Operating temperature range of 0-85°C, data rate up to 1.4 Mbps, suitable for telecom applications requiring data/fax/voice modulation.
AD9970
Analog Devices' AD9970 is a modem-support circuit in a square chip carrier package with 32 terminals. Operating temperature ranges from -25°C to 85°C, supporting a nominal voltage of 1.8V. Ideal for telecom applications requiring high-performance modems in compact form factors.
L-CV92-F100A-DT
73K212L-IH
73K212L-IH by Texas Instruments is a modem IC with 28 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It supports data rates up to 0.0012 Mbps, making it ideal for telecom applications.
ST7536CFN
ST7536CFN by STMicroelectronics is a modem IC with data rate of 0.0012 Mbps, operating at -10 to 70 °C. It has +-5 V power supplies, 28 terminals in a square chip carrier package suitable for telecom applications.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
11564-502-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
11564-502-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR; Power Supplies (V): 3/5;
11564-503-XTD
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Qualification: Not Qualified;
11564-504-XTD
11564-504-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
Ami Semiconductor
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Package Style (Meter): FLATPACK;
11564-503-XTP
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; No. of Functions: 1;
MODEM-DEMODULATOR; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: QFP; Package Shape: SQUARE; Terminal Position: QUAD;
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