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NCN49599MNRG

Onsemi

NCN49599MNRG by Onsemi

The Onsemi NCN49599MNRG is a programmable modem with 56 terminals in a square chip carrier package. It operates at temperatures ranging from -40 to 85 °C, suitable for industrial applications. With a supply voltage of 3.3V and max current of 60mA, it is ideal for telecom systems requiring high performance in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 190 parts In-Stock

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Digiode

USA . 102 parts In-Stock

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102

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Distributors (Availability)

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SupplyDigital Components

Austria . 7,430 parts In-Stock

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7,430

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TANS Electronics

Latvia . 4,947 parts In-Stock

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Problanco Electronics

Mexico . 4,301 parts In-Stock

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Kulean Microsystems

USA . 1,643 parts In-Stock

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UHIMA Technologies

Türkiye . 318 parts In-Stock

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Corphita

USA . 274 parts In-Stock

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Corohmni

South Africa . 74 parts In-Stock

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Overview

Get ready to experience top-quality communication with the NCN49599MNRG by Onsemi! This modem, designed with precision and expertise by renowned manufacturer Onsemi, offers unparalleled reliability and performance in a compact package. Perfect for various applications, this modem provides seamless connectivity and data transfer, making it an essential component for your projects. Upgrade to the NCN49599MNRG today and enjoy the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components of the modem, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, making installation and assembly more efficient.

No. of Terminals: 56

The high number of terminals enables the modem to connect to multiple devices or networks simultaneously, enhancing its versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the modem can withstand and operate effectively in various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the modem to function reliably even in cold environments, increasing its usability.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides a stable power source for the modem, contributing to its consistent performance.

Technical Specifications

Modems NCN49599MNRG attributes and parameters. Explore more Modems devices from Onsemi

Specs

JESD-30 Code:

S-PQCC-N56

Length:

8 mm

No. of Functions:

1

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC56,.31SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Maximum Supply Current:

60 mA

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

8 mm

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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