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CGY1043,112

NXP Semiconductors

CGY1043,112 by NXP Semiconductors

RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; No. of Functions: 1; Maximum Supply Current: 280 mA; Package Equivalence Code: SOT-115J;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,857 parts In-Stock

1+ parts

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5,857

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Anansix

USA . 1,803 parts In-Stock

1+ parts

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1,803

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Digiode

USA . 1,700 parts In-Stock

1+ parts

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1,700

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 344 parts In-Stock

1+ parts

$2.456

100+ parts

-

1k+ parts

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10k+ parts

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344

$2.456

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$2.712

100+ parts

$2.468

1k+ parts

$2.224

10k+ parts

-

200

$2.712

$2.468

$2.224

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Native Components

USA . 709 parts In-Stock

1+ parts

$5.130

100+ parts

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709

$5.130

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AZTECH Wire

Italy . 557 parts In-Stock

1+ parts

$11.290

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557

$11.290

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Microchip USA

USA . 327 parts In-Stock

1+ parts

$13.121

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327

$13.121

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One Stop Electronics

USA . 973 parts In-Stock

1+ parts

$39.000

100+ parts

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973

$39.000

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QUARKTWIN TECHNOLOGY LTD

USA . 25,674 parts In-Stock

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25,674

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UNI Independent Distributors

Spain . 6,932 parts In-Stock

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6,932

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Corphita

USA . 2,928 parts In-Stock

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2,928

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Northwest PG Solutions

USA . 572 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$5.027

10k+ parts

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572

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$5.027

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Technical Specifications

RF & Microwave Amplifiers CGY1043,112 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

No. of Functions:

1

Package Body Material:

Package Equivalence Code:

SOT-115J

Power Supplies (V):

24

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

280 mA

Technology:

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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