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BGF802-20,127

NXP Semiconductors

BGF802-20,127 by NXP Semiconductors

NARROW BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Minimum Operating Frequency: 869 MHz; Construction: COMPONENT; Minimum Operating Temperature: -20 Cel;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,402 parts In-Stock

1+ parts

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2,402

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Digiode

USA . 1,978 parts In-Stock

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1,978

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Anansix

USA . 1,829 parts In-Stock

1+ parts

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1,829

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,528 parts In-Stock

1+ parts

$9.000

100+ parts

-

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1,528

$9.000

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AZTECH Wire

Italy . 1,127 parts In-Stock

1+ parts

$13.980

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1,127

$13.980

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Native Components

USA . 82 parts In-Stock

1+ parts

$18.270

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82

$18.270

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Northwest PG Solutions

USA . 2,328 parts In-Stock

1+ parts

$20.097

100+ parts

$18.087

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2,328

$20.097

$18.087

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Ampacity Inc.

Singapore . 534 parts In-Stock

1+ parts

$37.000

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534

$37.000

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Component Stockers USA

USA . 45 parts In-Stock

1+ parts

$1,208.250

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45

$1,208.250

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UNI Independent Distributors

Spain . 2,465 parts In-Stock

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Corphita

USA . 2,449 parts In-Stock

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2,449

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Technical Specifications

RF & Microwave Amplifiers BGF802-20,127 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Gain:

28 dB

Maximum Input Power (CW):

20 dBm

No. of Functions:

1

Maximum Operating Frequency:

894 MHz

Minimum Operating Frequency:

869 MHz

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

Package Equivalence Code:

FLNG,1.6"H.SPACE

Power Supplies (V):

26

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

320 mA

Technology:

Maximum Voltage Standing Wave Ratio:

2

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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