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BGY67BO

NXP Semiconductors

BGY67BO by NXP Semiconductors

WIDE BAND LOW POWER; Maximum Operating Frequency: 300 MHz; Minimum Operating Temperature: -20 Cel; Maximum Input Power (CW): 7 dBm; Additional Features: LOW NOISE, HIGH RELIABILITY; Characteristic Impedance: 75 ohm;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,572 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,572

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Anansix

USA . 2,639 parts In-Stock

1+ parts

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2,639

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Vyrian

USA . 60 parts In-Stock

1+ parts

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60

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Q Components

USA . 1 parts In-Stock

1+ parts

-

100+ parts

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1

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 997 parts In-Stock

1+ parts

$0.516

100+ parts

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1k+ parts

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10k+ parts

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997

$0.516

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Northwest PG Solutions

USA . 371 parts In-Stock

1+ parts

$0.567

100+ parts

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371

$0.567

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One Stop Electronics

USA . 836 parts In-Stock

1+ parts

$37.000

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836

$37.000

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Corphita

USA . 4,815 parts In-Stock

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4,815

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UNI Independent Distributors

Spain . 3,500 parts In-Stock

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3,500

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Technical Specifications

RF & Microwave Amplifiers BGY67BO attributes and parameters. Explore more RF & Microwave Amplifiers devices from NXP Semiconductors

Specs

Additional Features:

LOW NOISE, HIGH RELIABILITY

Characteristic Impedance:

75 ohm

Construction:

MODULE

Maximum Input Power (CW):

7 dBm

Maximum Operating Frequency:

300 MHz

Minimum Operating Frequency:

5 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

RF or Microwave Device Type:

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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