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BGA2874,115

NXP Semiconductors

BGA2874,115 by NXP Semiconductors

BGA2874,115 by NXP Semiconductors is a surface-mount RF amplifier designed for efficient signal amplification. It operates at 2.5V with a max supply current of 19mA and features a 6-terminal plastic/epoxy package. Ideal for various RF applications, it ensures reliable performance in compact designs.

Median Price

$0.120

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 72 parts In-Stock

1+ parts

-

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$0.120

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$0.100

10k+ parts

$0.089

72

-

$0.120

$0.100

$0.089

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,827 parts In-Stock

1+ parts

$0.093

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4,827

$0.093

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Vyrian

USA . 7,511 parts In-Stock

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7,511

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Anansix

USA . 2,172 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,251 parts In-Stock

1+ parts

$0.088

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-

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1,251

$0.088

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Component Stockers USA

USA . 101 parts In-Stock

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$0.110

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101

$0.110

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Corohmni

South Africa . 34 parts In-Stock

1+ parts

$0.924

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34

$0.924

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$3.277

100+ parts

$2.982

1k+ parts

$2.687

10k+ parts

-

350

$3.277

$2.982

$2.687

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AZTECH Wire

Italy . 1,189 parts In-Stock

1+ parts

$20.300

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1,189

$20.300

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QUARKTWIN TECHNOLOGY LTD

USA . 9,374 parts In-Stock

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9,374

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UNI Independent Distributors

Spain . 7,308 parts In-Stock

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7,308

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Northwest PG Solutions

USA . 1,757 parts In-Stock

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1,757

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Native Components

USA . 575 parts In-Stock

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575

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Overview

Unlock exceptional performance with the BGA2874,115 from NXP Semiconductors, a leader in RF and microwave technology. This high-quality amplifier is designed for efficiency and reliability, making it perfect for a range of applications, from telecommunications to automotive systems. With its surface mount design and low power consumption, it seamlessly integrates into your projects, delivering robust signal amplification while saving energy. Experience the NXP advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides excellent durability and resistance to environmental factors, making it suitable for various applications.

Power Supplies (V): 2.5

A power supply requirement of 2.5V indicates low power consumption, making this amplifier energy-efficient and ideal for battery-powered devices.

No. of Terminals: 6

Having 6 terminals allows for a flexible configuration and ease of integration into different circuit designs, enhancing versatility.

Terminal Finish: TIN

The tin terminal finish ensures good solderability and reliable electrical connections, contributing to the overall reliability of the product.

Maximum Supply Current: 19 mA

A maximum supply current of 19 mA signifies a low power requirement, which is critical for minimizing thermal issues and extending the lifespan of the device.

Mounting Feature: SURFACE MOUNT

Surface mount technology allows for compact designs and efficient use of board space, making this amplifier suitable for modern electronic applications where space is at a premium.

Technical Specifications

RF & Microwave Amplifiers BGA2874,115 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Mounting Feature:

No. of Functions:

1

No. of Terminals:

6

Package Body Material:

Package Equivalence Code:

TSSOP6,.08

Power Supplies (V):

2.5

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

19 mA

Terminal Finish:

TIN

Trade Compliance

BGA2874,115 RF & Microwave trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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