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NCN49597MNRG

Onsemi

NCN49597MNRG by Onsemi

The Onsemi NCN49597MNRG is a programmable modem with 52 terminals, operating at temperatures from -40 to 115 °C. It has a supply voltage of 3.3V and low current draw of 0.06mA, suitable for industrial telecom applications in surface-mount configurations.

Median Price

$3.780

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,728 parts In-Stock

1+ parts

-

100+ parts

$3.780

1k+ parts

$3.380

10k+ parts

$3.180

1,728

-

$3.780

$3.380

$3.180

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 457 parts In-Stock

1+ parts

$4.000

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457

$4.000

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Vyrian

USA . 8,510 parts In-Stock

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8,510

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Cyclops Electronics Ltd

UK . 2,397 parts In-Stock

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2,397

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,324 parts In-Stock

1+ parts

$3.789

100+ parts

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1,324

$3.789

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Corohmni

South Africa . 340 parts In-Stock

1+ parts

$4.210

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340

$4.210

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AZTECH Wire

Italy . 495 parts In-Stock

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$13.520

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495

$13.520

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Perfect Parts

USA . 16,318 parts In-Stock

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16,318

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Kepictronics

USA . 10,000 parts In-Stock

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10,000

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TANS Electronics

Latvia . 5,453 parts In-Stock

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5,453

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SupplyDigital Components

Austria . 4,910 parts In-Stock

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4,910

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Problanco Electronics

Mexico . 4,710 parts In-Stock

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4,710

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Authorized Procurement Solutions

USA . 2,405 parts In-Stock

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2,405

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Kulean Microsystems

USA . 2,136 parts In-Stock

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2,136

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UHIMA Technologies

Türkiye . 583 parts In-Stock

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583

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Microchip USA

USA . 119 parts In-Stock

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119

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Overview

Experience the next level of connectivity with the NCN49597MNRG by Onsemi. Crafted with precision and quality in mind, this modem offers unparalleled performance and reliability for a wide range of applications. From industrial automation to telecommunications, this versatile chip carrier is designed to meet your needs with its programmable features and innovative technology. Trust Onsemi's expertise in manufacturing to deliver a product that exceeds expectations, providing value and benefits that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the modem easy to handle and long-lasting.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving time and effort.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of devices and systems.

Package Shape: SQUARE

The square shape helps in efficient placement on the circuit board, optimizing space and layout.

No. of Terminals: 52

Having 52 terminals allows for versatile connectivity options and integration with various components.

Maximum Operating Temperature: 115 °C

The high maximum operating temperature ensures reliability and stable performance even under extreme conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the modem to function in cold environments without any issues.

Terminal Position: QUAD

The quad terminal position provides a secure connection and ensures efficient signal transmission.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates that the modem is suitable for use in harsh industrial environments.

Maximum Supply Current: 0.06 mA

The low maximum supply current helps in conserving power and reducing energy consumption.

Telecom IC Type: PROGRAMMABLE MODEM

The programmable modem allows for customization and flexibility in settings and configurations, making it adaptable to different requirements.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures stable and reliable power delivery to the modem.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for compact design and space-saving layout on the circuit board.

Technical Specifications

Modems NCN49597MNRG attributes and parameters. Explore more Modems devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N52

No. of Terminals:

52

Maximum Operating Temperature:

115 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC52,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Modems

Maximum Supply Current:

.06 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

NCN49597MNRG Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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