Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
Add filters
All
Selected
CGD1040HI,112
NXP Semiconductors
CGD1040HI,112 by NXP Semiconductors is a hybrid RF amplifier designed for high-performance applications. It operates at 24V with a max current of 460mA and withstands temperatures from -20 °C to 100 °C. Ideal for demanding RF and microwave tasks, it ensures reliability in various environments.
1
100 Cel
-20 Cel
PLASTIC/EPOXY
SOT-115J
24
RF/Microwave Amplifiers
460 mA
HYBRID
CGD1042HI,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; No. of Functions: 1; Maximum Supply Current: 460 mA; Package Equivalence Code: SOT-115J;
CGY888C,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; No. of Functions: 1; Package Equivalence Code: SOT-115J; Power Supplies (V): 24;
300 mA
CGD1046HI,112
CGD1046HI,112 by NXP Semiconductors is a hybrid RF amplifier designed for high-performance applications. It operates with a supply voltage of 24V and supports temperatures from -20 °C to 100 °C, drawing up to 465mA. Ideal for demanding RF systems, it ensures reliability in various environments.
465 mA
CGY1043,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; No. of Functions: 1; Maximum Supply Current: 280 mA; Package Equivalence Code: SOT-115J;
280 mA
CGY1041,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Package Equivalence Code: SOT-115J; Power Supplies (V): 24; Maximum Supply Current: 280 mA;
CGY1032,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; Maximum Supply Current: 280 mA; Package Equivalence Code: SOT-115J;
BGY588C,112
BGY588C,112 by NXP Semiconductors is a hybrid RF amplifier designed for high-performance applications. It operates at 24V with a max current of 345mA and withstands temperatures from -20 °C to 100 °C. Ideal for telecom and broadcasting systems, it ensures reliable signal amplification.
345 mA
BGE788C,112
BGE788C,112 by NXP Semiconductors is a hybrid RF amplifier designed for high-performance applications. It operates at 24V with a max current of 325mA and withstands temperatures from -20 °C to 100 °C. Ideal for telecommunications and broadcasting systems.
325 mA
BGX885N,112
BGX885N,112 by NXP Semiconductors is a hybrid RF amplifier designed for robust performance. It operates b/w -20 °C and 100 °C with a max supply current of 240 mA and requires a 24V power supply. Ideal for demanding microwave applications, it ensures reliability in various environments.
240 mA
CGD942C,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Package Equivalence Code: SOT-115J; No. of Functions: 1; Power Supplies (V): 24;
CGD944C,112
RF/Microwave Amplifiers; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; No. of Functions: 1; Package Equivalence Code: SOT-115J;
BGD502,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; Maximum Operating Frequency: 550 MHz; Package Equivalence Code: SOT-115J;
LOW NOISE
75 ohm
MODULE
18.8 dB
16.25 dBm
e4
550 MHz
40 MHz
WIDE BAND HIGH POWER
435 mA
Gold (Au)
BGD702N,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Package Equivalence Code: SOT-115J; Maximum Supply Current: 435 mA; Maximum Operating Temperature: 100 Cel;
LOW NOISE, HIGH RELIABILITY
18.5 dB
750 MHz
BGD704,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Minimum Operating Temperature: -20 Cel; Maximum Supply Current: 435 mA; Maximum Operating Temperature: 100 Cel;
20 dB
BGD714,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Maximum Supply Current: 410 mA; Gain: 20.8 dB; Maximum Operating Frequency: 750 MHz;
20.8 dB
410 mA
BGD802,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; Minimum Operating Temperature: -20 Cel; Maximum Operating Frequency: 860 MHz;
860 MHz
BGD804,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; JESD-609 Code: e4; Maximum Operating Frequency: 860 MHz; Characteristic Impedance: 75 ohm;
BGD812,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; Minimum Operating Frequency: 40 MHz; Maximum Operating Temperature: 100 Cel;
19 dB
870 MHz
BGD814,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Characteristic Impedance: 75 ohm; Minimum Operating Frequency: 40 MHz; Maximum Operating Temperature: 100 Cel;
20.5 dB
21.25 dBm
BGD816L,112
WIDE BAND HIGH POWER; Technology: HYBRID; Additional Features: LOW NOISE, HIGH RELIABILITY; Maximum Operating Frequency: 870 MHz; Package Equivalence Code: SOT-115J; Maximum Supply Current: 375 mA;
22 dB
375 mA
BGD885,112
WIDE BAND MEDIUM POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Gain: 16.5 dB; Additional Features: LOW NOISE, HIGH RELIABILITY; Package Equivalence Code: SOT-115D;
16.5 dB
SOT-115D
WIDE BAND MEDIUM POWER
450 mA
BGD902,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Minimum Operating Frequency: 40 MHz; Power Supplies (V): 24; Maximum Supply Current: 435 mA;
COMPONENT
18.2 dB
900 MHz
BGD904,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Package Equivalence Code: SOT-115J; Terminal Finish: Gold (Au); Maximum Input Power (CW): 21.25 dBm;
BGD906,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Terminal Finish: Gold (Au); JESD-609 Code: e4; Construction: MODULE;
BGE788,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Maximum Operating Frequency: 750 MHz; Power Supplies (V): 24; Minimum Operating Temperature: -20 Cel;
34 dB
320 mA
BGE885,112
WIDE BAND MEDIUM POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Minimum Operating Temperature: -20 Cel; Construction: MODULE; Minimum Operating Frequency: 40 MHz;
BGF802-20,127
NARROW BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Minimum Operating Frequency: 869 MHz; Construction: COMPONENT; Minimum Operating Temperature: -20 Cel;
50 ohm
28 dB
20 dBm
894 MHz
869 MHz
90 Cel
FLNG,1.6"H.SPACE
26
NARROW BAND HIGH POWER
2
BGR269,112
The NXP Semiconductors BGR269,112 is a wide band high power RF amplifier module with 35 dB gain. Operating from 5 MHz to 200 MHz, it requires a 24V power supply and draws a max current of 175 mA. Ideal for applications requiring high-power amplification in the RF and microwave domain.
