Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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RF (Radio Frequency) and microwave amplifiers are electronic devices used to amplify signals in the frequency range from 1 MHz to several GHz. They are commonly used in various applications such as telecommunications, wireless communications, radar systems, and satellite communication. RF and microwave amplifiers can be classified into different types based on their operating principle, frequency range, power output, and application.The most commonly used types of RF and microwave amplifiers include transistor amplifiers, vacuum tube amplifiers, and hybrid amplifiers. Transistor amplifiers are widely used due to their low cost, small size, and high reliability. They can be further classified into bipolar junction transistor (BJT) amplifiers, field-effect transistor (FET) amplifiers, and HEMT (high electron mobility transistor) amplifiers. Vacuum tube amplifiers, such as the klystron and traveling-wave tube, are used in high-power applications where high gain and efficiency are required. Hybrid amplifiers combine the advantages of both transistor and vacuum tube amplifiers.RF and microwave amplifiers can also be classified based on their frequency range. Low-frequency amplifiers operate in the range of a few kHz to a few hundred MHz, while high-frequency amplifiers operate in the range of several GHz. Amplifiers can also be classified based on their power output, which can range from a few milliwatts to several kilowatts.
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BGA622-E6327
Infineon Technologies
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; No. of Functions: 1; Minimum Operating Temperature: -30 Cel; Package Equivalence Code: SOT-343R; Maximum Operating Temperature: 85 Cel;
1
85 Cel
-30 Cel
PLASTIC/EPOXY
SOT-343R
2.75
RF/Microwave Amplifiers
ACPM-7381-TR1
Broadcom
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 10; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 3.4; Maximum Supply Current: 560 mA;
SURFACE MOUNT
10
SOLCC10,.16,32
3.4
560 mA
ALM-1612-BLKG
RF/Microwave Amplifiers; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; No. of Functions: 1; Power Supplies (V): 1.8/2.7;
12
MODULE,12LEAD,.13
1.8/2.7
11.5 mA
GAAS
ALM-1612-TR1G
RF/Microwave Amplifiers; No. of Terminals: 12; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; No. of Functions: 1; Package Equivalence Code: MODULE,12LEAD,.13;
UPC8240T6N-E2-A
Renesas Electronics
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Operating Temperature: 85 Cel;
6
-40 Cel
SOLCC6,.06,20
9 mA
BIPOLAR
CGD1040HI,112
NXP Semiconductors
CGD1040HI,112 by NXP Semiconductors is a hybrid RF amplifier designed for high-performance applications. It operates at 24V with a max current of 460mA and withstands temperatures from -20 °C to 100 °C. Ideal for demanding RF and microwave tasks, it ensures reliability in various environments.
100 Cel
-20 Cel
SOT-115J
24
460 mA
HYBRID
CGD1042HI,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; No. of Functions: 1; Maximum Supply Current: 460 mA; Package Equivalence Code: SOT-115J;
CGY888C,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; No. of Functions: 1; Package Equivalence Code: SOT-115J; Power Supplies (V): 24;
300 mA
BGU7003,132
BGU7003,132 by NXP Semiconductors is a surface-mount RF amplifier designed for robust performance. It operates b/w -40 °C and 85 °C with a supply voltage of 2.5V and max current of 15mA. Ideal for applications in wireless communication systems.
e3
SOLCC6,.04,14
2.5
15 mA
Tin (Sn)
CGD1044HI,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 24; Package Equivalence Code: SOT-115J; No. of Functions: 1; Maximum Supply Current: 460 mA;
BGA7124,118
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: SOLCC8,.12,20; Maximum Supply Current: 200 mA;
8
SOLCC8,.12,20
3.3/5
200 mA
MC-7847-KC-AZ
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: SOT-115J; Power Supplies (V): 24; Maximum Supply Current: 420 mA;
420 mA
MC-7834-KC-AZ
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Maximum Supply Current: 325 mA; Power Supplies (V): 24; No. of Functions: 1;
325 mA
UPC2763TB-E3-A
TSSOP6,.08
3
35 mA
BGA7024,135
BGA7024,135 by NXP Semiconductors is a surface-mount RF amplifier designed for efficient performance. It operates at 5V with a max supply current of 125mA and features a plastic/epoxy package. Ideal for applications in wireless communication systems.
