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BGY66B,112

NXP Semiconductors

BGY66B,112 by NXP Semiconductors

WIDE BAND HIGH POWER; Package Body Material: PLASTIC/EPOXY; Technology: HYBRID; Power Supplies (V): 24; Additional Features: LOW NOISE, HIGH RELIABILITY; Maximum Input Power (CW): 16.25 dBm;

Median Price

$18.800

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 373 parts In-Stock

1+ parts

-

100+ parts

$18.800

1k+ parts

-

10k+ parts

-

373

-

$18.800

-

-

Rochester

USA . 245 parts In-Stock

1+ parts

-

100+ parts

$16.240

1k+ parts

$14.530

10k+ parts

$13.670

245

-

$16.240

$14.530

$13.670

Verical

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$21.250

1k+ parts

$19.212

10k+ parts

-

150

-

$21.250

$19.212

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,078 parts In-Stock

1+ parts

$17.176

100+ parts

-

1k+ parts

-

10k+ parts

-

4,078

$17.176

-

-

-

Vyrian

USA . 7,905 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,905

-

-

-

-

Anansix

USA . 191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

191

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 788 parts In-Stock

1+ parts

$0.414

100+ parts

-

1k+ parts

-

10k+ parts

$0.397

788

$0.414

-

-

$0.397

Northwest PG Solutions

USA . 1,691 parts In-Stock

1+ parts

$0.455

100+ parts

-

1k+ parts

-

10k+ parts

$0.402

1,691

$0.455

-

-

$0.402

Corohmni

South Africa . 140 parts In-Stock

1+ parts

$1.587

100+ parts

-

1k+ parts

-

10k+ parts

-

140

$1.587

-

-

-

Advanced Electronics

New Zealand . 1,384 parts In-Stock

1+ parts

$3.349

100+ parts

$3.048

1k+ parts

$2.746

10k+ parts

-

1,384

$3.349

$3.048

$2.746

-

Corphita

USA . 1,973 parts In-Stock

1+ parts

$16.272

100+ parts

-

1k+ parts

-

10k+ parts

-

1,973

$16.272

-

-

-

Microchip USA

USA . 385 parts In-Stock

1+ parts

$18.937

100+ parts

-

1k+ parts

-

10k+ parts

-

385

$18.937

-

-

-

UNI Independent Distributors

Spain . 1,895 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,895

-

-

-

-

Technical Specifications

RF & Microwave Amplifiers BGY66B,112 attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE, HIGH RELIABILITY

Characteristic Impedance:

75 ohm

Construction:

MODULE

Gain:

24.5 dB

Maximum Input Power (CW):

16.25 dBm

Maximum Operating Frequency:

120 MHz

Minimum Operating Frequency:

5 MHz

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

Package Equivalence Code:

SOT-115J

Power Supplies (V):

24

RF or Microwave Device Type:

Sub-Category:

RF/Microwave Amplifiers

Maximum Supply Current:

135 mA

Technology:

Trade Compliance

BGY66B,112 RF & Microwave trade compliance attributes, and parameters.

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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