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TCM3105N

Texas Instruments

TCM3105N by Texas Instruments

TCM3105N by Texas Instruments is a 16-terminal modem IC with 5V power supply. It features CMOS technology, through-hole terminal form, and operates at a nominal voltage of 5V. This telecom IC is commonly used in applications requiring modem functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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ACDS - Activité Composants Distribution Service

France . 3,375 parts In-Stock

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Holdelec - ElecDif-Pro

France . 3,375 parts In-Stock

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Vyrian

USA . 1,983 parts In-Stock

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Digiode

USA . 879 parts In-Stock

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879

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ECAB

Sweden . 435 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 400 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 239 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 113 parts In-Stock

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Ashlea Components Ltd

UK . 71 parts In-Stock

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Sinequanon

UK . 65 parts In-Stock

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Cyclops Electronics Ltd

UK . 49 parts In-Stock

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ComSIT Distribution GmbH

Germany . 43 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 16 parts In-Stock

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LittleDiode

UK . 7 parts In-Stock

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Parana Technologies

USA . 1,785 parts In-Stock

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$5.781

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$6.574

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ChromeModa Solutions

Germany . 1,608 parts In-Stock

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$6.496

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$5.327

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IDEA Electronic Components Group

UK . 1,262 parts In-Stock

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$5.846

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AZTECH Wire

Italy . 419 parts In-Stock

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$11.259

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One Stop Electronics

USA . 751 parts In-Stock

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Lixinc

USA . 13,167 parts In-Stock

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Corphita

USA . 2,411 parts In-Stock

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Assy Fe

Spain . 1,133 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,122 parts In-Stock

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DigiPath Technology Company

USA . 1,109 parts In-Stock

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Kepictronics

USA . 116 parts In-Stock

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Overview

Enhance your communication capabilities with the TCM3105N by Texas Instruments. Known for their top-quality products, Texas Instruments delivers reliable modems that cater to a wide range of applications. Whether you're looking to improve data transmission in industrial settings or enhance connectivity in consumer electronics, this modem is a versatile solution. With its efficient design and trusted performance, the TCM3105N offers exceptional value, providing customers with seamless communication solutions that drive productivity and innovation. Elevate your connectivity experience with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and resistance to wear and tear, allowing the modem to have a longer lifespan.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to stack or place the modem in a compact space, saving room in your setup.

Power Supplies (V): 5

Operating at a low voltage of 5V means the modem consumes less power, which can result in energy savings and efficiency.

No. of Terminals: 16

Having 16 terminals allows for more connectivity options, making the modem versatile and suitable for various setups.

Package Style (Meter): IN-LINE

In-line package style makes it easier to integrate the modem into existing systems or setups without taking up much space.

Terminal Position: DUAL

Dual terminal position provides redundancy and can offer better connectivity options, ensuring more stable connections.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the modem efficient and dependable for data processing.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections, reducing the risk of disconnection or signal loss in the modem.

Telecom IC Type: MODEM

Being a modem, this product is specifically designed for telecommunications purposes, ensuring efficient data transmission and reception.

Nominal Supply Voltage: 5 V

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate the modem into various setups.

Terminal Pitch: 2.54 mm

Having a terminal pitch of 2.54mm allows for easier soldering or connection of wires to the modem, simplifying the installation process.

Technical Specifications

Modems TCM3105N attributes and parameters. Explore more Modems devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Modems

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Telecom IC Type:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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