TO-243
5
125 mA
TIN
BGA7024,115
BGA7024,115 by NXP Semiconductors is a surface-mount RF amplifier designed for efficient performance. It operates at 5V with a max supply current of 125mA and features a plastic/epoxy package. Ideal for applications in wireless communication systems.
BGA2865,115
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: TSSOP6,.08; Power Supplies (V): 5;
29.7 mA
BGU7032,115
BGU7032,115 by NXP Semiconductors is a wideband low-power RF amplifier designed for surface mount applications. It operates at a max frequency of 1000 MHz and supports power supplies of 5V, with an operating temp range from -10 °C to 70 °C. Ideal for enhancing signal quality in communication systems.
COMPONENT
1000 MHz
70 Cel
-10 Cel
WIDE BAND LOW POWER
BGA2850,115
10.8 mA
CGD1046HI,112
CGD1046HI,112 by NXP Semiconductors is a hybrid RF amplifier designed for high-performance applications. It operates with a supply voltage of 24V and supports temperatures from -20 °C to 100 °C, drawing up to 465mA. Ideal for demanding RF systems, it ensures reliability in various environments.
465 mA
BGA7027,115
BGA7027,115 by NXP Semiconductors is a surface-mount RF amplifier with a 5V power supply and a max current of 195 mA. It features a plastic/epoxy package and has 3 terminals with tin finish. Ideal for enhancing signal strength in communication systems.
195 mA
BGA420H6327
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; No. of Functions: 1; Minimum Operating Temperature: -65 Cel; Power Supplies (V): 3;
150 Cel
-65 Cel
8 mA
BGA2816,115
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: TSSOP6,.08; Maximum Supply Current: 25.5 mA;
3.3
25.5 mA
BGA2002,115
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Screening Level: AEC-Q100; JESD-609 Code: e3; No. of Functions: 1;
AEC-Q100
CGY1043,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; No. of Functions: 1; Maximum Supply Current: 280 mA; Package Equivalence Code: SOT-115J;
280 mA
CGY1041,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Package Equivalence Code: SOT-115J; Power Supplies (V): 24; Maximum Supply Current: 280 mA;
CGY1032,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; Maximum Supply Current: 280 mA; Package Equivalence Code: SOT-115J;
UPD5750T7D-E4A-A
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BICMOS; Power Supplies (V): 1.8;
BGA6,2X3,10
1.8
4.5 mA
BICMOS
BGU7041,115
NXP Semiconductors' BGU7041,115 is a RF & Microwave Amplifier with 6 terminals and operates at temperatures from -10°C to 70°C. It has a power supply of 3.3V and uses surface mount technology. Ideal for applications requiring high-frequency signal amplification in various electronic devices.
CGD987HCI,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: GAAS; Package Equivalence Code: SOT-115J; Power Supplies (V): 24; No. of Functions: 1;
ACPM-5007-TR1
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 10; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Power Supplies (V): 3.4;
90 Cel
SOLCC10,.11,24
500 mA
BGU7042,115
BGU7042,115 by NXP Semiconductors is a surface-mount RF amplifier designed for efficient performance. It operates at 3.3V with a max supply current of 60mA and functions effectively in temperatures ranging from -10 °C to 70 °C. Ideal for wireless communication applications, it ensures reliable signal amplification.
60 mA
BGU6104,147
BGU6104,147 by NXP Semiconductors is a wideband low-power RF amplifier with a gain of 5 dB and operates b/w 40 MHz and 4000 MHz. It features a compact surface mount design with a max supply current of 40 mA. Ideal for applications in communication systems, it withstands temperatures from -40 °C to 85 °C.
