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TCM3105J

Texas Instruments

TCM3105J by Texas Instruments

TCM3105J by Texas Instruments is a 16-terminal modem IC with CMOS technology, operating at 5V. Housed in a ceramic rectangular package, it features dual terminal position and through-hole form. Ideal for telecom applications, this modem IC has a 2.54mm terminal pitch and is designed for power supplies of 5V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,687 parts In-Stock

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7,687

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Digiode

USA . 923 parts In-Stock

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923

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Mil-Aero Solutions, Inc.

USA . 39 parts In-Stock

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39

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,962 parts In-Stock

1+ parts

$14.732

100+ parts

-

1k+ parts

$15.172

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1,962

$14.732

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$15.172

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DigiPath Technology Company

USA . 1,741 parts In-Stock

1+ parts

$16.222

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1,741

$16.222

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ChromeModa Solutions

Germany . 2,531 parts In-Stock

1+ parts

$16.553

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$13.573

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2,531

$16.553

$13.573

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IDEA Electronic Components Group

UK . 1,456 parts In-Stock

1+ parts

$16.553

100+ parts

$15.725

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$14.898

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1,456

$16.553

$15.725

$14.898

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AZTECH Wire

Italy . 619 parts In-Stock

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$18.759

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619

$18.759

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One Stop Electronics

USA . 1,240 parts In-Stock

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$960.000

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1,240

$960.000

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Corphita

USA . 2,377 parts In-Stock

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2,377

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Overview

Unlock seamless communication with the TCM3105J by Texas Instruments, a high-quality modem designed to elevate your connectivity experience. Crafted with precision and expertise by Texas Instruments, a trusted name in the industry, this modem promises reliability and top-notch performance. Ideal for a wide range of applications, this modem delivers unparalleled value, efficiency, and convenience to customers. Stay connected effortlessly with the TCM3105J and experience the difference it makes in your daily communication needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is known for its high durability and heat resistance, making it suitable for applications where the modem may be subjected to harsh conditions.

Power Supplies (V): 5

Operating at 5 volts ensures compatibility with standard power sources, making it easy to integrate this modem into various systems.

No. of Terminals: 16

Having 16 terminals allows for a greater range of connectivity options, enabling the modem to interface with different devices or components.

Package Style (Meter): IN-LINE

The in-line package style makes it convenient to install the modem in a compact space, saving valuable real estate in a system.

Terminal Position: DUAL

Dual terminal position provides redundancy and enhances stability in connections, reducing the risk of signal interruptions or data loss.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, contributing to efficient and reliable performance of the modem.

Terminal Form: THROUGH-HOLE

Through-hole terminals are robust and secure, ensuring a stable connection even in rugged environments or under vibration.

Telecom IC Type: MODEM

Being a modem specific IC ensures optimized performance for telecommunication applications, delivering fast and reliable data transmission.

Nominal Supply Voltage: 5 V

The 5V supply voltage is commonly available, simplifying the power requirements for the modem and increasing compatibility with various systems.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy and secure connections, facilitating the installation and maintenance of the modem in a system.

Technical Specifications

Modems TCM3105J attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Modems

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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