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BGU7003,132

NXP Semiconductors

BGU7003,132 by NXP Semiconductors

BGU7003,132 by NXP Semiconductors is a surface-mount RF amplifier designed for robust performance. It operates b/w -40 °C and 85 °C with a supply voltage of 2.5V and max current of 15mA. Ideal for applications in wireless communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,174 parts In-Stock

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3,174

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Vyrian

USA . 2,157 parts In-Stock

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2,157

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Anansix

USA . 1,689 parts In-Stock

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1,689

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Distributors (Availability)

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Northwest PG Solutions

USA . 1,533 parts In-Stock

1+ parts

$2.551

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1,533

$2.551

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AZTECH Wire

Italy . 612 parts In-Stock

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$13.280

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612

$13.280

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One Stop Electronics

USA . 1,256 parts In-Stock

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$26.000

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1,256

$26.000

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UNI Independent Distributors

Spain . 398 parts In-Stock

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398

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Native Components

USA . 353 parts In-Stock

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$2.249

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353

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$2.249

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Corphita

USA . 155 parts In-Stock

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Overview

Elevate your RF projects with the BGU7003,132 from NXP Semiconductors, a trusted leader in innovation. This high-quality microwave amplifier offers exceptional performance across varying conditions, ensuring reliability from -40 °C to 85 °C. Designed for versatility, it's perfect for applications ranging from telecommunications to industrial devices. Enjoy the benefits of low power consumption and compact surface-mount design, delivering efficiency and space savings that enhance your product's value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and lightweight characteristics, making the product suitable for various applications while contributing to reduced manufacturing costs.

Power Supplies: 2.5V

Operating at a low voltage of 2.5V makes this amplifier energy efficient, which is crucial for battery-powered devices and helps in extending operational life.

Number of Terminals: 6

Having 6 terminals allows for versatile connectivity options, enabling designers to integrate the amplifier easily within different circuit configurations.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature of 85 °C ensures reliability and performance in demanding environments, making this amplifier suitable for industrial and outdoor applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this amplifier can function effectively in extreme cold conditions, making it ideal for applications in harsh weather climates.

Terminal Finish: Tin (Sn)

The use of tin for terminal finish enhances solderability and prevents oxidation, ensuring stable electrical performance and longevity of connections in various applications.

Maximum Supply Current: 15 mA

A maximum supply current of 15 mA indicates low power consumption, which is beneficial for thermal management and helps in minimizing energy costs in the final application.

Mounting Feature: Surface Mount

Surface mount technology allows for compact design and easy integration onto PCBs, saving space and facilitating automated assembly processes.

Technical Specifications

RF & Microwave Amplifiers BGU7003,132 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Mounting Feature:

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SOLCC6,.04,14

Power Supplies (V):

2.5

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

15 mA

Terminal Finish:

Tin (Sn)

Trade Compliance

BGU7003,132 RF & Microwave trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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