5 dB
4000 MHz
40 MHz
SOLCC6,.08,20
40 mA
BGU7003W,115
BGU7003W,115 by NXP Semiconductors is a surface-mount RF amplifier designed for efficient performance. It operates b/w -40 °C to 85 °C with a supply voltage of 2.5V and a max current of 15mA. Ideal for applications in wireless communication systems.
SOLCC6,.04,20
BGY588C,112
BGY588C,112 by NXP Semiconductors is a hybrid RF amplifier designed for high-performance applications. It operates at 24V with a max current of 345mA and withstands temperatures from -20 °C to 100 °C. Ideal for telecom and broadcasting systems, it ensures reliable signal amplification.
345 mA
BGE788C,112
BGE788C,112 by NXP Semiconductors is a hybrid RF amplifier designed for high-performance applications. It operates at 24V with a max current of 325mA and withstands temperatures from -20 °C to 100 °C. Ideal for telecommunications and broadcasting systems.
BGU7052,118
BGU7052,118 by NXP Semiconductors is a surface mount RF amplifier designed for robust performance in various applications. It operates b/w -40 °C and 85 °C with a supply voltage of 3.3V and a max current of 95mA. Ideal for enhancing signal strength in communication systems.
SOLCC10,.12,20
95 mA
BGA2874,115
BGA2874,115 by NXP Semiconductors is a surface-mount RF amplifier designed for efficient signal amplification. It operates at 2.5V with a max supply current of 19mA and features a 6-terminal plastic/epoxy package. Ideal for various RF applications, it ensures reliable performance in compact designs.
19 mA
BGU7053,118
BGU7053,118 by NXP Semiconductors is an RF amplifier designed for surface mount applications. It operates b/w -40 °C to 85 °C with a supply voltage of 3.3V and a max current of 110mA. Ideal for enhancing signal strength in communication devices.
110 mA
BGU8007,115
NXP Semiconductors' BGU8007,115 is a RF & Microwave Amplifier with 6 terminals and Tin finish. It operates b/w -40 to 85°C, powered by 1.8V supply at max current of 14.7mA. Ideal for surface mount applications in various electronic devices.
14.7 mA
BGA7130,118
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Power Supplies (V): 5; No. of Functions: 1;
550 mA
UPC8232T5N-A
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 6; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 4.1 mA;
4.1 mA
BLM7G22S-60PB,118
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: FL16(UNSPEC); Power Supplies (V): 28;
2
16
FL16(UNSPEC)
28
BLM7G22S-60PBG,118
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; No. of Functions: 2; Package Equivalence Code: SOP16(UNSPEC);
SOP16(UNSPEC)
SST12CP11-QVCE
Microchip Technology
SST12CP11-QVCE by Microchip Technology is a RF & Microwave Amplifier with 16 terminals and operates on a 5V power supply. It features bipolar technology, can withstand temperatures from -40°C to 85°C, and comes in a surface mount package. Ideal for applications requiring high-frequency signal amplification.
LCC16,.12SQ,20
UPC1678GV-A
RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Body Material: PLASTIC/EPOXY; Technology: BIPOLAR; Maximum Supply Current: 60 mA;
-45 Cel
SSOP8,.2
BGA3012,115
NXP Semiconductors' BGA3012,115 is a RF & Microwave Amplifier with 8V power supply, 3 terminals, and max operating temp of 85°C. It features TIN terminal finish, 125mA max supply current, and surface mounting. Ideal for applications requiring high-frequency signal amplification in various electronic devices.
BGA3018,115
NXP Semiconductors' BGA3018,115 is a RF & Microwave Amplifier with 8V power supply, 3 terminals, and max operating temp of 85°C. It features surface mounting and TIN terminal finish. Ideal for applications requiring high-frequency signal amplification in various electronic devices.
135 mA
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