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TCM3101J

Texas Instruments

TCM3101J by Texas Instruments

Texas Instruments TCM3101J modem features CMOS technology, 16 terminals in a ceramic rectangular package with in-line style. Operating temperature range from -10°C to 70°C makes it suitable for commercial telecom applications. Dual terminal position and 2.54mm pitch enhance connectivity and performance.

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12

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Vyrian

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Velocity Electronics

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North Shore Components

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Digiode

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Diverse Electronics

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EMSNET

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Mil-Aero Solutions, Inc.

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Electronic Expediters

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Ack Elektronik San.Tic.Ltd.Sti

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Manotoh

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Parana Technologies

USA . 535 parts In-Stock

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DigiPath Technology Company

USA . 1,809 parts In-Stock

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ChromeModa Solutions

Germany . 1,851 parts In-Stock

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IDEA Electronic Components Group

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AZTECH Wire

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One Stop Electronics

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Overview

Unlock seamless communication with the TCM3101J by Texas Instruments, a high-quality modem designed to elevate your connectivity experience. Crafted by a reputable manufacturer known for superior products, this modem offers unparalleled reliability and performance. Perfect for a wide range of applications, the TCM3101J is versatile and efficient, making it an essential tool for businesses and individuals alike. Experience the value and benefits of top-notch technology with this innovative modem that delivers outstanding results every time.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic is a durable material that can withstand high temperatures and provide excellent insulation, making it ideal for protecting sensitive electronic components in the modem.

No. of Terminals: 16

Having a higher number of terminals allows for more connections and functionality in the modem, increasing its versatility and performance capabilities.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in hot environments, making this modem suitable for a wide range of applications.

Technology: CMOS

CMOS technology is known for its low power consumption and high speed capabilities, contributing to the efficiency and performance of the modem.

Telecom IC Type: MODEM

Being specifically designed as a modem telecom IC, this product is optimized for telecommunications applications, ensuring reliable and fast data transmission.

Technical Specifications

Modems TCM3101J attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Modems

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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