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TCM3105DW

Texas Instruments

TCM3105DW by Texas Instruments

TCM3105DW by Texas Instruments is a 24-terminal modem IC with CMOS technology, operating at 5V. It features a small outline package style and gull wing terminal form, suitable for telecom applications requiring a 1.27mm terminal pitch in surface mount configurations.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,592 parts In-Stock

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6,592

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ACDS - Activité Composants Distribution Service

France . 369 parts In-Stock

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369

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Ashlea Components Ltd

UK . 173 parts In-Stock

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173

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Component Electronics Inc.

Canada . 135 parts In-Stock

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135

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Digiode

USA . 75 parts In-Stock

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75

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Fibra_Brandt Electronic GMBH

Germany . 5 parts In-Stock

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AZTECH Wire

Italy . 707 parts In-Stock

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$6.189

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707

$6.189

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Parana Technologies

USA . 51 parts In-Stock

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$11.670

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$12.062

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51

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$12.062

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DigiPath Technology Company

USA . 9 parts In-Stock

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$12.850

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9

$12.850

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IDEA Electronic Components Group

UK . 506 parts In-Stock

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$13.112

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$12.456

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$11.801

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506

$13.112

$12.456

$11.801

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ChromeModa Solutions

Germany . 360 parts In-Stock

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$13.112

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$10.752

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360

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One Stop Electronics

USA . 835 parts In-Stock

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$813.000

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835

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Perfect Parts

USA . 827 parts In-Stock

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Corphita

USA . 809 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 369 parts In-Stock

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369

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Glotronic Ltd.

UK . 295 parts In-Stock

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295

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Overview

Upgrade your communication systems with the TCM3105DW by Texas Instruments, a high-quality modem perfect for a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, you can trust that this modem delivers superior performance and reliability. Whether you're looking to enhance your data transmission or improve your telecommunication network, the TCM3105DW offers unmatched value, benefits, and advantages that will meet and exceed your expectations. Experience seamless connectivity and efficiency with this top-of-the-line modem from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is durable and lightweight, making the modem easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate the modem into existing systems and circuit designs.

Power Supplies (V): 5

Operates on a standard 5V power supply, making it compatible with a wide range of devices and applications.

No. of Terminals: 24

With 24 terminals, this modem offers a high level of connectivity and flexibility for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, making it ideal for compact devices.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures a secure connection between the modem and other components.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making the modem energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and strong mechanical connections, ensuring stability and durability.

Telecom IC Type: MODEM

Designed specifically for telecommunications applications, this modem offers reliable and efficient data transmission.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with a wide range of devices and power sources.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this modem offers precise and reliable connections for optimal performance.

Technical Specifications

Modems TCM3105DW attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G24

No. of Terminals:

24

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Modems

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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