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BGA7024,135

NXP Semiconductors

BGA7024,135 by NXP Semiconductors

BGA7024,135 by NXP Semiconductors is a surface-mount RF amplifier designed for efficient performance. It operates at 5V with a max supply current of 125mA and features a plastic/epoxy package. Ideal for applications in wireless communication systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,713 parts In-Stock

1+ parts

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3,713

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Anansix

USA . 2,220 parts In-Stock

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2,220

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Digiode

USA . 1,055 parts In-Stock

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1,055

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,307 parts In-Stock

1+ parts

$5.174

100+ parts

-

1k+ parts

$4.967

10k+ parts

$4.967

5,307

$5.174

-

$4.967

$4.967

AZTECH Wire

Italy . 704 parts In-Stock

1+ parts

$20.120

100+ parts

-

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704

$20.120

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One Stop Electronics

USA . 1,240 parts In-Stock

1+ parts

$34.000

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1,240

$34.000

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Corphita

USA . 3,695 parts In-Stock

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3,695

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UNI Independent Distributors

Spain . 3,018 parts In-Stock

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3,018

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Northwest PG Solutions

USA . 881 parts In-Stock

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881

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Native Components

USA . 856 parts In-Stock

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856

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Robosynatics

Brazil . 350 parts In-Stock

1+ parts

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$2.455

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$2.273

10k+ parts

$2.273

350

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$2.455

$2.273

$2.273

Lucentia Tech

USA . 350 parts In-Stock

1+ parts

-

100+ parts

$2.455

1k+ parts

$2.273

10k+ parts

$2.273

350

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$2.455

$2.273

$2.273

Overview

Elevate your RF applications with the BGA7024,135 from NXP Semiconductors, a leader in innovation and quality. This high-performance amplifier delivers exceptional reliability and efficiency, ensuring optimal signal strength for your devices. With its compact design and robust build, it seamlessly integrates into various systems, enhancing communication capabilities while reducing energy consumption. Choose NXP for unparalleled expertise and transform your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material ensures a lightweight and cost-effective design, while also providing good thermal stability and protection for the internal components.

Power Supplies (V): 5

Operating on a 5V power supply makes this amplifier convenient to integrate into a wide range of electronic systems, especially for low-power applications.

No. of Terminals: 3

With only three terminals, this amplifier offers simplified integration and reduced complexity in PCB layout, making it ideal for compact designs.

Terminal Finish: TIN

The use of tin finish on terminals enhances solderability and helps improve the durability of solder joints, ensuring reliable performance over time.

Maximum Supply Current: 125 mA

A maximum supply current of 125 mA is efficient for low-power applications, allowing for better battery life and reduced heat generation in the circuit.

Mounting Feature: SURFACE MOUNT

The surface mount design facilitates easier and more efficient automation in assembly processes, as well as saves space on PCB, which is critical for modern compact devices.

Technical Specifications

RF & Microwave Amplifiers BGA7024,135 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

JESD-609 Code:

e3

Mounting Feature:

No. of Functions:

1

No. of Terminals:

3

Package Body Material:

Package Equivalence Code:

TO-243

Power Supplies (V):

5

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

125 mA

Terminal Finish:

TIN

Trade Compliance

BGA7024,135 RF & Microwave trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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