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BLM7G22S-60PB,118

NXP Semiconductors

BLM7G22S-60PB,118 by NXP Semiconductors

RF/Microwave Amplifiers; Mounting Feature: SURFACE MOUNT; No. of Terminals: 16; Package Body Material: PLASTIC/EPOXY; Package Equivalence Code: FL16(UNSPEC); Power Supplies (V): 28;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,974 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,974

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Digiode

USA . 3,371 parts In-Stock

1+ parts

-

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-

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3,371

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Anansix

USA . 215 parts In-Stock

1+ parts

-

100+ parts

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215

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$11.410

100+ parts

-

1k+ parts

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10k+ parts

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204

$11.410

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One Stop Electronics

USA . 1,626 parts In-Stock

1+ parts

$16.000

100+ parts

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1,626

$16.000

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Component Stockers USA

USA . 609 parts In-Stock

1+ parts

$99.990

100+ parts

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1k+ parts

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609

$99.990

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UNI Independent Distributors

Spain . 7,422 parts In-Stock

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7,422

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Corphita

USA . 4,417 parts In-Stock

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4,417

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Microchip USA

USA . 4,114 parts In-Stock

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4,114

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Northwest PG Solutions

USA . 1,266 parts In-Stock

1+ parts

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1,266

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Native Components

USA . 671 parts In-Stock

1+ parts

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671

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Technical Specifications

RF & Microwave Amplifiers BLM7G22S-60PB,118 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Mounting Feature:

No. of Functions:

2

No. of Terminals:

16

Package Body Material:

Package Equivalence Code:

FL16(UNSPEC)

Power Supplies (V):

28

Sub-Category:

RF/Microwave Amplifiers

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

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