35 dB
200 MHz
5 MHz
175 mA
BGY1085A,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Package Equivalence Code: SOT-115J; Maximum Supply Current: 240 mA; Maximum Operating Temperature: 100 Cel;
1000 MHz
BGY585A,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Maximum Operating Frequency: 550 MHz; Maximum Supply Current: 240 mA; Package Equivalence Code: SOT-115J;
BGY588N,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Maximum Operating Temperature: 100 Cel; Construction: MODULE; Maximum Operating Frequency: 550 MHz;
340 mA
BGY66B,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; Additional Features: LOW NOISE, HIGH RELIABILITY; Maximum Input Power (CW): 16.25 dBm;
24.5 dB
120 MHz
135 mA
BGY67A,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Maximum Input Power (CW): 16.25 dBm; Package Equivalence Code: SOT-115J; Additional Features: LOW NOISE;
23.5 dB
230 mA
BGY68,112
NARROW BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Construction: MODULE; Maximum Supply Current: 135 mA; Maximum Operating Frequency: 75 MHz;
29.2 dB
6.25 dBm
75 MHz
BGY785A,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Package Equivalence Code: SOT-115J; Characteristic Impedance: 75 ohm; Minimum Operating Temperature: -20 Cel;
BGY787,112
WIDE BAND MEDIUM POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Construction: MODULE; Package Equivalence Code: SOT-115J; Minimum Operating Temperature: -20 Cel;
21.5 dB
BGY883,112
WIDE BAND MEDIUM POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Construction: MODULE; Minimum Operating Temperature: -20 Cel; Power Supplies (V): 24;
15 dB
235 mA
BGY885A,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Minimum Operating Frequency: 40 MHz; Maximum Operating Temperature: 100 Cel; Maximum Supply Current: 240 mA;
BGY885B,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Maximum Supply Current: 235 mA; Characteristic Impedance: 75 ohm; Terminal Finish: Gold (Au);
BGY887,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; Maximum Supply Current: 235 mA; Package Equivalence Code: SOT-115J;
BGY887B,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Minimum Operating Frequency: 40 MHz; Characteristic Impedance: 75 ohm; Maximum Operating Frequency: 860 MHz;
29 dB
BGY888,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Characteristic Impedance: 75 ohm; Maximum Supply Current: 340 mA; Maximum Operating Frequency: 860 MHz;
CGD914,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; JESD-609 Code: e4; Package Equivalence Code: SOT-115J; Power Supplies (V): 24;
20.2 dB
19.75 dBm
CGD923,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Terminal Finish: GOLD; Minimum Operating Frequency: 40 MHz; Package Equivalence Code: SOT-115J;
19.5 dB
490 mA
GOLD
CGY887A,112
WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Maximum Supply Current: 240 mA; Gain: 25.7 dB; Additional Features: LOW NOISE, HIGH RELIABILITY;
25.7 dB
CGY887B,112
WIDE BAND HIGH POWER; Technology: HYBRID; Maximum Operating Temperature: 100 Cel; Construction: MODULE; No. of Functions: 1; Maximum Supply Current: 325 mA;
MMZ25332B4T1
NXP Semiconductors' MMZ25332B4T1 is a wide band medium power RF amplifier with 23.5 dB gain, operating from 1500 MHz to 2700 MHz. It has a max input power of 30 dBm and requires a 5V power supply, making it suitable for various RF and microwave applications. The component features a hybrid technology construction in a surface mount package with 24 terminals.
30 dBm
e3
SURFACE MOUNT
2700 MHz
1500 MHz
LCC24,.16SQ,20
5
415 mA
TIN
© 2023 All rights reserved
