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BGU7003W,115

NXP Semiconductors

BGU7003W,115 by NXP Semiconductors

BGU7003W,115 by NXP Semiconductors is a surface-mount RF amplifier designed for efficient performance. It operates b/w -40 °C to 85 °C with a supply voltage of 2.5V and a max current of 15mA. Ideal for applications in wireless communication systems.

Median Price

$0.309

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$0.309

1k+ parts

$0.257

10k+ parts

$0.229

3

-

$0.309

$0.257

$0.229

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,033 parts In-Stock

1+ parts

$0.240

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2,033

$0.240

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Vyrian

USA . 4,236 parts In-Stock

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4,236

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Anansix

USA . 813 parts In-Stock

1+ parts

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813

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 288 parts In-Stock

1+ parts

$0.208

100+ parts

-

1k+ parts

-

10k+ parts

$0.199

288

$0.208

-

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$0.199

Corphita

USA . 1,153 parts In-Stock

1+ parts

$0.228

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1,153

$0.228

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Northwest PG Solutions

USA . 298 parts In-Stock

1+ parts

$0.228

100+ parts

-

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$0.201

298

$0.228

-

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$0.201

Continental Prestige Electronics

USA . 7 parts In-Stock

1+ parts

$0.691

100+ parts

-

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7

$0.691

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AZTECH Wire

Italy . 521 parts In-Stock

1+ parts

$20.610

100+ parts

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521

$20.610

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UNI Independent Distributors

Spain . 5,202 parts In-Stock

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5,202

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Overview

Unlock unparalleled performance with the BGU7003W,115 from NXP Semiconductors, a leader in innovative RF solutions. This high-quality amplifier excels in diverse applications, ensuring reliable operation even in extreme temperatures. Its compact design allows for seamless integration into your projects, while its low power consumption translates to greater efficiency and longer device life. Trust in NXP's legacy of excellence to elevate your technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body material provides excellent durability and resistance to environmental factors, making it suitable for a wide range of applications.

Power Supplies (V): 2.5

A low supply voltage of 2.5V allows for efficient power consumption and is ideal for battery-operated devices, enhancing overall design flexibility.

No. of Terminals: 6

Having 6 terminals offers versatility in connections while maintaining compact design, making it compatible with various circuit configurations.

Maximum Operating Temperature: 85 °C

The capability to operate at a maximum temperature of 85 °C ensures reliable performance in high-temperature environments, making it robust and dependable.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C guarantees performance in extreme cold conditions, making it suitable for applications in harsh climates.

Terminal Finish: TIN

TIN terminal finish promotes good solderability and ensures long-lasting connections, enhancing the overall reliability of the product.

Maximum Supply Current: 15 mA

With a maximum supply current of 15 mA, this amplifier is energy-efficient, which is essential for low-power applications and helps in prolonging battery life.

Mounting Feature: SURFACE MOUNT

Surface mount technology allows for compact design and automated assembly, contributing to lower production costs and improved space efficiency on PCBs.

Technical Specifications

RF & Microwave Amplifiers BGU7003W,115 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Mounting Feature:

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

Package Equivalence Code:

SOLCC6,.04,20

Power Supplies (V):

2.5

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

15 mA

Terminal Finish:

TIN

Trade Compliance

BGU7003W,115 RF & Microwave trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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