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TCM3105DWL

Texas Instruments

TCM3105DWL by Texas Instruments

TCM3105DWL by Texas Instruments is a 24-terminal modem IC with 5V supply, operating b/w 0-70°C. It features CMOS technology, GULL WING terminals, and requires 12mA current. Ideal for telecom applications due to its small outline package and dual terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,591 parts In-Stock

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GES GmbH

Germany . 375 parts In-Stock

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375

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Beltway Electronics Company

USA . 159 parts In-Stock

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159

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Digiode

USA . 142 parts In-Stock

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Goldney Electronics S.L.

Spain . 24 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 494 parts In-Stock

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$6.566

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494

$6.566

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Parana Technologies

USA . 2,288 parts In-Stock

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$13.752

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$14.239

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2,288

$13.752

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$14.239

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IDEA Electronic Components Group

UK . 1,814 parts In-Stock

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$15.452

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$14.679

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$13.907

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1,814

$15.452

$14.679

$13.907

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ChromeModa Solutions

Germany . 387 parts In-Stock

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$15.452

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$12.671

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387

$15.452

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One Stop Electronics

USA . 610 parts In-Stock

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$463.000

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610

$463.000

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DigiPath Technology Company

USA . 2,156 parts In-Stock

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$13.932

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$13.932

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Corphita

USA . 627 parts In-Stock

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Perfect Parts

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Overview

Experience the seamless connectivity and reliable performance of the TCM3105DWL by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and innovation in their products. The TCM3105DWL modem is versatile and efficient, making it ideal for a wide range of applications. From telecommunications to networking, this modem offers unparalleled value, benefits, and advantages to customers looking for a high-quality solution. Trust Texas Instruments to deliver exceptional performance with the TCM3105DWL modem.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the modem lightweight and durable, perfect for portable or stationary use.

Surface Mount: YES

Surface mount capability allows for easy installation onto circuit boards, saving space and simplifying the production process.

Power Supplies (V): 5

Operating at a low voltage of 5V makes the modem energy-efficient and compatible with a wide range of power sources.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this modem can function in various environments without overheating.

Technology: CMOS

The CMOS technology used in this modem ensures low power consumption and high reliability, making it a cost-effective and efficient choice.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources, making integration into existing systems easy.

Technical Specifications

Modems TCM3105DWL attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

Additional Features:

FULL DUPLEX

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Modems

Maximum Supply Current:

12 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

TCM3105DWL Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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