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UCB1200BE

NXP Semiconductors

UCB1200BE by NXP Semiconductors

MODEM-SUPPORT CIRCUIT; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

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Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,479 parts In-Stock

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4 Star Electronics, Inc.

USA . 2,769 parts In-Stock

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Anansix

USA . 2,717 parts In-Stock

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Digiode

USA . 2,024 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

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Bristol Electronics

USA . 1,475 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,210 parts In-Stock

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Electronics Depot

USA . 1,135 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 904 parts In-Stock

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ABC Electronics Ltd.

UK . 24 parts In-Stock

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Resion

USA . 11 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,197 parts In-Stock

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$266.000

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Assy Fe

Spain . 25,133 parts In-Stock

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Perfect Parts

USA . 6,268 parts In-Stock

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Kepictronics

USA . 5,900 parts In-Stock

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UNI Independent Distributors

Spain . 5,261 parts In-Stock

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GreenTree Electronics

Israel . 5,000 parts In-Stock

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Corphita

USA . 3,832 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,798 parts In-Stock

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ChipstoGo Electronic ltd

UK . 727 parts In-Stock

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Glotronic Ltd.

UK . 638 parts In-Stock

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Technical Specifications

Modems UCB1200BE attributes and parameters. Explore more Modems devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

UCB1200BE Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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