Loading...

E-STLC7550TQF7

STMicroelectronics

E-STLC7550TQF7 by STMicroelectronics

E-STLC7550TQF7 by STMicroelectronics is a low-profile modem supporting data rates of 0.056 Mbps, ideal for telecom applications. It operates at a nominal voltage of 3V and features a compact design with 48 terminals in a square package. With an operating temp range of 0 °C to 70°C, it's suitable for commercial use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,626 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,626

-

-

-

-

Anansix

USA . 2,614 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,614

-

-

-

-

Digiode

USA . 322 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

322

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,547 parts In-Stock

1+ parts

$6.981

100+ parts

-

1k+ parts

$6.283

10k+ parts

-

1,547

$6.981

-

$6.283

-

Native Components

USA . 105 parts In-Stock

1+ parts

$12.650

100+ parts

-

1k+ parts

-

10k+ parts

-

105

$12.650

-

-

-

MKK Technologies

India . 2,054 parts In-Stock

1+ parts

$13.127

100+ parts

-

1k+ parts

-

10k+ parts

-

2,054

$13.127

-

-

-

DigiPath Technology Company

USA . 2,054 parts In-Stock

1+ parts

$13.127

100+ parts

-

1k+ parts

-

10k+ parts

-

2,054

$13.127

-

-

-

Northwest PG Solutions

USA . 1,548 parts In-Stock

1+ parts

$13.915

100+ parts

$12.523

1k+ parts

-

10k+ parts

-

1,548

$13.915

$12.523

-

-

AZTECH Wire

Italy . 533 parts In-Stock

1+ parts

$16.280

100+ parts

-

1k+ parts

-

10k+ parts

-

533

$16.280

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 24,923 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

24,923

-

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Microchip USA

USA . 5,628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,628

-

-

-

-

Corphita

USA . 4,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,426

-

-

-

-

Parana Technologies

USA . 1,046 parts In-Stock

1+ parts

-

100+ parts

$8.347

1k+ parts

-

10k+ parts

-

1,046

-

$8.347

-

-

Overview

Unlock the future of connectivity with the E-STLC7550TQF7 modem from STMicroelectronics. Renowned for its innovation and reliability, STMicroelectronics delivers a compact, high-performance solution perfect for diverse applications—from IoT devices to smart home technology. With superior quality and efficient power management, this modem ensures seamless data transmission, helping you stay connected while enhancing your product’s value. Experience exceptional performance and trust in a brand that prioritizes excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures a balance of durability and lightweight construction, making the modem reliable for various applications.

Surface Mount: YES

Surface-mount technology allows for a compact design and efficient mounting, which is ideal for modern electronic circuits.

Package Shape: SQUARE

The square package shape enables efficient space utilization on printed circuit boards (PCBs), facilitating design flexibility.

Power Supplies (V): 3

Operating on a 3V supply makes this modem suitable for low-power applications, promoting energy efficiency.

No. of Terminals: 48

A higher number of terminals allows for more connections and better integration with other components, enhancing functionality.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The low-profile flatpack design is ideal for compact devices, making it an excellent choice for space-constrained environments.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in a variety of environmental conditions, making it versatile.

Minimum Operating Temperature: 0 °C

With a minimum temperature of 0 °C, this modem is suitable for a wide range of applications, including outdoor and industrial settings.

Terminal Position: QUAD

Quad terminal positioning provides a stable and reliable connection, which is essential for maintaining signal integrity.

Maximum Seated Height: 1.6 mm

A low seated height of 1.6 mm is beneficial for reducing overall device thickness, contributing to a sleek design.

Width: 7 mm

A compact width of 7 mm promotes high-density PCB layouts, allowing for more components to be integrated within a limited space.

Length: 7 mm

The small length complements the width, maintaining a compact form factor that suits modern electronic applications.

Temperature Grade: COMMERCIAL

Having a commercial temperature grade means it is designed for standard operating conditions, making it ideal for consumer electronics.

Technology: CMOS

The use of CMOS technology enables low power consumption and high-speed operation, making it efficient for processing data.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint reliability, improving overall durability and performance of the modem.

Telecom IC Type: MODEM-SUPPORT CIRCUIT

Being specifically designed as a modem-support circuit ensures optimal data transmission capabilities suitable for telecommunications.

Nominal Supply Voltage: 3 V

A nominal supply voltage of 3V reinforces its energy efficiency, making it ideal for battery-operated devices.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch allows for high-density assembling which is critical in the modern miniaturization of electronic devices.

Data Rate: 0.056 Mbps

A data rate of 0.056 Mbps is sufficient for basic data communications, catering to low-bandwidth applications effectively.

Technical Specifications

Modems E-STLC7550TQF7 attributes and parameters. Explore more Modems devices from STMicroelectronics

Specs

Data Rate:

.056 Mbps

JESD-30 Code:

S-PQFP-G48

JESD-609 Code:

e3/e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP48,.35SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Power Supplies (V):

3

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Modems

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

7 mm

Trade Compliance

E-STLC7550TQF7 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.