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UCB1100LP/X3

Philips Semiconductors

UCB1100LP/X3 by Philips Semiconductors

Modems; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 48; Package Code: QFP; Package Shape: SQUARE;

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Digiode

USA . 2,372 parts In-Stock

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Vyrian

USA . 616 parts In-Stock

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Anansix

USA . 443 parts In-Stock

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One Stop Electronics

USA . 474 parts In-Stock

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$722.000

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Corphita

USA . 4,950 parts In-Stock

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UNI Independent Distributors

Spain . 2,158 parts In-Stock

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Technical Specifications

Modems UCB1100LP/X3 attributes and parameters. Explore more Modems devices from Philips Semiconductors

Specs

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e0

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Modems

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Manufacturer Highlights

Philips Semiconductors

In September 2006, Philips completed the sale of an 80.1% stake in Philips Semiconductors to a consortium of private equity investors consisting of KKR, Bain Capital, Silver Lake Partners, Apax Partners and AlpInvest Partners. The new company name NXP (from Next eXPerience) was announced on August 31, 2006, and the company was officially launched during the Internationale Funkausstellung (IFA) consumer electronics show in Berlin. The newly independent NXP was ranked as one of the world's top 10 semiconductor companies

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